New Solder Products

Solder Powder/Flux allows soldering irons to be re-tinned.

Multicore-® TTC-LF consists of lead-free grade solder powder and flux, formed into shape of thick disk for cleaning and de-wetting soldering irons. Users wipe tip of iron across surface of TTC-LF to produce local melting, and then wipe on damp sponge. Suited for lead and lead-free applications, product features activators that thermally decompose into inert components, and ability to clean...

Lead-Free Solder Paste suits high-speed printing processes.

Available in lead-free alloys 96SC and 97SC, water-washable Multicore WS300 is resistant to humidity and slump, and is formulated to minimize any defects due to voiding. Paste is classified as ORH1 and meets or exceeds test specifications of ANSI/J-STD-004 and 005 for SIR, corrosion, fluorides, and slump. Product also meets Bellcore GR-78-CORE tests for electromigration and SIR.

Lead-Free Solder Paste exhibits humidity resistance.

Multicore-® LF318 is a halide-free, no-clean, pin-testable formulation that offers broad process windows for printing and reflow. Offering open time greater than 24 hr, paste provides initial tack force of 2.0 g/mm-². It achieves high degree of coalescence upon reflow, even after 72 hr at 27-

Solder Pellets range in size from 6 to 3/0 gauge.

Battery Terminal Solder Pellets provide method for attaching battery lug to cable, eliminating need for crimping. Flux core prevents dirt and contaminants from hindering soldering process. Pellets are color-coded to industry standards.

Hemp: An Eco-friendly Substitute for Cotton and Petroleum-based Synthetics

To learn more about hemp's history, composition, performance, and its sustainability and cost, download this white paper now.

Solder Paste features colored labeling for identification.

SolderPlus-® dispensable solder paste formulations are packaged in 3, 5, 10, 30, and 55 cc syringes with green end caps and green leaf label design for immediate recognition on production floor. Tin/silver, tin/silver/copper, and tin/bismuth alloys have low liquidus temperatures from 217 to 138-

Solder Paste remains soft and pliable.

SynTECH(TM) no-clean solder paste is made with synthetic poly adducts and yields reliable solder joints in SMT PC board assemblies. It offers wide process windows with 12 to 18 hr stencil life and 18 to 24 hr tack time. Paste leaves non-conductive, non-corrosive post reflow residue, which acts as protective coating. SynTECH requires no refrigeration. It is suitable for in-circuit testing of fine...

Solder Paste joins hard-to-solder materials.

SolderPlus with WS421 flux offers aggressive flux chemistry that provides suitable bonding strength for mechanical assembly applications. Available in lead-free and tin/lead solder paste alloys, it is prepackaged in EFD syringes for precise application with automatic dispensing equipment. Solder paste works successfully on hard-to-solder materials such as stainless steel 304 and 316, Nichrome,...

Solder Paste eliminates tombstone defects.

Loctite-® Multicore-® 63S4 RP15 phased-reflow, no clean solder paste is formulated with 63S4 alloy. 63S4 alloy blends SN63 and SN62, with melting points of 183-

Solder Paste produces consistent joints without cleaning.

SolderPlus No Clean solder paste prepackaged alloy/flux blend is formulated for controlled application by automatic dispensing equipment. It provides control and speed in production soldering processes by producing consistent solder deposits without needing to remove flux residue. This tacky paste is suitable for electronic, electromechanical and telecommunications applications.

Triad's Next-Gen Power Supplies Offer Increased Reliability and Reduced Noise Performance

Triad Magnetics, an established leader in power supply design and manufacturing, is proud to announce their next generation WAU AC and WDU DC Series of power supplies. These linear wall plug-ins offer minimum noise performance without sacrificing reliability or life. See our video to learn more.