UV-Cure Encapsulants cure within 26-46 sec.

Press Release Summary:



Hysol 3323, 3327, and 3329 are dam-and-fill products for encapsulation of wire-bonded dies used in Smart Card ICs. Used to form dam, high-viscosity Hysol 3323 has thixotropic nature and glass transition temperature (Tg) of 155°C. Hysol 3327 and 3329 are low-viscosity materials used for fill process. Coefficient of thermal expansion is 45 ppm below Tg and 130 ppm above Tg. Curing time enables max of 10,000 UPH, with no post-cure requirement.



Original Press Release:



New UV-Cure Encapsulants from Henkel Offer Improved Adhesion, Faster Curing and High Reliability



Smart Card IC module manufacturers can reduce process costs with new dam-and-fill products

The electronics group of Henkel has announced the launch of three new UV-cure encapsulants for use in Smart Card IC module manufacturing. The dam-and-fill products are to be marketed under Henkel's Hysol brand and are named Hysol 3323, Hysol 3327 and Hysol 3329. Developed using the latest single-component epoxy technology, these encapsulants provide faster curing times, improved adhesion, minimized tape warpage and excellent performance during reliability testing, compared to existing UV- or thermal-cure encapsulants.

All three products are designed specifically for the encapsulation of wire-bonded dies used in Smart Card ICs. Hysol 3323 has high viscosity and a thixotropic nature, and is used to form the dam, while Hysol 3327 and 3329 are both low viscosity materials used for the fill process. The physical and chemical properties of the three materials have been closely matched, such that Hysol 3323 dam encapsulant is intended for use only with Hysol 3327 or Hysol 3329 fill encapsulants. Hysol 3329 has a higher glass transition temperature (Tg) of 155°C (compared to 110°C for Hysol 3327) and a higher Shore hardness. Either combination will pass mechanical stress testing and high-reliability tests, typically -55°C to +125°C temperature cycling and heat/humidity ageing at 85°C and 85% relative humidity.

These encapsulants provide many benefits during the manufacture of Smart Card IC modules. They are easy to dispense, adhere strongly to a wide range of commonly-used carrier substrates, for example glass epoxy, and possess a low coefficient of thermal expansion (45ppm below Tg and 130ppm above Tg). Typical UV cure times per IC module are between 26-46 seconds, which enables a maximum of 10,000 UPH, with no post-cure requirement. With the combination of higher process throughput achieved, a long pot life that minimises wastage, and competitive pricing, the potential exists for considerable cost-savings.

Henkel offers an extensive product range for Smart Card manufacture, including die-attach materials, thermal-cure encapsulants, adhesives for implanting/lamination and NCP/ACP materials for flip-chip attachment. A dedicated global team is on hand to offer technical and sales/logistics support to customers, ensuring that they derive maximum benefit from the latest developments in product technology. Application development team is offering to encapsulate wire bonded dies - provided by module manufacturers - on internal available production equipment to save time and resources for customers. Additional information is available from www.henkelelectronics.com.

About the electronics group of Henkel

Henkel is the world's leading and most progressive provider of qualified, compatible material sets for semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol, Loctite and Multicore brands, and its global customer support infrastructure, the electronics group of Henkel delivers world-class materials products, process expertise and total solutions across the board to enable tomorrow's electronic industry. Within Henkel, the electronics group is part of the Adhesives, Sealants and Surface Treatments business that serves the automotive, electronics, aerospace, metal, assembly, maintenance and repair, consumer goods and packaging industries, and offers a broad range of products for craftsmen and consumers.

Company Contact
Lisa Stickley
Henkel Corporation
P: 949-789-2900
E: lisa.stickley@us.henkel.com

Global Agency Contact
Krista MacKinnon
Protean Marketing Communications
P: +44 (0)1628 648530
E: krista@protean.co.uk

Americas Agency Contact
Laura Sims
Protean Marketing Communications
P: 404-661-0348
E: laura@proteanmarketing.com

About Henkel

"Henkel - A Brand like a Friend". With brands and advanced technologies, Henkel makes people's lives easier, better, and more beautiful. The business sector Henkel Technologies is one of the leading suppliers of adhesives, sealants and surface treatments for industrial customers. Strong brands, such as Loctite, Teroson, P3, Hysol and Liofol, are key drivers behind the success of the business sector. Henkel Technologies serves the automotive, electronics, aerospace, metal industries, assembly, maintenance and repair, consumer goods and packaging industries

The Henkel Group operates in three strategic business areas - Home Care, Personal Care, and Adhesives, Sealants and Surface Treatment. In fiscal 2003 the Henkel Group generated sales of 9.436 billion Euro and an operating profit (EBIT) of 706 million euros. 50,000 employees work for the Henkel Group worldwide. People in 125 countries around the world trust in brands and technologies from Henkel.

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