Solder

Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016
Solder

Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016

Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo, which will be held on March 15-17 in Las Vegas, Nev. Indium Corporation, the industry-leading source of void-reducing materials and results, has specifically formulated Indium10.1 solder paste to reduce voiding significantly below the industry average – for improved...

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Indium Corporation Features Gold-Tin Solder Preforms for Precision Die-Attach Applications at AeroDef2016
Solder

Indium Corporation Features Gold-Tin Solder Preforms for Precision Die-Attach Applications at AeroDef2016

Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical. Gold-based solder has a high melting point, ranging from 280°C to 1064°C (depending on the alloy), making it compatible with subsequent reflow...

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Adhesives

Henkel Selected as Morey Corporation's Primary Solder and Adhesive Provider

Expanded relationship provides mutual business opportunities Building on a business relationship that spans more than three decades, Henkel Adhesive Technologies announces that The Morey Corporation (Morey) has named the company its primary partner for supplying solder and adhesive materials for the production of advanced electronic technology. Located in suburban Chicago, Morey utilizes more...

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Water Washable Solder Paste has temperature-stable formula.
Solder

Water Washable Solder Paste has temperature-stable formula.

Along with properties of high-activity flux performance, LOCTITE GC 3W offers performance stability at 26.5°C forÂ- 6 months and at 40°C for one month. This lead-free, halogen-free solder paste has water-soluble formula and affords flexibility for user to clean board up to 7 days after board assembly. After 3 days at 80% RH, exhibits no dewetting on long...

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Flux

The Balver Zinn Group Going for VOC Emission Reduction with Low-VOC Fluxes during Productronica

The Balver Zinn Group announces that it will exhibit in Hall A4, Booth #261 at the international Productronica Trade Fair, scheduled to take place November 10 - 13, 2015 at the New Munich Trade Fair Centre in Munich, Germany. They will highlight the company’s extensive range of Cobar’s low-VOC fluxes for VOC emission reduction. In today’s production technology of electronic products the...

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Henkel's Temperature Stable LOCTITE GC 10 Solder Paste Living up to Its Game-Changing Promise
Solder

Henkel's Temperature Stable LOCTITE GC 10 Solder Paste Living up to Its Game-Changing Promise

Earlier this year, Henkel Adhesive Technologies introduced the electronics market to the first-ever temperature stable solder paste, LOCTITE GC 10. Since its official debut in February, over 1,000 sample requests of the material have been fulfilled and customers who have qualified the game-changing solder paste are singing its praises. Matt Polak, owner of Valley View, Ohio-based Raven Systems...

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Microtronic to Exhibit at the IMAPS EMPC in Germany
Flaw Sensors / Detectors

Microtronic to Exhibit at the IMAPS EMPC in Germany

Munich, GermanyÂ- – Microtronic GmbH, a leading sales specialist of microelectronics, today announced plans to exhibit at the 20th European Microelectronics and Packaging Conference Exhibition (EMPC), scheduled to take place Sept. 14-16, 2015 in Friedrichshafen, Germany. Company representative will demonstrate the Microtronic LBT-210, Akrometrix TherMoiré AXP and Sonix ECHO™ as...

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Nihon Superior to Celebrate Its 50th Anniversary and Showcase New Developments at SMTAI
Solder

Nihon Superior to Celebrate Its 50th Anniversary and Showcase New Developments at SMTAI

OSAKA, JAPANÂ- – Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth #419 at SMTA International, scheduled to take place Sep. 27 - Oct. 1, 2015 at the Donald Stephens Convention Center in Rosemont, IL. This year, Nihon Superior will celebrate its 50th anniversary since first introducing joining materials to the market. The most well-known solder;...

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Lead-Free Solder Recovery System reduces solder consumption.
Soldering Machinery

Lead-Free Solder Recovery System reduces solder consumption.

Lead-free EVS 500LF targets those with one lead wave and one lead-free wave, those who use Nitrogen or want to reduce Nitrogen usage, those with selective solder pots who only remove small amounts of dross every hour, or those with multiple waves. Users can recover up to 80% of pure solder from waste dross. ISO14001-compatible system works with environmental control systems and also helps to...

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Indium Corporation Features Indium8.9HF, Indium10.1 Solder Pastes at NEPCON South China
Solder

Indium Corporation Features Indium8.9HF, Indium10.1 Solder Pastes at NEPCON South China

Indium Corporation will feature its Indium8.9HF and Indium10.1 solder pastes at NEPCON South China 2015, on Aug. 25-27, in Shenzhen, China. Pb-free, halogen-free Indium8.9HF is perfectly suited for a wide variety of applications, including automotive, consumer, and communications. This is due to its high print transfer efficiency and robust reflow process window capability. With reliable...

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Sponsored

Simple Connection MGB with EtherNet/IP

The new MGB with EtherNet/IP is a leap forward in access door safety. Designed for easy installation, flawless performance, and long service life, it is engineered with robust features and cutting-edge technology that places it firmly at the leading edge of the door safety device industry. To learn all about the benefits of the Euchner MGB, see our video.

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