Master Bond, Inc.

New EP21ND-LP Epoxy Adhesive Provides Tensile Strength Between 6,000 and 7,000 psi
Adhesives & Sealants

New EP21ND-LP Epoxy Adhesive Provides Tensile Strength Between 6,000 and 7,000 psi

Master bond’s EP21ND-LP Epoxy Adhesive is formulated for structural bonding applications and features working life of 2-4 hrs at 75°F for a 100 gram mass. Capable to withstand thermal cycling, product exhibits a coefficient of thermal expansion of 50-55 x 10^-6/in/in/°C and electrical insulation with volume resistivity of greater than 10^14 ohm-cm. The adhesive is suitable for use in...

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New EP30LTE-2 Epoxy Offers a Compressive Strength of 24,000-26,000 psi
Adhesives & Sealants

New EP30LTE-2 Epoxy Offers a Compressive Strength of 24,000-26,000 psi

Master Bond’s EP30LTE-2 Epoxy is offered in ½ pint, pint, quart, gallon and 5 gallon kits in premixed and frozen syringes. The epoxy is used for joining dissimilar substrates that are exposed to thermally and mechanically induced stresses. Product features a low CTE at 10-13 x 10^-6/in/in/°C and a volume resistivity of more than 10^15 ohm-cm for use in electrical insulator. EP30LTE-2 features...

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New Supreme 62-1 Epoxy is Suitable for Structural Bonding of Dissimilar Substrates
Adhesives & Sealants

New Supreme 62-1 Epoxy is Suitable for Structural Bonding of Dissimilar Substrates

Supreme 62-1 Epoxy offers a tensile strength of 8,000-9,000 psi and a tensile modulus of 450,000-500,000 psi. The epoxy is used in -60°F to +450°F temperature range and is resistant to acids, bases, fuels and solvents. Exhibiting a volume resistivity of 10^14 ohm-cm and Shore D hardness of 75-85, the product is offered in ½ pint, pint, quart, gallon and 5 gallon kits. Supreme 62-1 can be used...

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One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability
Adhesives & Sealants

One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability

Silver filled epoxy adhesive system Master Bond EP3HTSDA-2 was developed for crucial thermal management applications. As a one component system, it is not premixed and frozen and has an “unlimited” working life at room temperature. This compound possesses a high thermal conductivity of 45-49 BTU•in/ft2•hr•°F [6.5-7.0 W/(m•K)]. It can be applied in ultra thin bond lines and contains...

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Nanosilica Filled Epoxy with High Abrasion Resistance Meets NASA Low Outgassing Specifications
Adhesives & Sealants

Nanosilica Filled Epoxy with High Abrasion Resistance Meets NASA Low Outgassing Specifications

Master Bond EP30NS is a two component epoxy system that cures at room temperature or more rapidly at elevated temperatures. It is optically clear especially in thin sections and can be used as an adhesive, sealant, coating and encapsulation compound. EP30NS offers dimensional stability, linear shrinkage of less than 0.01%, excellent physical strength characteristics and cures rigid. Most...

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6 Master Bond Epoxy Adhesives Tested and Approved for MIL-STD-883J for Thermal Stability
Adhesives & Sealants

6 Master Bond Epoxy Adhesives Tested and Approved for MIL-STD-883J for Thermal Stability

Master Bond is pleased to announce that the following epoxy compounds, EP17HTDA-1, EP21TDCHT, EP33, EP46HT-1AO, Supreme 11AOHT and Supreme 12AOHT-LO have passed MIL-STD-883J section 3.5.2., the subsection of the United States Military Standards set by the U.S. Department of Defense that refers to the thermal stability of a material. This test indicates a consistent product performance for...

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Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion
Adhesives & Sealants

Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion

Master Bond EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate size encapsulating, potting and casting applications. It is also effective in bonding fragile components requiring a low coefficient of thermal expansion. EP42HT-3AO is designed to optimize heat dissipation properties, improve the quality and reliability of...

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Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile
Adhesives & Sealants

Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile

Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. This thixotropic, moderately low viscosity compound has a viscosity of 8,000-12,000 cps at 75°F (~23°C). It provides outstanding dimensional stability and superior physical strength properties. Additionally, UV22DC80-10F is optically clear and offers the ability to be cured in...

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Slideshow Offers More of 2017's New Adhesive Systems
Adhesives & Sealants

Slideshow Offers More of 2017's New Adhesive Systems

Tis the season to look back on some of the most advanced products released over the year. These adhesive systems offer exceptional mechanical, electrical and thermal properties. Here’s a closer look at 2017’s outstanding products. Read More: http://click.skem1.com/click/ldb4u-d0gvz8-13mg5467/ X21Med: One Component Primer/Adhesive for Polyolefins Featuring a very low viscosity, X21Med offers...

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Heat Curable Corrosion Resistant Epoxy System Withstands Temperatures up to 500°F
Adhesives & Sealants

Heat Curable Corrosion Resistant Epoxy System Withstands Temperatures up to 500°F

Master Bond Supreme 34CA is a high strength structural epoxy adhesive featuring superior resistance to aggressive chemicals such as acids, bases, solvents and oils. Serviceable from -80°F to +500°F this solvent free formulation has a working life of more than 24 hours per 100 gram batch at room temperature. It has good flow properties, a mixed viscosity of 7,000-20,000 cps, a mix ratio of 100...

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New EP21ND-LP Epoxy Adhesive Provides Tensile Strength Between 6,000 and 7,000 psi
Adhesives & Sealants

New EP21ND-LP Epoxy Adhesive Provides Tensile Strength Between 6,000 and 7,000 psi

Master bond’s EP21ND-LP Epoxy Adhesive is formulated for structural bonding applications and features working life of 2-4 hrs at 75°F for a 100 gram mass. Capable to withstand thermal cycling, product exhibits a coefficient of thermal expansion of 50-55 x 10^-6/in/in/°C and electrical insulation with volume resistivity of greater than 10^14 ohm-cm. The adhesive is suitable for use in...

Read More »
New EP30LTE-2 Epoxy Offers a Compressive Strength of 24,000-26,000 psi
Adhesives & Sealants

New EP30LTE-2 Epoxy Offers a Compressive Strength of 24,000-26,000 psi

Master Bond’s EP30LTE-2 Epoxy is offered in ½ pint, pint, quart, gallon and 5 gallon kits in premixed and frozen syringes. The epoxy is used for joining dissimilar substrates that are exposed to thermally and mechanically induced stresses. Product features a low CTE at 10-13 x 10^-6/in/in/°C and a volume resistivity of more than 10^15 ohm-cm for use in electrical insulator. EP30LTE-2 features...

Read More »
New Supreme 62-1 Epoxy is Suitable for Structural Bonding of Dissimilar Substrates
Adhesives & Sealants

New Supreme 62-1 Epoxy is Suitable for Structural Bonding of Dissimilar Substrates

Supreme 62-1 Epoxy offers a tensile strength of 8,000-9,000 psi and a tensile modulus of 450,000-500,000 psi. The epoxy is used in -60°F to +450°F temperature range and is resistant to acids, bases, fuels and solvents. Exhibiting a volume resistivity of 10^14 ohm-cm and Shore D hardness of 75-85, the product is offered in ½ pint, pint, quart, gallon and 5 gallon kits. Supreme 62-1 can be used...

Read More »
One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability
Adhesives & Sealants

One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability

Silver filled epoxy adhesive system Master Bond EP3HTSDA-2 was developed for crucial thermal management applications. As a one component system, it is not premixed and frozen and has an “unlimited” working life at room temperature. This compound possesses a high thermal conductivity of 45-49 BTU•in/ft2•hr•°F [6.5-7.0 W/(m•K)]. It can be applied in ultra thin bond lines and contains...

Read More »
Nanosilica Filled Epoxy with High Abrasion Resistance Meets NASA Low Outgassing Specifications
Adhesives & Sealants

Nanosilica Filled Epoxy with High Abrasion Resistance Meets NASA Low Outgassing Specifications

Master Bond EP30NS is a two component epoxy system that cures at room temperature or more rapidly at elevated temperatures. It is optically clear especially in thin sections and can be used as an adhesive, sealant, coating and encapsulation compound. EP30NS offers dimensional stability, linear shrinkage of less than 0.01%, excellent physical strength characteristics and cures rigid. Most...

Read More »
6 Master Bond Epoxy Adhesives Tested and Approved for MIL-STD-883J for Thermal Stability
Adhesives & Sealants

6 Master Bond Epoxy Adhesives Tested and Approved for MIL-STD-883J for Thermal Stability

Master Bond is pleased to announce that the following epoxy compounds, EP17HTDA-1, EP21TDCHT, EP33, EP46HT-1AO, Supreme 11AOHT and Supreme 12AOHT-LO have passed MIL-STD-883J section 3.5.2., the subsection of the United States Military Standards set by the U.S. Department of Defense that refers to the thermal stability of a material. This test indicates a consistent product performance for...

Read More »
Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion
Adhesives & Sealants

Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion

Master Bond EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate size encapsulating, potting and casting applications. It is also effective in bonding fragile components requiring a low coefficient of thermal expansion. EP42HT-3AO is designed to optimize heat dissipation properties, improve the quality and reliability of...

Read More »
Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile
Adhesives & Sealants

Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile

Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. This thixotropic, moderately low viscosity compound has a viscosity of 8,000-12,000 cps at 75°F (~23°C). It provides outstanding dimensional stability and superior physical strength properties. Additionally, UV22DC80-10F is optically clear and offers the ability to be cured in...

Read More »
Slideshow Offers More of 2017's New Adhesive Systems
Adhesives & Sealants

Slideshow Offers More of 2017's New Adhesive Systems

Tis the season to look back on some of the most advanced products released over the year. These adhesive systems offer exceptional mechanical, electrical and thermal properties. Here’s a closer look at 2017’s outstanding products. Read More: http://click.skem1.com/click/ldb4u-d0gvz8-13mg5467/ X21Med: One Component Primer/Adhesive for Polyolefins Featuring a very low viscosity, X21Med offers...

Read More »
Heat Curable Corrosion Resistant Epoxy System Withstands Temperatures up to 500°F
Adhesives & Sealants

Heat Curable Corrosion Resistant Epoxy System Withstands Temperatures up to 500°F

Master Bond Supreme 34CA is a high strength structural epoxy adhesive featuring superior resistance to aggressive chemicals such as acids, bases, solvents and oils. Serviceable from -80°F to +500°F this solvent free formulation has a working life of more than 24 hours per 100 gram batch at room temperature. It has good flow properties, a mixed viscosity of 7,000-20,000 cps, a mix ratio of 100...

Read More »

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