Conductive Adhesive suits die attach applications.
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Press Release Summary:
Electrically conductive Loctite® QMI529HT addresses requirements of higher-temperature processes such as lead-free manufacturing. Suited for attachment of ICs and components to metallic lead frames, silver-filled adhesive offers hydrophobic properties and temperature stability for production of void-free bond lines. Bismaleimide formulation can be SkipCured(TM) on diebonder or wirebonder preheater and can be converted into controlled collapse spacer paste.
Original Press Release:
Henkel Corporation Introduces New Conductive Adhesive for Die Attach Applications
Loctite® QMI529HT Provides Excellent Stability at High Temperatures; Perfect for Today's Lead-Free Processes
Always on the forefront of next-generation materials development, the electronics group of Henkel has introduced a new conductive adhesive to address the requirements of higher temperature processes such as lead-free manufacturing.
Delivering excellent electrical conductivity for attachment of integrated circuits (ICs) and components to metallic lead frames, Loctite® QMI529HT is a highly silver filled conductive adhesive designed to provide high thermal conductivity. The material's hydrophobic and high temperature stability characteristics produce void-free bond lines with excellent adhesive strength, enabling adhesion to a wide variety of metals and ceramic surfaces, including copper, silver-plated copper and pre-plated leadframes. Henkel's patented bismaleimide (BMI) formulation also has particularly robust adhesion to NiPdAu leadframes.
"We are definitely seeing an increase in higher temperature applications," says Ben Santos, Die Attach and TIM1 (Thermal Interface Materials) global product manager for the electronics group of Henkel. "QMI529HT has been specifically formulated to address these challenges, while maintaining flexibility, ease of use, quality and reliability. It provides today's advanced packing professionals with a state-of-the art material for their toughest manufacturing requirements."
Designed as a soft-solder replacement or for applications that require high thermal or electrical conductivity, Loctite QMI529HT achieves UPHs that are significantly higher than conventional oven cured adhesives. With exceptionally fast cure kinetics and very low volatiles, QMI529HT can be SkipCured(TM) on the diebonder or on the wirebonder preheater. This versatility allows the user to begin production using conventional oven cure and then switch to SkipCure, enabling significant cost reductions.
To control bondlines and fillet heights, QMI529HT can also be converted into a controlled collapse spacer paste (CCSP). Because the spacers do not alter the material properties, manufacturers who qualify QMI529HT first can easily transfer to its CCSP version with full confidence that the package reliability will only improve.
For more information on Loctite QMI529HT or any of Henkel's semiconductor packaging materials solutions, call (949) 789-2500 or visit www.henkelelectronics.com.
About the electronics group of Henkel
Henkel is the world's leading and most progressive provider of qualified, compatible material sets for semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol, Loctite and Multicore brands, and its global customer support infrastructure, the electronics group of Henkel delivers world-class materials products, process expertise and total solutions across the board to enable tomorrow's electronic industry.
The Henkel Group operates in three strategic business areas - Home Care, Personal care, and Adhesives, Sealants and Surface Treatments of which the electronics group is part, serving transportation, electronics, aerospace, metal, durable goods, consumer goods, maintenance and repair and packaging industries, and offering a broad range of products for the craftsman and consumer. With brands and advanced technologies, Henkel makes people's lives easier, better, and more beautiful. 50,000 employees work for the Henkel Group worldwide. People in 125 countries around the world trust in brands and technologies from Henkel - "A Brand like a Friend".
Company Contact
Lisa Stickley
Henkel
(p) 949-789-2551
E: lisa.stickley@us.henkel.com
www.henkelelectronics.com
Agency Contact
Laura Sims
Protean Marketing Communications
(p) 404-661-0348
E: lbsims@mindspring.com
www.proteanmarketing.com
