Master Bond, Inc.

Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test
Adhesives & Sealants

Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test

Master Bond EP93AOFR is a two part epoxy that may be used in encapsulation and potting applications, as well as in bonding, sealing and coating. According to Rohit Ramnath, Senior Product Engineer, "This flame retardant non-halogenated system is not only thermally conductive, 9-10 BTU•in/ft²•hr•°F [1.30-1.44 W/(m•K)], but it is also a reliable electrical insulator with a volume...

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New LED405Med LED Curable Adhesive Meets ISO 10993-5 Cytotoxicity Standards
Adhesives & Sealants

New LED405Med LED Curable Adhesive Meets ISO 10993-5 Cytotoxicity Standards

The LED405Med LED Curable Adhesive exhibits a thermal expansion of 35-40 in/in x 10^-6/°C and cures to a hardness of 65-75 Shore D. The product features a refractive index of 1.50, volume resistivity of more than 10^14 ohm-cm and dielectric constant of 4.2 at 60 Hz. The adhesive is used in -60°F to +250°F temperature range and cures upon exposure to a 405 nm wavelength light source. It is used...

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Master Bond Launches EP3UF-1 Underfill Epoxy with Dielectric Constant of 4.5
Adhesives & Sealants

Master Bond Launches EP3UF-1 Underfill Epoxy with Dielectric Constant of 4.5

The EP3UF-1 Thermally Conductive Underfill Epoxy is offered in 10 cc syringes and 30 cc syringes. The product features viscosity of 5,000-15,000 cps, compressive strength of 18,000-20,000 psi and tensile modulus of 450,000-500,000 psi. The compound exhibits thermal conductivity and resistance of 1.30-1.44 W/(m•K) and 5-7 x 10-6 K•m²/W respectively. The epoxy cures in 20-30 minutes at 250°F,...

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Master Bond Offers MasterSil 980 Fluorosilicone with a Dielectric Constant of 6.4
Adhesives & Sealants

Master Bond Offers MasterSil 980 Fluorosilicone with a Dielectric Constant of 6.4

The MasterSil 980 Two Part Fluorosilicone is suitable for high performance bonding, sealing, coating and potting applications. The product features an elongation of 100-200% at 75°F and provides an operating temperature of -85°F to +465°F. The adhesive bonds with metals, composites, ceramics, glass, rubbers, plastics and silicones and has a volume resistivity of more than 10^14 ohm-cm. It can...

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New EP17HTND-CCM Epoxy Exhibits a Thermal Conductivity of 1.4423 W/(m.K) at 75 Degrees F
Adhesives & Sealants

New EP17HTND-CCM Epoxy Exhibits a Thermal Conductivity of 1.4423 W/(m.K) at 75 Degrees F

Master Bond’s EP17HTND-CCM Single Component Epoxy features a resistivity of more than 10^15 ohm-cm at 75°F and over 10^12 ohm-cm at 400°F. The compound can be used in -80°F to +600°F temperature and forms high strength bonds to substrates such as metals, ceramics, plastics, composites and circuit board materials. The material is offered in syringes with sizes ranging from 10 cc to 30 cc and...

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New UV26 UV Curable Adhesive Features a Refractive Index of 1.55 at Room Temperature
Adhesives & Sealants

New UV26 UV Curable Adhesive Features a Refractive Index of 1.55 at Room Temperature

The Master Bond’s UV26 UV Curable Adhesive has a glass transition temperature (Tg) ranging from 160 to 170°C. The compound is suitable for use on substrates such as glass, surface treated metals and plastics. The product can cure compounds of viscosity ranging from 250-1,500 cps when exposed to UV light source at a wavelength of 320-365 nm. It can withstand chemicals such as acids, bases,...

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New EP42S-6 Epoxy from Master Bond Is Suitable for Potential Explosive Environments
Adhesives & Sealants

New EP42S-6 Epoxy from Master Bond Is Suitable for Potential Explosive Environments

Master Bond’s new EP42S-6 is UL 1203 certified for explosion proof and dust ignition proof electrical equipment. The epoxy can be used in Class I Division 1 Groups A, B, C, and D, as well as Class II Division 1 Groups E, F, and G. The two component epoxy is serviceable from -80 to 500 degrees F, and has dielectric strength of 440 volts/mil at 75 degrees F for .125 inch thickness. The epoxy also...

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New EP70CN Epoxy Adhesive Exhibits a Tensile Strength of 11,000 to 12,000 psi
Adhesives & Sealants

New EP70CN Epoxy Adhesive Exhibits a Tensile Strength of 11,000 to 12,000 psi

Master Bond’s EP70CN Epoxy Adhesive is available in 1/2 pint, pint, quart and gallon kits and is used for bonding, sealing, coating and potting applications. The product offers a tensile modulus of 300,000 to 350,000 psi and features a glass temperature transition temperature of 130 to 135°C and viscosity of 2,500 to 5,000 cps. The adhesive bonds to substrates such as metals, ceramics and...

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New EP21ND-LP Epoxy Adhesive Provides Tensile Strength Between 6,000 and 7,000 psi
Adhesives & Sealants

New EP21ND-LP Epoxy Adhesive Provides Tensile Strength Between 6,000 and 7,000 psi

Master bond’s EP21ND-LP Epoxy Adhesive is formulated for structural bonding applications and features working life of 2-4 hrs at 75°F for a 100 gram mass. Capable to withstand thermal cycling, product exhibits a coefficient of thermal expansion of 50-55 x 10^-6/in/in/°C and electrical insulation with volume resistivity of greater than 10^14 ohm-cm. The adhesive is suitable for use in...

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New EP30LTE-2 Epoxy Offers a Compressive Strength of 24,000-26,000 psi
Adhesives & Sealants

New EP30LTE-2 Epoxy Offers a Compressive Strength of 24,000-26,000 psi

Master Bond’s EP30LTE-2 Epoxy is offered in ½ pint, pint, quart, gallon and 5 gallon kits in premixed and frozen syringes. The epoxy is used for joining dissimilar substrates that are exposed to thermally and mechanically induced stresses. Product features a low CTE at 10-13 x 10^-6/in/in/°C and a volume resistivity of more than 10^15 ohm-cm for use in electrical insulator. EP30LTE-2 features...

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Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test
Adhesives & Sealants

Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test

Master Bond EP93AOFR is a two part epoxy that may be used in encapsulation and potting applications, as well as in bonding, sealing and coating. According to Rohit Ramnath, Senior Product Engineer, "This flame retardant non-halogenated system is not only thermally conductive, 9-10 BTU•in/ft²•hr•°F [1.30-1.44 W/(m•K)], but it is also a reliable electrical insulator with a volume...

Read More »
New LED405Med LED Curable Adhesive Meets ISO 10993-5 Cytotoxicity Standards
Adhesives & Sealants

New LED405Med LED Curable Adhesive Meets ISO 10993-5 Cytotoxicity Standards

The LED405Med LED Curable Adhesive exhibits a thermal expansion of 35-40 in/in x 10^-6/°C and cures to a hardness of 65-75 Shore D. The product features a refractive index of 1.50, volume resistivity of more than 10^14 ohm-cm and dielectric constant of 4.2 at 60 Hz. The adhesive is used in -60°F to +250°F temperature range and cures upon exposure to a 405 nm wavelength light source. It is used...

Read More »
Master Bond Launches EP3UF-1 Underfill Epoxy with Dielectric Constant of 4.5
Adhesives & Sealants

Master Bond Launches EP3UF-1 Underfill Epoxy with Dielectric Constant of 4.5

The EP3UF-1 Thermally Conductive Underfill Epoxy is offered in 10 cc syringes and 30 cc syringes. The product features viscosity of 5,000-15,000 cps, compressive strength of 18,000-20,000 psi and tensile modulus of 450,000-500,000 psi. The compound exhibits thermal conductivity and resistance of 1.30-1.44 W/(m•K) and 5-7 x 10-6 K•m²/W respectively. The epoxy cures in 20-30 minutes at 250°F,...

Read More »
Master Bond Offers MasterSil 980 Fluorosilicone with a Dielectric Constant of 6.4
Adhesives & Sealants

Master Bond Offers MasterSil 980 Fluorosilicone with a Dielectric Constant of 6.4

The MasterSil 980 Two Part Fluorosilicone is suitable for high performance bonding, sealing, coating and potting applications. The product features an elongation of 100-200% at 75°F and provides an operating temperature of -85°F to +465°F. The adhesive bonds with metals, composites, ceramics, glass, rubbers, plastics and silicones and has a volume resistivity of more than 10^14 ohm-cm. It can...

Read More »
New EP17HTND-CCM Epoxy Exhibits a Thermal Conductivity of 1.4423 W/(m.K) at 75 Degrees F
Adhesives & Sealants

New EP17HTND-CCM Epoxy Exhibits a Thermal Conductivity of 1.4423 W/(m.K) at 75 Degrees F

Master Bond’s EP17HTND-CCM Single Component Epoxy features a resistivity of more than 10^15 ohm-cm at 75°F and over 10^12 ohm-cm at 400°F. The compound can be used in -80°F to +600°F temperature and forms high strength bonds to substrates such as metals, ceramics, plastics, composites and circuit board materials. The material is offered in syringes with sizes ranging from 10 cc to 30 cc and...

Read More »
New UV26 UV Curable Adhesive Features a Refractive Index of 1.55 at Room Temperature
Adhesives & Sealants

New UV26 UV Curable Adhesive Features a Refractive Index of 1.55 at Room Temperature

The Master Bond’s UV26 UV Curable Adhesive has a glass transition temperature (Tg) ranging from 160 to 170°C. The compound is suitable for use on substrates such as glass, surface treated metals and plastics. The product can cure compounds of viscosity ranging from 250-1,500 cps when exposed to UV light source at a wavelength of 320-365 nm. It can withstand chemicals such as acids, bases,...

Read More »
New EP42S-6 Epoxy from Master Bond Is Suitable for Potential Explosive Environments
Adhesives & Sealants

New EP42S-6 Epoxy from Master Bond Is Suitable for Potential Explosive Environments

Master Bond’s new EP42S-6 is UL 1203 certified for explosion proof and dust ignition proof electrical equipment. The epoxy can be used in Class I Division 1 Groups A, B, C, and D, as well as Class II Division 1 Groups E, F, and G. The two component epoxy is serviceable from -80 to 500 degrees F, and has dielectric strength of 440 volts/mil at 75 degrees F for .125 inch thickness. The epoxy also...

Read More »
New EP70CN Epoxy Adhesive Exhibits a Tensile Strength of 11,000 to 12,000 psi
Adhesives & Sealants

New EP70CN Epoxy Adhesive Exhibits a Tensile Strength of 11,000 to 12,000 psi

Master Bond’s EP70CN Epoxy Adhesive is available in 1/2 pint, pint, quart and gallon kits and is used for bonding, sealing, coating and potting applications. The product offers a tensile modulus of 300,000 to 350,000 psi and features a glass temperature transition temperature of 130 to 135°C and viscosity of 2,500 to 5,000 cps. The adhesive bonds to substrates such as metals, ceramics and...

Read More »
New EP21ND-LP Epoxy Adhesive Provides Tensile Strength Between 6,000 and 7,000 psi
Adhesives & Sealants

New EP21ND-LP Epoxy Adhesive Provides Tensile Strength Between 6,000 and 7,000 psi

Master bond’s EP21ND-LP Epoxy Adhesive is formulated for structural bonding applications and features working life of 2-4 hrs at 75°F for a 100 gram mass. Capable to withstand thermal cycling, product exhibits a coefficient of thermal expansion of 50-55 x 10^-6/in/in/°C and electrical insulation with volume resistivity of greater than 10^14 ohm-cm. The adhesive is suitable for use in...

Read More »
New EP30LTE-2 Epoxy Offers a Compressive Strength of 24,000-26,000 psi
Adhesives & Sealants

New EP30LTE-2 Epoxy Offers a Compressive Strength of 24,000-26,000 psi

Master Bond’s EP30LTE-2 Epoxy is offered in ½ pint, pint, quart, gallon and 5 gallon kits in premixed and frozen syringes. The epoxy is used for joining dissimilar substrates that are exposed to thermally and mechanically induced stresses. Product features a low CTE at 10-13 x 10^-6/in/in/°C and a volume resistivity of more than 10^15 ohm-cm for use in electrical insulator. EP30LTE-2 features...

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