Master Bond, Inc.
Hackensack, NJ 07601-3950
Nanosilica Filled, Dual Cure Adhesive Meets NASA Low Outgassing Specifications
Master Bond UV22DC80 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating with the ability to cure under UV light and/or with heat. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 milliwatts/cm2 of energy. This type of formulation allows for polymerization in “shadowed out” areas with...
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Rigid, Abrasion Resistant Two Component Epoxy for Bonding, Coating, and Sealing Applications
Engineered with a silicon carbide filler material, Master Bond EP21SC-1 delivers abrasion resistance for an array of chemical and mechanical processing applications. This epoxy has a smooth paste consistency and a non-critical one to one mix ratio by weight or volume. As a two part system, it cures readily at room temperature or more quickly at elevated temperatures. With a Shore D hardness...
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Low Thermal Expansion Epoxy passes NASA low outgassing tests.
Formulated with blend of polymeric and inorganic materials, 100% reactive EP30LTE-LO is used for bonding, sealing, casting, and coating applications. This 2-component epoxy exhibits dimensional stability and is serviceable over -60 to +250-
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Flexible Epoxy withstands cryogenic conditions.
Serviceable over wide range of 4 K to 250-
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Epoxy Adhesive encapsulates sensors in harsh environments.
Combining quartz filler and amine compound, Supreme 45HTQ is suited for bonding and encapsulating transducers, gauges, actuators, and sensors in harsh environments. Epoxy adhesive features tensile strength exceeding 8,500 psi and compressive strength greater than 20,000 psi. Resistant to chemicals, acids, oils, water, and steam, product can withstand long term exposure to 400-500-
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Heat Resistant Epoxy Adhesive provides high strength bonds.
Withstanding long-term exposure to wide temperature ranges between -100 and +500-
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Adhesive for Fiberglass Remarkably Resistant to High Temperature
Master Bond fiberglass adhesive EP33 facilitates the reliable bonding of fiberglass to a variety of different substrates. It has been specially designed to overcome CTE mismatch complications. Curing at room temperature, it produces durable, high strength, and tough bonds between fiberglass, wood, metals, vulcanized rubbers and many plastics. The cured fiberglass adhesive composition is an...
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Metal Bonding Epoxy offers optimal shear, peel strengths.
Formulated for service from -73-
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Adhesive/Sealant contains no solvents or diluents.
Storage-stable, one component, low viscosity system, EP19HT adhesive/sealant, impregnant, and liner features viscosity of 500-600 cps at 75-
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A Versatile Aerospace Epoxy Conquers Cryogenic Wind Tunnel
2/26/2009 A uniquely formulated epoxy adhesive has come to the rescue in an extraordinarily difficult cryogenic wind tunnel model bonding application. The state of the art wind tunnel poses a difficult challenge to engineering thermoplastics, not only in terms of the low temperatures and vacuum conditions, but in terms of thermal, thermal cycling and mechanical shear stresses. Cooled to 113-
Read More »Understanding Optical Transmission of Adhesives
Optical transmission is the ability for light to be channeled through a material, and it is measured from 0 to 100% on a wavelength scale of approximately 200 to 3,100 nanometers (nm). This property is essential for a number of applications in the optical and electro-optical industries. Most optically clear epoxies, polysulfides, and silicones offer excellent light transmission across the visible...
Read More »How to Optimize Bond Strength
Proper surface preparation is an essential part of optimizing bond strength. This infographic breaks down the various options ranging from abrasion to chemical etching when it comes to bonding rubbers, metals and plastics. Read More: http://click.skem1.com/click/gj688-awf98y-13mg5462/ Master Bond Website: www.masterbond.com Email: [email protected] Phone:+1 201 343 8983
Read More »Developed for Chip-on-Board Encapsulation Applications, Master Bond Supreme 3HTND-2DM is a Rapid Curing, Toughened, One Part Epoxy System that Can Be Used for Dam-and-Fill
This video demonstrates the process of dispensing the epoxy paste and creating a barrier, or “dam”, which can then be filled by a flowable encapsulant. This thermally conductive compound also meets NASA low outgassing specifications and can withstand 1,000 hours at 85°C/85% RH. Read More (http://click.skem1.com/click/fm07e-ahgtxl-13mg5468/) Updated Electronic Industry Catalog This 36-page...
Read More »White Paper: Silicones Meet the Needs of the Electronics Industry
Silicones offer the ability to maintain their physical properties across a wide range of temperatures while featuring unmatched flexibility. In this white paper, learn what makes silicones different from other organic polymers, and how they are playing a special role in the development of emerging electronic device technology. Electrically Conductive System Has High Flexibility MasterSil 973S-LO...
Read More »Webinar Explains How to Select an Adhesive for Aerospace
Master Bond’s technical experts clear up some of the unique challenges associated with selecting high performance adhesives for aerospace applications in a pre-recorded webinar presented with NASA Tech Briefs. They explain the many parameters to consider, including adhesion, temperature resistance, handling and curing time, among others. This webinar also focuses on different cure mechanisms...
Read More »New Catalog: Adhesives, Sealants & Coatings for the Optical Industry
This 24 page catalog features performance properties on Master Bond’s extensive line of epoxy, silicone and light curing compounds that meet the specific demands of the optical, fiber-optic, electro-optic, display, photonic and biophotonic industries. These products are used for bonding, laminating, sealing, coating, precise positioning, fixturing, mounting and potting/encapsulation. EP30-2LB:...
Read More »Nanosilica Filled, Dual Cure Adhesive Meets NASA Low Outgassing Specifications
Master Bond UV22DC80 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating with the ability to cure under UV light and/or with heat. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 milliwatts/cm2 of energy. This type of formulation allows for polymerization in “shadowed out” areas with...
Read More »Master Bond Introduces New Catalog on Adhesives, Sealants and Coatings for the Aerospace Industry
Master Bond is offering a new, easy to read, 28 page catalog with performance and processing data on its extensive line of epoxies, silicones, UV curing compounds and specialty systems for the aerospace industry. These products ensure reliability in the assembly of aircraft structures, components, interiors and MRO applications. They are widely used for structural bonding, sealing and gap...
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Rigid, Abrasion Resistant Two Component Epoxy for Bonding, Coating, and Sealing Applications
Engineered with a silicon carbide filler material, Master Bond EP21SC-1 delivers abrasion resistance for an array of chemical and mechanical processing applications. This epoxy has a smooth paste consistency and a non-critical one to one mix ratio by weight or volume. As a two part system, it cures readily at room temperature or more quickly at elevated temperatures. With a Shore D hardness...
Read More »Master Bond Introduces New Catalog on Adhesives, Sealants and Coatings for the Electronic Industry
New, easy to read, 32 page catalog offers performance and processing data on Master Bond’s extensive line of epoxy, silicone, polyurethane, silicate based and light curing compounds. These products provide solutions to PCB assembly, die-attach, conformal coating, surface mount, lid sealing, chip and wire bonding applications. Convenient, efficient and reliable packaging options are also...
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