Dam and Fill Encapsulants meet lead-free requirements.
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Press Release Summary:
Hysol® FP4451TD(TM) and FP4800(TM) meet stringent JEDEC level testing requirements and enable wirebonded cavity-down SuperBGA® and Viper(TM) BGA packages. Suited for package level applications, Hysol FP4451TD offers aspect ratio of 0.70 height-to-width and enables dam heights greater than 1 mm. Self-leveling, liquid encapsulant, Hysol FP4800 withstands solder temperatures to 260°C after preconditioning, and penetrates fine-pitch wires and deep cavities without entrapping voids.
Original Press Release:
New Dam and Fill Encapsulants from Henkel Meet Stringent Lead-Free Requirements
Hysol FP4451TD and Hysol FP4800 support high-throughput, low-cost package assembly processes
The electronics group of Henkel announces two new, high-purity dam and fill encapsulants designed specifically for lead-free processing. Hysol® FP4451TD(TM) and Hysol FP4800(TM) both meet the stringent JEDEC level testing requirements for high-temperature reliability demanded by lead-free processes. The two products enable smaller, thinner and lighter wirebonded cavity down, SuperBGA® and Viper(TM) BGA packages, while supporting high-throughput, low-cost package assembly processes.
Dam heights greater than 1 mm are possible with Hysol FP4451TD, a tall dam flow control barrier recommended for package level applications. It offers superior dispensing and a high aspect of ratio of 0.70 height to width. In addition, its ionic contamination level is lower than earlier-generation products. Based on proven resin chemistry, FP4451TD exhibits excellent chemical resistance and thermal stability.
Hysol FP4800 is a liquid encapsulant with excellent adhesion that can withstand solder temperatures up to 260º C after JEDEC level 2 preconditioning. Its excellent flow properties allow it to penetrate fine-pitch wires and deep cavities without entrapping voids. Like all Hysol high-purity encapsulants, FP4800 is self-leveling and offers unprecedented performance for numerous advanced packages: BGAs, PBGAs, CSPs, full arrays on LTCC, transistors, system in package (SIP), microprocessors and ASICs.
With the addition of FP4451TD and FP4800 to the Hysol lead-free materials set, manufacturers can be confident of having a full range of products, backed by in-depth technical and engineering support, to meet the EU lead-free implementation date of July 2006. All Henkel lead-free products are designed to support high-quality advanced assembly processes at full production levels.
About the electronics group of Henkel
Henkel is one of the world's leading and most progressive providers of qualified, compatible material sets for semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol, Loctite and Multicore brands, and its global customer support infrastructure, the electronics group of Henkel delivers world-class materials products, process expertise and total solutions across the board to enable tomorrow's electronic industry.
The Henkel Group operates in three strategic business areas - Home Care, Personal care, and Adhesives, Sealants and Surface Treatments of which the electronics group is part, serving transportation, electronics, aerospace, metal, durable goods, consumer goods, maintenance and repair and packaging industries, and offering a broad range of products for the craftsman and consumer. With brands and advanced technologies, Henkel makes people's lives easier, better, and more beautiful. 50,000 employees work for the Henkel Group worldwide. People in 125 countries around the world trust in brands and technologies from Henkel - "A Brand like a Friend".
Company Contact
Doug Dixon
Henkel
(p) 949-789-2500
E: doug.dixon@us.henkel.com
www.electronics.henkel.com
