Solder

Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019

Indium Corporation Features Indium8.9HF Solder Paste Series at FIEE 2019

Indium Corporation will help customers Avoid the Void® with its void-reducing Indium8.9HF Solder Paste series at FIEE Smart Future, July 23-26, in São Paulo, Brazil. Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process...

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ECTC is 1 Month Away! Visit Yincae Booth # 506 May 31st to June 3rd

ECTC is 1 MONTH AWAY! VISIT YINCAE BOOTH # 506 May 31st to June 3rd Albany, NY – ECTC is only 1 month away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV from May 31st to June 3rd. YINCAE hopes that you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer. YINCAE offers a variety of exclusive Adhesives, Thermal Interface,...

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Henkel Solder and Thermal Innovations Earn Industry Recognition

Henkel Adhesive Technologies’ Electronics business was the big winner at the NPI Awards presented at last month’s APEX event in Las Vegas.Â-  Scoring victories in the Solder Materials and Underfill/Thermal Interface Materials categories for its LoctiteÂ-® GC 3W and Gap PadÂ-® EMI 1.0 materials, respectively, Henkel continues its streak of award wins for innovative product...

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Nihon Superior Collects an NPI Award for Its SN100C P604 D4 Solder Paste

Nihon Superior Collects an NPI Award for Its SN100C P604 D4 Solder Paste

OSAKA, JAPANÂ- – Nihon Superior Co., Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it was awarded a 2013 NPI Award in the category of Soldering Materials for its SN100C P604 D4 Lead-free and Completely Halogen-Free Solder Paste. The award was presented to the company during a Tuesday, February 19, 2013 ceremony that took place at the San...

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Choosing the Right Material for Your Project
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Choosing the Right Material for Your Project

When choosing an appropriate metal material, the range of options is so broad that selecting the correct material for your unique application can be challenging. Different metals have characteristics that can affect weldability, ductility, and formability. Our new eBook outlines the unique properties and applications of popular metals including: Stainless Steel Brass Aluminum Copper Titanium

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Reflow Soldering System offers void-free results. .

Reflow Soldering System offers void-free results. .

Combining convection heat and hyper-pneumatic module, MaxiReflow HP ensures virtually void-free solder connections. Instead of using complicated vacuum process, system is equipped with excess pressure chamber, enabling gas convection to be used for heating assemblies. Each heating zone of MaxiReflow HP – as well as zones integrated in hyper-pneumatic chamber – has tangential fan that ensures...

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Taiyo Showcases Diversified Product Selection at IPC APEX EXPO 2011

Taiyo America will be presenting a wide variety of products at the IPC show this year. With the support of Taiyo Holdings these products will be displayed as static items, graphically and digitally for the best hands on experience possible. The products that will be showcased are Laser Direct Imaging Solder Mask products for flex and rigid, Ink Jet Legend, Dual Cure Type Marking Ink and White...

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Henkel to Show Latest Materials Innovations at APEX 2010

Henkel to Show Latest Materials Innovations at APEX 2010

Irvine, California - Customers visiting Henkel at the upcoming APEX 2010 event in Las Vegas will quickly discover that partnering with the materials leader is no gamble. A continued emphasis on product innovation and R&D investment - even throughout the recent downturn - has placed the company firmly at the top among electronics materials suppliers, with materials solutions and global resources...

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Innovation Wins Big at APEX: Henkel R&D Commitment Results in Impressive Awards Haul

Irvine, California, April 8, 2009 The current economic climate, though challenging, certainly hasn't deterred the technology specialists at Henkel from continuing on an aggressive R&D path. As evidenced by an impressive five award wins during last week's APEX show in Las Vegas, Nevada, Henkel's commitment to innovation and materials advance is stronger than ever. Two Henkel electronics assembly...

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Powder recycles solder by separating dross.

Powder recycles solder by separating dross.

Applicable for wave soldering, Dross-B-Gone can recover 90% of pure solder originally used. Effective with both lead-free and lead solders, powder eliminates dross by oxidizing it into removable powder that is discarded, while pure molten solder remains in pot and becomes completely reusable. Non-polluting powder is sprinkled on molten solder at approximate ratio of 1/3 oz per 35.3 oz of solder...

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Pb-Free Material aids semiconductor thermal management.

To improve operational reliability, Honeywell Pb-free Die Attach Solder helps manage heat produced by semiconductor chips by filling gap between chips and heat spreader. This lead (Pb)-free thermal interface material, intended to be used mainly in wire form, is designed to offer environmentally friendly alternative with combination of melting temperature, wetting behavior, and mechanical...

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Sponsored

Simple Connection MGB with EtherNet/IP

The new MGB with EtherNet/IP is a leap forward in access door safety. Designed for easy installation, flawless performance, and long service life, it is engineered with robust features and cutting-edge technology that places it firmly at the leading edge of the door safety device industry. To learn all about the benefits of the Euchner MGB, see our video.

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