Master Bond, Inc.
Hackensack, NJ 07601-3950
Dual Curable Adhesive Offers Rapid Fixturing with LED Light
Master Bond LED415DC90 is a one component adhesive system that cures rapidly upon exposure to a 405 nm wavelength LED light source without any oxygen inhibition. The rate of cure depends upon the intensity of the light source, the thickness of the adhesive layer and the distance from the light to the adhesive. This no-mix system requires a post cure with heat and adheres well to both similar and...
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Non-Cytotoxic Epoxy Withstands Multiple Methods of Medical Sterilization
Master Bond EP41S-5Med is a two part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical devices. It features high temperature resistance and good strength properties. As an electrically insulative material, it can be utilized in medical electronic applications. This epoxy was tested against many sterilization...
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Electrically Insulative, Toughened Epoxy Meets NASA Low Outgassing Specifications
Master Bond Supreme 42HT-2ND Black is a two-part, non-drip epoxy system designed for bonding, sealing and coating applications. It is capable of withstanding temperatures up to 450°F (232°C), and provides a glass transition temperature (Tg) of 130-135°C. The material meets NASA low outgassing standards and is recommended for applications that require vacuum compatibility. Supreme 42HT-2ND...
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Electrically Isolating Epoxy Features Ultra High Heat Transfer Capability
Master Bond EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity. It requires a cure at only 80°C for 1.5 to 2 hours. To optimize performance properties a post-cure of 1-2 hours at 80°C is recommended. Featuring a thixotropic paste consistency, this compound adheres well to a...
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Thermally Conductive, Electrically Non-Conductive Silicone Meets NASA Low Outgassing Specifications
Master Bond MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace, electronic, optoelectronic and specialty OEM industries. This system has a thermal...
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Ultra-Low Viscosity, Biocompatible Epoxy Offers Optical Clarity
Master Bond EP4CL-80Med is a one part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilization cycles and passes ISO 10993-5 testing for non-cytotoxicity. This product cures at moderate temperatures of around 80-85°C within 60 to 90 minutes and faster at slightly higher temperatures. As a one part, non-premixed and frozen system, it...
Read More »
Toughened, Non-Drip Epoxy Meets NASA Low Outgassing Specifications
Master Bond EP40ND is a two component epoxy system, designed for bonding, sealing and coating applications. It is a non-drip, toughened system with an easy to use 1:1 mix ratio by weight or volume. EP40ND meets NASA low outgassing specifications and has a high elongation of 80-90% at 75°F. It adheres well to many plastics, such as polycarbonates and acrylics, making it appropriate for...
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Low Viscosity, Electrically Conductive Epoxy Meets ISO 10993-5 Cytotoxicity Standards
Master Bond EP4G-80Med is a one part epoxy designed for use in the assembly of medical devices. This system is formulated with a non-metallic, graphite filler, which leads to good thermal and electrical conductivity. It possesses a thermal conductivity of 1.44-1.73 W/(m•K) and a volume resistivity of 50-100 ohm-cm. Furthermore, it complies with the ISO 10993-5 guidelines and is considered to be...
Read More »
UL Certified Epoxy Encapsulant Resists Arcing without Igniting
Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required. Electrical arcing is a challenge for numerous electronic or electrical devices; this occurs when electricity jumps from one connection to another, resulting in an electrical breakdown. The air surrounding the current becomes ionized and...
Read More »
Silver Filled, Low Outgassing Epoxy for EMI/RFI Shielding
Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements. It has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C. With a viscosity of 10,000-15,000 cps, EP4S-80 has a smooth flow and is easily brushable, making it ideal for EMI/RFI shielding and static dissipation. This formulation can also be used in a...
Read More »
Dual Curable Adhesive Offers Rapid Fixturing with LED Light
Master Bond LED415DC90 is a one component adhesive system that cures rapidly upon exposure to a 405 nm wavelength LED light source without any oxygen inhibition. The rate of cure depends upon the intensity of the light source, the thickness of the adhesive layer and the distance from the light to the adhesive. This no-mix system requires a post cure with heat and adheres well to both similar and...
Read More »
Non-Cytotoxic Epoxy Withstands Multiple Methods of Medical Sterilization
Master Bond EP41S-5Med is a two part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical devices. It features high temperature resistance and good strength properties. As an electrically insulative material, it can be utilized in medical electronic applications. This epoxy was tested against many sterilization...
Read More »
Electrically Insulative, Toughened Epoxy Meets NASA Low Outgassing Specifications
Master Bond Supreme 42HT-2ND Black is a two-part, non-drip epoxy system designed for bonding, sealing and coating applications. It is capable of withstanding temperatures up to 450°F (232°C), and provides a glass transition temperature (Tg) of 130-135°C. The material meets NASA low outgassing standards and is recommended for applications that require vacuum compatibility. Supreme 42HT-2ND...
Read More »
Electrically Isolating Epoxy Features Ultra High Heat Transfer Capability
Master Bond EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity. It requires a cure at only 80°C for 1.5 to 2 hours. To optimize performance properties a post-cure of 1-2 hours at 80°C is recommended. Featuring a thixotropic paste consistency, this compound adheres well to a...
Read More »
Thermally Conductive, Electrically Non-Conductive Silicone Meets NASA Low Outgassing Specifications
Master Bond MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace, electronic, optoelectronic and specialty OEM industries. This system has a thermal...
Read More »
Ultra-Low Viscosity, Biocompatible Epoxy Offers Optical Clarity
Master Bond EP4CL-80Med is a one part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilization cycles and passes ISO 10993-5 testing for non-cytotoxicity. This product cures at moderate temperatures of around 80-85°C within 60 to 90 minutes and faster at slightly higher temperatures. As a one part, non-premixed and frozen system, it...
Read More »
Toughened, Non-Drip Epoxy Meets NASA Low Outgassing Specifications
Master Bond EP40ND is a two component epoxy system, designed for bonding, sealing and coating applications. It is a non-drip, toughened system with an easy to use 1:1 mix ratio by weight or volume. EP40ND meets NASA low outgassing specifications and has a high elongation of 80-90% at 75°F. It adheres well to many plastics, such as polycarbonates and acrylics, making it appropriate for...
Read More »
Low Viscosity, Electrically Conductive Epoxy Meets ISO 10993-5 Cytotoxicity Standards
Master Bond EP4G-80Med is a one part epoxy designed for use in the assembly of medical devices. This system is formulated with a non-metallic, graphite filler, which leads to good thermal and electrical conductivity. It possesses a thermal conductivity of 1.44-1.73 W/(m•K) and a volume resistivity of 50-100 ohm-cm. Furthermore, it complies with the ISO 10993-5 guidelines and is considered to be...
Read More »
UL Certified Epoxy Encapsulant Resists Arcing without Igniting
Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required. Electrical arcing is a challenge for numerous electronic or electrical devices; this occurs when electricity jumps from one connection to another, resulting in an electrical breakdown. The air surrounding the current becomes ionized and...
Read More »
Silver Filled, Low Outgassing Epoxy for EMI/RFI Shielding
Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements. It has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C. With a viscosity of 10,000-15,000 cps, EP4S-80 has a smooth flow and is easily brushable, making it ideal for EMI/RFI shielding and static dissipation. This formulation can also be used in a...
Read More »