Top Five Thermally Conductive Adhesives
EP36AO: Flexible Epoxy for Potting and Encapsulation Applications B-staged epoxy, EP36AO, features outstanding thermal shock resistance and thermal conductivity over the wide temperature range of -100°F to +500°F. It is available for use in 30 gram cookies. EP36AO has excellent adhesion to both metallic and non-metallic substrates, plus a high degree of chemical resistance. It also offers...
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Thermally Conductive, Electrically Insulative Epoxy Delivers Low Exotherm for Large Castings and Potting Applications
Master Bond EP39MAOHT is a room temperature curing system for demanding bonding, sealing, coating, potting and encapsulation applications. “It is a versatile product that combines convenient handing, good flow, thermal conductivity, electrical insulation and high temperature resistance,” said Robert Michaels, vice president of technical support. “Its toughness lessens the chance of stress...
Read More »Adhesives for the Medical Industry
For an overview of our most popular medical grade formulations, please browse this easy to read catalog organized by chemistry, key properties and curing schedules. From the prototype stage through the assembly process, each compound in this 24 page catalog is designed to satisfy the requirements of medical device manufacturing companies. These products meet either USP Class VI or ISO 10993-5...
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Adhesives for Your Specific Need
MasterSil 157: Addition Cured Silicone with Wide Temperature Serviceability MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and has the ability to transmit light very well from 220-2,500 nanometers. These properties are retained over the exceptionally broad service temperature range of...
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Corrosive/Ultrapure Fluid Heat Exchanger Coils - Choosing the Right Strategy
Check out this white paper to learn which heat exchanger types are the best for high temperature performance in chemically aggressive applications.
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Rapid Curing Two Component Epoxy Offers Impressive Chemical Resistance and High Bond Strength
Master Bond EP41S-F is a two part epoxy for bonding, sealing, coating and encapsulation applications. It combines fast ambient temperature cure speed with chemical resistance and superior electrical insulation properties. This versatile system is easy to handle and has a forgiving 100 to 25 mix ratio by weight. After mixing, EP41S-F polymerizes quickly and can usually be removed from a fixture...
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Master Bond EP93FRHT Developed for Aircraft Applications
Specifically designed for avionic/aviation applications, Master Bond EP93FRHT readily passes the stringent Airbus specifications for vertical burn test, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. This video explains the testing procedures and how well this two part, non-halogenated system performed. EP93FRHT can be used for bonding, sealing and potting applications...
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Dymax to Introduce New Small-Gauge Needle Bonding Adhesive at MD&M East 2017
Torrington, Connecticut – June 2, 2017 - Dymax Corporation, a leading supplier of adhesives to the disposable medical device industry, will exhibit in Booth #1357 at MD&M East, scheduled to take place June 13-15, 2017 at the Jacob Javits Convention Center in New York. Their newest products and technologies – including MD® 1406-M, a next generation needle bonding adhesive – will be...
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Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions
Formulated to meet rigorous Airbus specifications, Master Bond EP93FRHT passes the twelve second vertical burn test per AITM 2.0002B and Section 7.1.2 of ABD0031, Issue F; the smoke emission test per AITM 2.0007B, Issue 3 in the flaming mode and Section 7.3.2 of ABD0031, Issue F; and the toxic gas emission test per AITM 3.0005, Issue 2 in the flaming mode and Section 7.4 of ABD0031, Issue F....
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70-3812NC Epoxy Adhesive meets ASTM E-595-07 standards.
Providing enhanced bonding and thermal conductivity, 70-3812NC Aluminum Filled Epoxy Adhesive is suitable for bonded fin heat sink and pipe bonding in extruded aluminum base applications. Formulated to be cured at room temperature or with mild heat, product’s 10:1 mix ratio is easy for batch mixing or using Meter Mix and Dispense Equipment.
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Uni-Seal™ 6322: UV / LED / Visible Hybrid Low Shrinkage (Soft) Gasketing Sealant / Bonder
Incure Uni-Seal™ 6322 UV / Visible / LED light curable adhesive is an acid-free, low viscosity form-in-place / cure-in-place gasket (FIPG / CIPG). Cures very fast with low energy LED lamps for high volume production. High resilient (good memory retention) and high flexibility out-perform many gaskets provides air-tight sealing. Uni-Seal™ 6322 exhibits enhanced excellent moisture and...
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Precision Machined Parts for High Tech Applications
For precision and value that sets the standard for quality and craftsmanship, EGS Production Machining is the source for precision and value. Our extensive capabilities and dedication to customer service allow us to deliver the optimal manufacturing solution. See our video to learn more.
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