Adhesives

New UV26 UV Curable Adhesive Features a Refractive Index of 1.55 at Room Temperature
Adhesives

New UV26 UV Curable Adhesive Features a Refractive Index of 1.55 at Room Temperature

The Master Bond’s UV26 UV Curable Adhesive has a glass transition temperature (Tg) ranging from 160 to 170°C. The compound is suitable for use on substrates such as glass, surface treated metals and plastics. The product can cure compounds of viscosity ranging from 250-1,500 cps when exposed to UV light source at a wavelength of 320-365 nm. It can withstand chemicals such as acids, bases,...

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New UV26 UV Curable Adhesive Features a Refractive Index of 1.55 at Room Temperature
Adhesives

New UV26 UV Curable Adhesive Features a Refractive Index of 1.55 at Room Temperature

The Master Bond’s UV26 UV Curable Adhesive has a glass transition temperature (Tg) ranging from 160 to 170°C. The compound is suitable for use on substrates such as glass, surface treated metals and plastics. The product can cure compounds of viscosity ranging from 250-1,500 cps when exposed to UV light source at a wavelength of 320-365 nm. It can withstand chemicals such as acids, bases,...

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WINDGO, Inc. Granted Substrate-Backed Smart Damping Adhesive Patent
Adhesives

WINDGO, Inc. Granted Substrate-Backed Smart Damping Adhesive Patent

COLUMBIA, Mo., Oct. 4, 2018 /PRNewswire/ -- Today, WINDGO Inc., a research and development company specializing in smart material and vibrational transfer technologies announced that they have been granted US Patent No.10,088,011 for a substrate-backed Smart Damping Adhesive (SDA). This is in line with WINDGO's emphasis on energy, resonance and vibration technologies and products. WINDGO, Inc. is...

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WINDGO, Inc. Granted Substrate-Backed Smart Damping Adhesive Patent
Adhesives

WINDGO, Inc. Granted Substrate-Backed Smart Damping Adhesive Patent

COLUMBIA, Mo., Oct. 4, 2018 /PRNewswire/ -- Today, WINDGO Inc., a research and development company specializing in smart material and vibrational transfer technologies announced that they have been granted US Patent No.10,088,011 for a substrate-backed Smart Damping Adhesive (SDA). This is in line with WINDGO's emphasis on energy, resonance and vibration technologies and products. WINDGO, Inc. is...

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PCB Fabrication Notes Guide
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PCB Fabrication Notes Guide

The overall purpose of your fabrication notes is to enhance Design for Manufacturability for optimal PCB fabrication and assembly while maintaining applicable industry standards and regulations.

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DuPont Electronics & Imaging Announces Newest In-Mold Electronics Inks
Adhesives

DuPont Electronics & Imaging Announces Newest In-Mold Electronics Inks

Second Generation Materials Address Key Industry Needs; Build on Existing Portfolio WILMINGTON, DEL. (PRWEB) SEPTEMBER 12, 2018 - DuPont Electronics & Imaging today announced that it is launching its second generation of In-Mold Electronic (IME) materials with key advancements in its electrically conductive adhesive, protection encapsulant and crossover dielectric. IME technology enables...

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DuPont Electronics & Imaging Announces Newest In-Mold Electronics Inks
Adhesives

DuPont Electronics & Imaging Announces Newest In-Mold Electronics Inks

Second Generation Materials Address Key Industry Needs; Build on Existing Portfolio WILMINGTON, DEL. (PRWEB) SEPTEMBER 12, 2018 - DuPont Electronics & Imaging today announced that it is launching its second generation of In-Mold Electronic (IME) materials with key advancements in its electrically conductive adhesive, protection encapsulant and crossover dielectric. IME technology enables...

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