Solder Paste suits high-speed printing processes.

Press Release Summary:



Multicore® 63S4 MP200 no-clean solder paste is formulated with 63S4 alloy that eliminates tombstone defects and reduces component misalignment. Paste delivers extended abandon time, long open time, and slump resistance. It is suitable for HASL, OSP copper, gold over nickel, and silver immersion. Multicore 63S4 meets or exceeds test specifications of J-STD-004 for copper mirror, copper plate, chlorides and bromides, and is classified as ROL0.



Original Press Release:



Phased Reflow Anti-Tombstoning Solder Paste for High Speed Printing Processes



Industry, Calif. - November 21, 2002.... Henkel Loctite Corporation has introduced new Loctite(R) Multicore(R) 63S4 MP200 no-clean solder paste, formulated with the unique 63S4 alloy that eliminates costly tombstone defects and reduces components misalignment that occurs when reflowing boards with very small components such as 0402 and 0201 chips. This paste offers excellent performance on difficult to solder substrates.

Suitable for fine pitch, high speed printing applications, Multicore 63S4 MP200 is a drop in replacement for standard lead alloys, but offers a wider process window to compensate for inaccuracies in screen printing, pick-and-place, and thermal profiling. The paste is formulated to deliver extended abandon time, long open time, slump resistance and increased tack life. The product is suitable for use on a variety of substrates including HASL, OSP copper, gold over nickel, and silver immersion.

The Loctite Multicore 63S4 alloy blends SN63 and SN62 with melting points of 183°C and 179°C respectively. In a phased reflow process, a small amount of SN62 wets both sides of the termination before the SN63 melts, tack soldering components to the PCB and delivering a larger assembly process window. By eliminating tombstone defects, 63S4 MP200 solder paste increases production yield, decreases rework costs, and improves overall quality.

This paste meets or exceeds test specifications of J-STD-004 for copper mirror, copper plate, chlorides and bromides, and is classified as ROL0. Multicore 63S4 MP200 also meets Bellcore GR-78-Core standards for electromigration. For more information on Loctite(R) Multicore(R) 63S4 MP200, call (626) 968-6511 or visit the Loctite Web site at http://www.loctite.com/electronics.

Since 1997, Henkel Loctite Corporation, formerly Loctite Corporation, headquartered in Düsseldorf, Germany, has been part of the Henkel Group. It operates in markets as diverse as electronics, automotive, aerospace, biomedical and general industry. Henkel is a leader in consumer brands and technologies. The branded business sectors are Laundry & Home Care, Cosmetics/Toiletries and Consumer and Craftsmen Adhesives. Henkel Technologies is the world market leader in Industrial Adhesives and Surface Technologies. The three systems businesses -- Henkel Industrial Adhesives and Sealants, Loctite Engineering Adhesives and Henkel Surface Technologies -- supported by their worldwide presence and strong technology base, are the pillars of Henkel Technologies' success. In Laundry & Home Care and in Cosmetics/Toiletries, Henkel holds a leading position in Europe. "Henkel - A Brand like a Friend": With strong brands and advanced technologies of superior quality and value Henkel makes people's lives easier, better and more beautiful. The company operates in more than 75 countries. In the first nine months of 2002, Henkel Group generated sales of 7.3 billion Euro and an operating profit (EBIT) of 490 million Euro. A total of 46,219 employees work for Henkel on a worldwide basis.

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