Master Bond, Inc.

Nanosilica Filled Epoxy with High Abrasion Resistance Meets NASA Low Outgassing Specifications
Adhesives & Sealants

Nanosilica Filled Epoxy with High Abrasion Resistance Meets NASA Low Outgassing Specifications

Master Bond EP30NS is a two component epoxy system that cures at room temperature or more rapidly at elevated temperatures. It is optically clear especially in thin sections and can be used as an adhesive, sealant, coating and encapsulation compound. EP30NS offers dimensional stability, linear shrinkage of less than 0.01%, excellent physical strength characteristics and cures rigid. Most...

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6 Master Bond Epoxy Adhesives Tested and Approved for MIL-STD-883J for Thermal Stability
Adhesives & Sealants

6 Master Bond Epoxy Adhesives Tested and Approved for MIL-STD-883J for Thermal Stability

Master Bond is pleased to announce that the following epoxy compounds, EP17HTDA-1, EP21TDCHT, EP33, EP46HT-1AO, Supreme 11AOHT and Supreme 12AOHT-LO have passed MIL-STD-883J section 3.5.2., the subsection of the United States Military Standards set by the U.S. Department of Defense that refers to the thermal stability of a material. This test indicates a consistent product performance for...

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Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion
Adhesives & Sealants

Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion

Master Bond EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate size encapsulating, potting and casting applications. It is also effective in bonding fragile components requiring a low coefficient of thermal expansion. EP42HT-3AO is designed to optimize heat dissipation properties, improve the quality and reliability of...

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Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile
Adhesives & Sealants

Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile

Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. This thixotropic, moderately low viscosity compound has a viscosity of 8,000-12,000 cps at 75°F (~23°C). It provides outstanding dimensional stability and superior physical strength properties. Additionally, UV22DC80-10F is optically clear and offers the ability to be cured in...

Read More »
Slideshow Offers More of 2017
Adhesives & Sealants

Slideshow Offers More of 2017

Tis the season to look back on some of the most advanced products released over the year. These adhesive systems offer exceptional mechanical, electrical and thermal properties. Here’s a closer look at 2017’s outstanding products. Read More: http://click.skem1.com/click/ldb4u-d0gvz8-13mg5467/ X21Med: One Component Primer/Adhesive for Polyolefins Featuring a very low viscosity, X21Med offers...

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Heat Curable Corrosion Resistant Epoxy System Withstands Temperatures up to 500
Adhesives & Sealants

Heat Curable Corrosion Resistant Epoxy System Withstands Temperatures up to 500

Master Bond Supreme 34CA is a high strength structural epoxy adhesive featuring superior resistance to aggressive chemicals such as acids, bases, solvents and oils. Serviceable from -80°F to +500°F this solvent free formulation has a working life of more than 24 hours per 100 gram batch at room temperature. It has good flow properties, a mixed viscosity of 7,000-20,000 cps, a mix ratio of 100...

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One Part Epoxy has Low CTE
Adhesives & Sealants

One Part Epoxy has Low CTE

Adhesive EP13LTE Passes NASA Low Outgassing Well suited for structural bonding applications, EP13LTE offers excellent adhesion to dissimilar substrates and has a stellar physical strength profile. This NASA low outgassing approved system is easy to use, doesn’t require mixing, and has an unlimited working life at room temperature. It also features high temperature resistance, dimensional...

Read More »
Adhesives for Your Specific Needs
Adhesives & Sealants

Adhesives for Your Specific Needs

EP45HTAN: Thermally Conductive, Electrically Insulative Epoxy Well suited for metal bonding especially roughened titanium, EP45HTAN is a two part epoxy paste with superior strength retention at elevated temperatures. It bonds well to a wide variety of similar/dissimilar substrates, such as multiple metals, glass, composites and many plastics. This system combines cryogenic serviceability with...

Read More »
Master Bond EP3HTSDA-1 for Die Attach Applications
Adhesives & Sealants

Master Bond EP3HTSDA-1 for Die Attach Applications

Premier die attach epoxy EP3HTSDA-1 features a very impressive thermal conductivity of 40-45 BTU•in/(ft²•hr•°F), substantially higher than other silver conductive epoxies. This video demonstrates how Master Bond EP3HTSDA-1 is dispensed and applied to a defined area without any tailing. Watch Video on EP3HTSDA-1: http://click.skem1.com/click/koc3k-cbupji-13mg5467/ Updated Electronic...

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Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity
Adhesives & Sealants

Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity

Master Bond EP3HTSDA-1 is a single part, no mix epoxy adhesive designed primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity of over 40-45 BTU•in/ft2•hr•°F [5.7-6.5 W/(m•K)]. “This 100% solids formulation has an ideal viscosity and flow for die attach, will not ‘tail’ and can be easily dispensed automatically”...

Read More »
Nanosilica Filled Epoxy with High Abrasion Resistance Meets NASA Low Outgassing Specifications
Adhesives & Sealants

Nanosilica Filled Epoxy with High Abrasion Resistance Meets NASA Low Outgassing Specifications

Master Bond EP30NS is a two component epoxy system that cures at room temperature or more rapidly at elevated temperatures. It is optically clear especially in thin sections and can be used as an adhesive, sealant, coating and encapsulation compound. EP30NS offers dimensional stability, linear shrinkage of less than 0.01%, excellent physical strength characteristics and cures rigid. Most...

Read More »
6 Master Bond Epoxy Adhesives Tested and Approved for MIL-STD-883J for Thermal Stability
Adhesives & Sealants

6 Master Bond Epoxy Adhesives Tested and Approved for MIL-STD-883J for Thermal Stability

Master Bond is pleased to announce that the following epoxy compounds, EP17HTDA-1, EP21TDCHT, EP33, EP46HT-1AO, Supreme 11AOHT and Supreme 12AOHT-LO have passed MIL-STD-883J section 3.5.2., the subsection of the United States Military Standards set by the U.S. Department of Defense that refers to the thermal stability of a material. This test indicates a consistent product performance for...

Read More »
Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion
Adhesives & Sealants

Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion

Master Bond EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate size encapsulating, potting and casting applications. It is also effective in bonding fragile components requiring a low coefficient of thermal expansion. EP42HT-3AO is designed to optimize heat dissipation properties, improve the quality and reliability of...

Read More »
Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile
Adhesives & Sealants

Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile

Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. This thixotropic, moderately low viscosity compound has a viscosity of 8,000-12,000 cps at 75°F (~23°C). It provides outstanding dimensional stability and superior physical strength properties. Additionally, UV22DC80-10F is optically clear and offers the ability to be cured in...

Read More »
Slideshow Offers More of 2017
Adhesives & Sealants

Slideshow Offers More of 2017

Tis the season to look back on some of the most advanced products released over the year. These adhesive systems offer exceptional mechanical, electrical and thermal properties. Here’s a closer look at 2017’s outstanding products. Read More: http://click.skem1.com/click/ldb4u-d0gvz8-13mg5467/ X21Med: One Component Primer/Adhesive for Polyolefins Featuring a very low viscosity, X21Med offers...

Read More »
Heat Curable Corrosion Resistant Epoxy System Withstands Temperatures up to 500
Adhesives & Sealants

Heat Curable Corrosion Resistant Epoxy System Withstands Temperatures up to 500

Master Bond Supreme 34CA is a high strength structural epoxy adhesive featuring superior resistance to aggressive chemicals such as acids, bases, solvents and oils. Serviceable from -80°F to +500°F this solvent free formulation has a working life of more than 24 hours per 100 gram batch at room temperature. It has good flow properties, a mixed viscosity of 7,000-20,000 cps, a mix ratio of 100...

Read More »
One Part Epoxy has Low CTE
Adhesives & Sealants

One Part Epoxy has Low CTE

Adhesive EP13LTE Passes NASA Low Outgassing Well suited for structural bonding applications, EP13LTE offers excellent adhesion to dissimilar substrates and has a stellar physical strength profile. This NASA low outgassing approved system is easy to use, doesn’t require mixing, and has an unlimited working life at room temperature. It also features high temperature resistance, dimensional...

Read More »
Adhesives for Your Specific Needs
Adhesives & Sealants

Adhesives for Your Specific Needs

EP45HTAN: Thermally Conductive, Electrically Insulative Epoxy Well suited for metal bonding especially roughened titanium, EP45HTAN is a two part epoxy paste with superior strength retention at elevated temperatures. It bonds well to a wide variety of similar/dissimilar substrates, such as multiple metals, glass, composites and many plastics. This system combines cryogenic serviceability with...

Read More »
Master Bond EP3HTSDA-1 for Die Attach Applications
Adhesives & Sealants

Master Bond EP3HTSDA-1 for Die Attach Applications

Premier die attach epoxy EP3HTSDA-1 features a very impressive thermal conductivity of 40-45 BTU•in/(ft²•hr•°F), substantially higher than other silver conductive epoxies. This video demonstrates how Master Bond EP3HTSDA-1 is dispensed and applied to a defined area without any tailing. Watch Video on EP3HTSDA-1: http://click.skem1.com/click/koc3k-cbupji-13mg5467/ Updated Electronic...

Read More »
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity
Adhesives & Sealants

Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity

Master Bond EP3HTSDA-1 is a single part, no mix epoxy adhesive designed primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity of over 40-45 BTU•in/ft2•hr•°F [5.7-6.5 W/(m•K)]. “This 100% solids formulation has an ideal viscosity and flow for die attach, will not ‘tail’ and can be easily dispensed automatically”...

Read More »

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