Printing Paste features splatter-free flux.

Press Release Summary:



PrintPlus(TM) prevents scatter of flux that results from outgassing during solder paste preheat and reflow processes. By eliminating unwanted flux residue on gold fingers, wire bonding pads, and other circuit board areas, paste reduces defects in subsequent assembly operations. No-clean flux system is offered with variety of solder alloys, including lead-free.



Original Press Release:



New Solution for Solder Paste Splatter



Lincoln, RI USA -- The EFD Solder Paste Group has introduced a new printing paste that eliminates flux splatter during SMT circuit assembly operations.

PrintPlus(TM) with new splatter-free flux prevents the scatter of flux that often results from outgassing during solder paste preheat and reflow processes. By eliminating unwanted flux residue on gold fingers, wire bonding pads, and other circuit board areas, this new high-quality paste greatly reduces defects in subsequent assembly operations.

The PrintPlus splatter-free flux system is a no clean flux that is available with a variety of solder alloys, including lead-free.

To learn more about EFD solder paste and to request a PrintPlus sample, phone the EFD Solder Application Specialists at (800) 338-4353, or visit our web site at: www.efdsolder.com

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