Solder

Indium Corporation to Feature MEMS Microphone Lid-Attach Indium8.9HF Solder Paste at MEMS and Sensors Technology Symposium 2017
Solder

Indium Corporation to Feature MEMS Microphone Lid-Attach Indium8.9HF Solder Paste at MEMS and Sensors Technology Symposium 2017

Indium Corporation will feature its MEMS microphone lid-attach Indium8.9HF Solder Paste at MEPTEC’s 15th Annual MEMS and Sensors Technology Symposium on June 6, in San Jose, Calif. Indium8.9HF is a no-clean, halogen-free (no intentionally added, halogen-free flux) solder paste that enables dispensing of fine lines and shapes down to a width of less than 150 microns. Indium8.9HF provides...

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Indium Corporation to Discuss Low-Voiding Options at SMTA Rocky Mountain
Solder

Indium Corporation to Discuss Low-Voiding Options at SMTA Rocky Mountain

Indium Corporation will feature its void-reducing solder pastes at the SMTA Rocky Mountain Expo & Technical Conference on Jan. 19 in Denver, Colo. Indium Corporation’s Indium8.9HF and Indium10.1 Solder Pastes: Are designed to provide ultra-low voiding Offer great print capabilities for small and low profile components Are designed to overcome head-in-pillow (HIP) Have excellent shelf and...

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Indium Corporation Features InFORMS® Reinforced Solder Preforms at IMAPS 2016
Solder

Indium Corporation Features InFORMS® Reinforced Solder Preforms at IMAPS 2016

Indium Corporation will feature its reinforced indium and solder alloy fabrications, InFORMS®, at IMAPS 49th International Symposium on Microelectronics (IMAPS 2016 - Packaging the Connected World), Oct. 10-13, in Pasadena, Calif. InFORMS are reinforced solder preforms that maintain a constant bondline thickness, thus significantly improving thermal cycling reliability. This is a key...

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Avoid the Void(TM): Indium Corporation's Indium8.9HF Solder Paste to be Featured at SMTAI
Solder

Avoid the Void(TM): Indium Corporation's Indium8.9HF Solder Paste to be Featured at SMTAI

Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste at SMTA International (SMTAI) 2016 on Sept. 27 and 28, in Rosemont, Ill. Indium8.9HF is specifically formulated to Avoid the Void™ while delivering high transfer efficiency with low variability. This no-clean solder paste is perfectly suited for a variety of applications, especially automotive, due to its unique...

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Distillation 101: A Guide to Distillation and Separation Technologies
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Distillation 101: A Guide to Distillation and Separation Technologies

Distillation is a separation unit operation that involves multiple countercurrent-stage steps, separating two or more volatile components. This results in the contact of liquid and vapor most generally in counterflow. Distillation 101: A Guide to Distillation and Separation Technologies provides an in-depth look at everything you need to know about distillation, including: Design procedures Equipment components Applications

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Adhesives

ECTC is 1 Month Away! Visit Yincae Booth # 506 May 31st to June 3rd

ECTC is 1 MONTH AWAY! VISIT YINCAE BOOTH # 506 May 31st to June 3rd Albany, NY – ECTC is only 1 month away! The tradeshow will take place at The Cosmopolitan hotel in Las Vegas, NV from May 31st to June 3rd. YINCAE hopes that you will stop by our Booth 506 to learn more about YINCAE and the innovative products we have to offer. YINCAE offers a variety of exclusive Adhesives, Thermal Interface,...

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Solder

Henkel Solder and Thermal Innovations Earn Industry Recognition

Henkel Adhesive Technologies’ Electronics business was the big winner at the NPI Awards presented at last month’s APEX event in Las Vegas.Â-  Scoring victories in the Solder Materials and Underfill/Thermal Interface Materials categories for its Loctite® GC 3W and Gap Pad® EMI 1.0 materials, respectively, Henkel continues its streak of award wins for innovative product...

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Sprayers

Spraying of Abrasive Soldering Paste

ViscoTec has proven high expertise particularly in complex dosing environments. ViscoTec's brand preeflow shows the capability to operate reliable, extremely precise and repeatable for various applications in many industries. With the help of the precision volume dispenser “eco-SPRAY” preeflow explores new paths. Soldering pastes are pasty mixtures of solder powder and flux agents, which...

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Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at IPC APEX EXPO
Solder

Nihon Superior Will Show the Latest Advancements of the SN100C Alloy at IPC APEX EXPO

OSAKA, JAPANÂ- – Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth #2610 at the IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and...

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Henkel Changes the Game Again - New, Innovative Materials to Debut at APEX 2016
Thermal Management Materials

Henkel Changes the Game Again - New, Innovative Materials to Debut at APEX 2016

Since its introduction at last year's APEX event, the global adoption of Loctite® GC 10 temperature stable solder paste and its excellent in-process performance have been unprecedented.Â-  At APEX 2016, Henkel Adhesive Technologies will highlight the success of this ground-breaking material and showcase its new water soluble counterpart, Loctite GC 3W – another game-changer for...

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Water-Soluble Solder Paste is suited for PCB assembly.
Flux

Water-Soluble Solder Paste is suited for PCB assembly.

Available in SAC and Pb-based alloys, Indium6.4R provides balanced performance for PCB assembly applications. This versatile, water-soluble solder paste flux, exhibiting optimized stencil printing performance and response-to-pause, allows for wetting and solderability on multiple surface finishes.Â- In addition to minimizing voiding on QFNs, BGAs, and CSPs, product also maintains...

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How SpinSelect Can Save You Time and Money
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How SpinSelect Can Save You Time and Money

Thanks to the unique SpinSelect™ Multi-Pocket selectable quick change tool holder, it's time to rethink the range, complexity and volume of parts that your lathe can produce. Our Spin-Select™ tool was created to increase productivity and consistency by decreasing downtime associated with lathe cutting tool and insert setups or changeovers. This product is a game-changer for the industry and we're pleased to show you why.

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