Solder Paste reduces voiding of bumps on wafer/substrate.

Press Release Summary:

Water-soluble SE-CURE® 7101 has activator package that is formulated to exhibit uniform wetting to various under-bump metallurgies, reducing bump's voiding level to less than 10%. Residues can be removed, post-reflow, with cool or warm deionized water. It releases cleanly from stencil apertures with area ratios of 1.5 and smaller. Thermally stable flux system is compatible with tin/lead and lead-free alloy systems and offers optimal deposit definition without slumping or flux bleed.

Original Press Release:

Northrop Grumman Announces Water Soluble, Wafer Bumping Solder Paste

DES PLAINES, IL - July 31, 2003- Northrop Grumman Corporation (NYSE: NOC) announced that Kester®, business unit of the company's Component Technologies sector, has introduced SE-CURE® 7101, a solder paste targeted at users invested in the lower cost paste bumping operations of wafers and substrates.

SE-CURE® 7101 is a water-soluble solder paste uniquely engineered to reduce voiding of the bumps on a wafer or substrate. The activator package is formulated to exhibit exceptionally uniform wetting to many different under-bump metallurgies (UBM) so that the bump's voiding level is reduced to less than 10 percent. Developed for semiconductor applications, the residues can be easily removed post-reflow with cool or warm deionized water with very low ionic residues. The thermally stable flux system is flexible for tin/lead solder alloys, as well as the higher temperature reflow lead-free solder alloys. Low and ultra-low alpha particle emitting solder alloys are available for critical applications sensitive to "soft errors."

SE-CURE® 7101 releases cleanly from stencil apertures with area ratios of 1.5 and smaller (mesh size dependent), or when the surface area of the stencil aperture is 50 percent greater than the surface area of the metallized cap. It offers optimal deposit definition without slumping or flux bleed.

SE-CURE® 7101 solder paste provides consistent, printing behavior for the stringently controlled semiconductor fabrication process. Additional benefits include optimal printing performance in a water soluble bumping paste; unsurpassed cleaning performance that significantly outperforms th in ease of cleaning; excellent wetting behavior; and compatibility with both tin/lead and lead-free alloy systems.

For more information on SE-CURE® 7101 solder paste and Kester's full line of products and services, contact Kester® by phone at (847) 297-1600 or 800-2-KESTER (53-7837), by fax at (847) 699-5548, or by e-mail at Kester's Web site may be found at

Founded in 1899, Kester® is a world-renowned supplier of solder and related materials and services to the electronics assembly, micro-component, industrial soldering, hardware/retail, and wholesale plumbing markets. Kester® is known for high quality, advanced technology and superior technical support. With headquarters in Des Plaines, Ill., Kester® has additional manufacturing facilities in the United States, Canada, Singapore, Germany, Japan, Brazil, Taiwan, and Malaysia. Its worldwide manufacturing and technical capabilities provide the support required to serve major electronics manufacturing services providers and Original Equipment Manufacturers.

Northrop Grumman's Component Technologies sector, headquartered in Iselin, N.J., is a world leader in the design, development and manufacture of high-performance electronic and optical components and materials to the telecommunications, networking, industrial, medical and military markets. Component Technologies is comprised of six business units that include Interconnect Technologies, Kester®, Life Support, Poly-Scientific, Precision Products International and Winchester Electronics. The sector has more than 3,000 employees with technical sales offices in 28 countries and operations in 18 countries.
Global Kester® customer service contact information:


515 East Touhy Avenue
Des Plaines, Illinois, USA 60018-2675
TEL: (+1) 847297-16000
FAX: (+1) 847-390-9338

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