Nihon Superior Collects an NPI Award for Its SN100C P604 D4 Solder Paste
OSAKA, JAPAN- – Nihon Superior Co., Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it was awarded a 2013 NPI Award in the category of Soldering Materials for its SN100C P604 D4 Lead-free and Completely Halogen-Free Solder Paste. The award was presented to the company during a Tuesday, February 19, 2013 ceremony that took place at the San Diego...
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Reflow Soldering System offers void-free results. .
Combining convection heat and hyper-pneumatic module, MaxiReflow HP ensures virtually void-free solder connections. Instead of using complicated vacuum process, system is equipped with excess pressure chamber, enabling gas convection to be used for heating assemblies. Each heating zone of MaxiReflow HP – as well as zones integrated in hyper-pneumatic chamber – has tangential fan that ensures...
Read More »Taiyo Showcases Diversified Product Selection at IPC APEX EXPO 2011
Taiyo America will be presenting a wide variety of products at the IPC show this year. With the support of Taiyo Holdings these products will be displayed as static items, graphically and digitally for the best hands on experience possible. The products that will be showcased are Laser Direct Imaging Solder Mask products for flex and rigid, Ink Jet Legend, Dual Cure Type Marking Ink and White...
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Lead-Free Solder Paste withstands extreme climate changes.
Suited for handheld and automotive sectors, Multicore LF620 ensures consistent print performance with minimal hot slump, even in regions with temperatures of 86-
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Super Precision Bearings for Machine Tools: Factors For A Successful Spindle Bearing Set Up
This white paper provides an in-depth overview into choosing the right bearing for machine tools.
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Henkel to Show Latest Materials Innovations at APEX 2010
Irvine, California - Customers visiting Henkel at the upcoming APEX 2010 event in Las Vegas will quickly discover that partnering with the materials leader is no gamble. A continued emphasis on product innovation and R&D investment - even throughout the recent downturn - has placed the company firmly at the top among electronics materials suppliers, with materials solutions and global resources...
Read More »S-Bond Joining Materials and Services for the Manufacture of Sputtering Targets
S-Bond-® active solders enable the joining of dissimilar metals and ceramics to each other and to other metals. S-Bond's patented alloys have active elements such as titanium and cerium added to Sn-Ag, Sn-In-Ag, and Sn-Bi alloys to create a solder that can be reacted directly with the metallic and/or ceramic surfaces prior to bonding. S-Bond filler metal alloys produce reliable joints with...
Read More »Die Attach Solder Paste has enhanced thermal control.
Suitable for high-Pb and Pb-free applications, Multicore-® DA100(TM) addresses thermal requirements of smaller outline, higher functioning power semiconductor devices. It incorporates no clean, ROLO flux system and uses specific high-temperature, Pb-free alloys to offer thermal control necessary for rectifiers, power transistors, amps, and other components. Exhibiting less that 5% void instances...
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Solder Paste is lead and halide free.
Offering solderability over wide range of reflow profiles in both air and nitrogen, Multicore-® LF700 works on Ni/Au, immersion Sn, immersion Ag, and OSP copper surface finishes. Capable of reducing voiding in BGA solder joints, it delivers high tack force to provide stability during high-speed component placement and offers long printer abandon times of up to 4 hr even when printed onto...
Read More »Innovation Wins Big at APEX: Henkel R&D Commitment Results in Impressive Awards Haul
Irvine, California, April 8, 2009 The current economic climate, though challenging, certainly hasn't deterred the technology specialists at Henkel from continuing on an aggressive R&D path. As evidenced by an impressive five award wins during last week's APEX show in Las Vegas, Nevada, Henkel's commitment to innovation and materials advance is stronger than ever. Two Henkel electronics assembly...
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Powder recycles solder by separating dross.
Applicable for wave soldering, Dross-B-Gone can recover 90% of pure solder originally used. Effective with both lead-free and lead solders, powder eliminates dross by oxidizing it into removable powder that is discarded, while pure molten solder remains in pot and becomes completely reusable. Non-polluting powder is sprinkled on molten solder at approximate ratio of 1/3 oz per 35.3 oz of solder...
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Basalt America Announces Stronger, Lighter, and Corrosion-Free FRP's (Fiber Reinforced Polymers)
Fiber Reinforced Polymers (FRP), represents a truly groundbreaking advancement in structural reinforcement. Lightweight, strong, and green, they are changing the way the construction industry thinks about rebar. Unlike steel, FRPs don't rust and are far stronger than standard rebar. To learn why Fiber Reinforced Polymers are poised to change the way the world builds, see our video.
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