Press Release Summary:
Type R905 lead-free solder paste is engineered for high thermal demand of assembling with elevated melting temperatures of lead-free alloys. It provides consistent release from stencil for critical, 0.4 mm fine-pitched applications with anti-slump characteristics and preferred solder deposit definition. Printing characteristics remain constant with print speeds up to 6 ips. Paste is 0201 capable with standard type 3 powder, and is reflowable in air and nitrogen atmospheres.
Original Press Release:
Northrop Grumman Introduces Environmentally Friendly, Lead-Free, No-Clean Solder Paste
DES PLAINES, IL - July 31, 2003 - Northrop Grumman Corporation (NYSE:NOC) today announced that Kester®, a business unit of the company's Component Technologies sector, has introduced R905, a new lead-free, no-clean solder paste.
Kester's R905 is engineered specifically for the high thermal demands of assembling with the elevated melting temperatures of lead-free alloys such as the tin silver/copper family. R905 is formulated for consistent release from the stencil for critical, fine-pitched applications (0.4 millimeters) with anti-slump characteristics and the preferred solder deposit definition. These printing characteristics remain constant with print speeds up to six inches per second or 150 millimeters per second. The print quality remains first-rate, even with down times of up to 60 minutes.
R905 Key Benefits:
o Consistency: Has batch-to-batch repeatability that is sought after by manufacturers because it minimizes delays and allows the manufacturer to ship finished products on schedule.
o Printability: Delivers consistent solder paste volume deposits regardless of print speed. Most surface mount technology (SMT) defects occur with variations in print volume from board-to-board.
o Advanced Technologies: Both lead-free processing and 0201 print and reflow capabilities. It is 0201 capable with standard type 3 (-325/+500 mesh) powder.
o Solderability: R905 is reflowable in air and nitrogen atmospheres. It solders well to a wide variety of board and component metallizations, including palladium
o Anti-slump: Has superb brick definition and bridging prevention due to the paste's non-slumping chemistry. The solder brick maintains its shape over time without variation. This attribute prevents bridging, especially in fine-pitch components.
Founded in 1899, Kester® is a world-renowned supplier of solder and related materials and services to the electronics assembly, micro-component, industrial soldering, hardware/retail, and wholesale plumbing markets. Kester® is known for high quality, advanced technology and superior technical support. With headquarters in Des Plaines, Ill., Kester® has additional manufacturing facilities in the United States, Canada, Singapore, Germany, Japan, Brazil, Taiwan, and Malaysia. Its worldwide manufacturing and technical capabilities provide the support required to serve major electronics manufacturing services providers and Original Equipment Manufacturers.
Northrop Grumman's Component Technologies sector, headquartered in Iselin, N.J., is a world leader in the design, development and manufacture of high-performance electronic and optical components and materials to the telecommunications, networking,
industrial, medical and military markets. Component Technologies is comprised of six business units that include Interconnect Technologies, Kester®, Life Support, Poly-Scientific, Precision Products International and Winchester Electronics. The sector has
more than 3,000 employees with technical sales offices in 28 countries and operations in 18 countries.
Global Kester® customer service contact information:
515 East Touhy Avenue
Des Plaines, Illinois, USA 60018-2675
TEL: (+1) 847-297-16000
FAX: (+1) 847-390-9338