Solder

Indium Corporation Features Indium8.9HF Solder Paste at SMTAI
Soldering Machinery

Indium Corporation Features Indium8.9HF Solder Paste at SMTAI

Indium Corporation will feature Indium8.9HF, a halogen-free, no-clean solder paste with excellent performance stability during printing, at the SMTA International Conference Sept. 27-Oct. 1 in Rosemont, Ill. Pb-free Indium8.9HF is perfectly suited for a wide variety of applications, including automotive, consumer and communications. This is due to its high print transfer efficiency and robust...

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Metcal to Display the Scarab Site Cleaning System at NEPCON South China
Cartridges

Metcal to Display the Scarab Site Cleaning System at NEPCON South China

GARDEN GROVE, CAÂ- – Metcal today announced plans to exhibit in Booth B-1G26 at NEPCON South China, scheduled to take place Aug. 25-27, 2015 at the Shenzhen Convention Exhibition Center. The new Metcal Scarab Site Cleaning System (APR-2000-SCS) will be on display, along with the new Solder Ball Replacement Kit and MX-HPDC dual cartridge hand-piece. The Scarab ensures accurate and...

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Indium Corporation's Patented BiAgX®: A Drop-In Replacement for High-Pb Solders
Solder

Indium Corporation's Patented BiAgX®: A Drop-In Replacement for High-Pb Solders

Indium Corporation's newly-patented BiAgX® solder paste technology is the only low-cost, lead-free replacement solder paste that is customer-proven to survive JEDEC/IPC J-STD-020Â-  MSL1 preconditioning in specific devices without delamination. BiAgX is a high-melting, lead-free (Pb-free) solder paste technology that serves as a drop-in replacement for the high-Pb solder pastes...

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Solder

Indium Corporation Receives SMT China Vision Award

Indium Corporation was presented with the SMT China Vision Award for its Indium10.1 solder paste at NEPCON China on April 21 in Shanghai, China. The SMT China Vision Award recognizes domestic and international companies with innovative products and technologies in SMT methods, processes, materials, equipment, software, and management services. Each product entry was evaluated based on its...

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EVS Redefines 'Green' with the EVS 500LF at SMT Hybrid Packaging
Soldering Machinery

EVS Redefines 'Green' with the EVS 500LF at SMT Hybrid Packaging

EVS International, the leader in solder recovery, will showcase the new EVS 500LF lead-free version in Hall 7, Stand 101L at SMT Hybrid Packaging, scheduled to take place May 5-7, 2015 in Nuremberg Germany. EVS has drastically reduced the size, weight, complication and footprint, while creating a greener lead-free system – the EVS 500LF. The EVS 500LF has been designed to be the same size as a...

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Indium Corporation Features InFORMS® at PCIM
Indium

Indium Corporation Features InFORMS® at PCIM

Indium Corporation will feature its reinforced indium and solder alloy fabrications, InFORMS®, at PCIM Europe, May 19-21 in Nuremberg, Germany. InFORMS are patented fabrications in which braided, woven, or random-fiber metal substrate materials are embedded into a solder preform. This technology is ideally suited for IGBT assembly of the DBC to the baseplate. InFORMS create solder joints...

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Indium Corporation Releases BiAgX® Solder Paste Technology as Drop-In Replacement for High-Pb Solders
Solder

Indium Corporation Releases BiAgX® Solder Paste Technology as Drop-In Replacement for High-Pb Solders

Environmental and legislative concerns are driving consumers away from products using solders that contain lead (Pb), including solders used in die-attach applications for analog semiconductor assembly. Indium Corporation's BiAgX® solder paste technology is a high-melting, lead-free (Pb-free) solder paste technology that serves as a drop-in replacement for the high-Pb solders used in...

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Solder

Henkel's New Game Changing Solder Paste Wins NPI Award

The launch of Henkel’s much-anticipated game changing solder paste, LOCTITE GC 10, at the recent APEX event did not disappoint. Customers and booth visitors were intrigued and the industry took note. LOCTITE GC 10 is the market’s first-ever temperature stable solder paste, an innovation that earned the material an NPI Award in the highly competitive solder materials category. Sponsored by...

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Solder Paste is temperature stable at 26.5°C for 1 year.
Soldering Machinery

Solder Paste is temperature stable at 26.5°C for 1 year.

Halogen-free and lead-free, LOCTITE GC 10 enables abandon times of up to 24 hours and has startup time of 0. Product offers stabilized and consistent print transfer efficiency, expanded reflow window, and increased activity for optimum results with soak temperature from 150–200°C. Temperature stable up to 40°C for one month, paste eliminates requirement for cold packing, overnight...

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Halogen- and Pb-Free Solder Paste improves ICT first-pass yields.
Solder

Halogen- and Pb-Free Solder Paste improves ICT first-pass yields.

Formulated to accommodate processing temperatures required by SnAgCu, SnAg, and other alloy systems used by electronics industry, Indium10.5HF no-cleanÂ- solder paste conserves time and increases output for companies that require ICT as part of their normal production. Soft, pliable, non-tacky residue minimizes build-up on probes during in-circuit testing and increases first-pass ICT yields,...

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Paratherm™ HR Heat Transfer Fluid: Higher Temperature Stability Leads to Longer Fluid Life
Sponsored

Paratherm™ HR Heat Transfer Fluid: Higher Temperature Stability Leads to Longer Fluid Life

For the ultimate in heat transfer fluid performance, Paratherm offers HR Heat Transfer Fluid that is engineered specifically for closed loop liquid phase heating. When it comes to characteristics such as thermal stability and fluid degradation, Paratherm HR leads the industry in value and performance. See our video to learn how Paratherm is raising the bar for heat transfer fluids.

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