Master Bond, Inc.
Hackensack, NJ 07601-3950
Flexible Epoxy withstands cryogenic conditions.
Serviceable over wide range of 4 K to 250-
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Heat Resistant Epoxy Adhesive provides high strength bonds.
Withstanding long-term exposure to wide temperature ranges between -100 and +500-
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Adhesive for Fiberglass Remarkably Resistant to High Temperature
Master Bond fiberglass adhesive EP33 facilitates the reliable bonding of fiberglass to a variety of different substrates. It has been specially designed to overcome CTE mismatch complications. Curing at room temperature, it produces durable, high strength, and tough bonds between fiberglass, wood, metals, vulcanized rubbers and many plastics. The cured fiberglass adhesive composition is an...
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Metal Bonding Epoxy offers optimal shear, peel strengths.
Formulated for service from -73-
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Epoxy Adhesive/Sealant meets NASA low outgassing requirements.
Offering optical clarity and chemical resistance, UV10TKLO-2 is not oxygen inhibited and cures rapidly at room temperature when exposed to UV light. Maximum UV absorption takes place in 320-365 nm range. One component, modified epoxy system has volume resistivity of greater than 1014 W cm, dielectric constant of 3.6 at 60 Hz, and service temperature of -60 to 300-
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A Versatile Aerospace Epoxy Conquers Cryogenic Wind Tunnel
2/26/2009 A uniquely formulated epoxy adhesive has come to the rescue in an extraordinarily difficult cryogenic wind tunnel model bonding application. The state of the art wind tunnel poses a difficult challenge to engineering thermoplastics, not only in terms of the low temperatures and vacuum conditions, but in terms of thermal, thermal cycling and mechanical shear stresses. Cooled to 113-
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Potting Compound withstands temperature extremes.
With thermal conductivity of 25 BTU-in./hr-ft2--
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Potting Compound has flexible, low-viscosity formulation.
Able to be used in thick and thin cross sections, EP30FL epoxy potting and encapsulation compound is 100% reactive and does not contain any volatiles. It cures at room temperature with minimal shrinkage and adheres to similar as well as dissimilar substrates. Recommended for use in environments exposed to thermal cycling, solution can withstand mechanical shock and vibration. Hardened compound...
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Conductive Adhesive withstands severe conditions.
Adhering to metallic and nonmetallic substrates, Epoxy Type EP11SIC is supplied as silver colored flowable paste with tensile strength greater than 6,000 psi and tensile shear strength over 1,500 psi over temperature range of -60 to +300-
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Two-Component Epoxy Adhesive gels in 3 minutes.
Used in general-purpose bonding applications or as electrical insulator, Polymer Adhesive EP44 gels in 3 min and cures within a few hours at ambient temperatures to develop bonding shear strength of 3,150+ psi. Parts bonded with this solution can be safely handled within 30 min, and bonds are resistant to thermal cycling as well as chemicals over -60 to 250-
Read More »Understanding Optical Transmission of Adhesives
Optical transmission is the ability for light to be channeled through a material, and it is measured from 0 to 100% on a wavelength scale of approximately 200 to 3,100 nanometers (nm). This property is essential for a number of applications in the optical and electro-optical industries. Most optically clear epoxies, polysulfides, and silicones offer excellent light transmission across the visible...
Read More »How to Optimize Bond Strength
Proper surface preparation is an essential part of optimizing bond strength. This infographic breaks down the various options ranging from abrasion to chemical etching when it comes to bonding rubbers, metals and plastics. Read More: http://click.skem1.com/click/gj688-awf98y-13mg5462/ Master Bond Website: www.masterbond.com Email: newsletters@masterbond.com Phone:+1 201 343 8983
Read More »Developed for Chip-on-Board Encapsulation Applications, Master Bond Supreme 3HTND-2DM is a Rapid Curing, Toughened, One Part Epoxy System that Can Be Used for Dam-and-Fill
This video demonstrates the process of dispensing the epoxy paste and creating a barrier, or “dam”, which can then be filled by a flowable encapsulant. This thermally conductive compound also meets NASA low outgassing specifications and can withstand 1,000 hours at 85°C/85% RH. Read More (http://click.skem1.com/click/fm07e-ahgtxl-13mg5468/) Updated Electronic Industry Catalog This 36-page...
Read More »White Paper: Silicones Meet the Needs of the Electronics Industry
Silicones offer the ability to maintain their physical properties across a wide range of temperatures while featuring unmatched flexibility. In this white paper, learn what makes silicones different from other organic polymers, and how they are playing a special role in the development of emerging electronic device technology. Electrically Conductive System Has High Flexibility MasterSil 973S-LO...
Read More »Webinar Explains How to Select an Adhesive for Aerospace
Master Bond’s technical experts clear up some of the unique challenges associated with selecting high performance adhesives for aerospace applications in a pre-recorded webinar presented with NASA Tech Briefs. They explain the many parameters to consider, including adhesion, temperature resistance, handling and curing time, among others. This webinar also focuses on different cure mechanisms...
Read More »New Catalog: Adhesives, Sealants & Coatings for the Optical Industry
This 24 page catalog features performance properties on Master Bond’s extensive line of epoxy, silicone and light curing compounds that meet the specific demands of the optical, fiber-optic, electro-optic, display, photonic and biophotonic industries. These products are used for bonding, laminating, sealing, coating, precise positioning, fixturing, mounting and potting/encapsulation. EP30-2LB:...
Read More »Master Bond Introduces New Catalog on Adhesives, Sealants and Coatings for the Aerospace Industry
Master Bond is offering a new, easy to read, 28 page catalog with performance and processing data on its extensive line of epoxies, silicones, UV curing compounds and specialty systems for the aerospace industry. These products ensure reliability in the assembly of aircraft structures, components, interiors and MRO applications. They are widely used for structural bonding, sealing and gap...
Read More »Master Bond Introduces New Catalog on Adhesives, Sealants and Coatings for the Electronic Industry
New, easy to read, 32 page catalog offers performance and processing data on Master Bond’s extensive line of epoxy, silicone, polyurethane, silicate based and light curing compounds. These products provide solutions to PCB assembly, die-attach, conformal coating, surface mount, lid sealing, chip and wire bonding applications. Convenient, efficient and reliable packaging options are also...
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Flexible Epoxy withstands cryogenic conditions.
Serviceable over wide range of 4 K to 250-
Read More »
Heat Resistant Epoxy Adhesive provides high strength bonds.
Withstanding long-term exposure to wide temperature ranges between -100 and +500-
Read More »