Solder

Solder

Henkel Solder and Thermal Innovations Earn Industry Recognition

Henkel Adhesive Technologies’ Electronics business was the big winner at the NPI Awards presented at last month’s APEX event in Las Vegas.Â-  Scoring victories in the Solder Materials and Underfill/Thermal Interface Materials categories for its Loctite® GC 3W and Gap Pad® EMI 1.0 materials, respectively, Henkel continues its streak of award wins for innovative product...

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Solder

Henkel Solder and Thermal Innovations Earn Industry Recognition

Henkel Adhesive Technologies’ Electronics business was the big winner at the NPI Awards presented at last month’s APEX event in Las Vegas.Â-  Scoring victories in the Solder Materials and Underfill/Thermal Interface Materials categories for its Loctite® GC 3W and Gap Pad® EMI 1.0 materials, respectively, Henkel continues its streak of award wins for innovative product...

Read More »
Sprayers

Spraying of Abrasive Soldering Paste

ViscoTec has proven high expertise particularly in complex dosing environments. ViscoTec's brand preeflow shows the capability to operate reliable, extremely precise and repeatable for various applications in many industries. With the help of the precision volume dispenser “eco-SPRAY” preeflow explores new paths. Soldering pastes are pasty mixtures of solder powder and flux agents, which...

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Sprayers

Spraying of Abrasive Soldering Paste

ViscoTec has proven high expertise particularly in complex dosing environments. ViscoTec's brand preeflow shows the capability to operate reliable, extremely precise and repeatable for various applications in many industries. With the help of the precision volume dispenser “eco-SPRAY” preeflow explores new paths. Soldering pastes are pasty mixtures of solder powder and flux agents, which...

Read More »
Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at IPC APEX EXPO
Solder

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at IPC APEX EXPO

OSAKA, JAPANÂ- – Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth #2610 at the IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and...

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Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at IPC APEX EXPO
Solder

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at IPC APEX EXPO

OSAKA, JAPANÂ- – Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth #2610 at the IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and...

Read More »
Henkel Changes the Game Again - New, Innovative Materials to Debut at APEX 2016
Thermal Management Materials

Henkel Changes the Game Again - New, Innovative Materials to Debut at APEX 2016

Since its introduction at last year's APEX event, the global adoption of Loctite® GC 10 temperature stable solder paste and its excellent in-process performance have been unprecedented.Â-  At APEX 2016, Henkel Adhesive Technologies will highlight the success of this ground-breaking material and showcase its new water soluble counterpart, Loctite GC 3W – another game-changer for...

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Henkel Changes the Game Again - New, Innovative Materials to Debut at APEX 2016
Thermal Management Materials

Henkel Changes the Game Again - New, Innovative Materials to Debut at APEX 2016

Since its introduction at last year's APEX event, the global adoption of Loctite® GC 10 temperature stable solder paste and its excellent in-process performance have been unprecedented.Â-  At APEX 2016, Henkel Adhesive Technologies will highlight the success of this ground-breaking material and showcase its new water soluble counterpart, Loctite GC 3W – another game-changer for...

Read More »
Water-Soluble Solder Paste is suited for PCB assembly.
Flux

Water-Soluble Solder Paste is suited for PCB assembly.

Available in SAC and Pb-based alloys, Indium6.4R provides balanced performance for PCB assembly applications. This versatile, water-soluble solder paste flux, exhibiting optimized stencil printing performance and response-to-pause, allows for wetting and solderability on multiple surface finishes.Â- In addition to minimizing voiding on QFNs, BGAs, and CSPs, product also maintains...

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Water-Soluble Solder Paste is suited for PCB assembly.
Flux

Water-Soluble Solder Paste is suited for PCB assembly.

Available in SAC and Pb-based alloys, Indium6.4R provides balanced performance for PCB assembly applications. This versatile, water-soluble solder paste flux, exhibiting optimized stencil printing performance and response-to-pause, allows for wetting and solderability on multiple surface finishes.Â- In addition to minimizing voiding on QFNs, BGAs, and CSPs, product also maintains...

Read More »

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