Press Release Summary:
HysolÂ® QMI600 semiconductor packaging material provides CTE and modulus to match existing mold compound properties, enabling wirebonds in same size die stack packages to survive thermal cycling. Silica-filled, non-conductive die attach paste exhibits stability at elevated temperatures as well as hydrophobic properties and produces void-free bond lines. Enhanced with pliable polymeric spacers, material transforms into controlled collapse spacer paste.
Original Press Release:
Low CTE, High Modulus Die Attach Material from Henkel Ideal for Same Size Die Stack Packages
New from the leader in semiconductor packaging materials, Hysol® QMI600 is the most recent advanced packaging material from Henkel to hit the market. A silica-filled, low viscosity, non-conductive die attach paste, Hysol QMI600 provides a low coefficient of thermal expansion (CTE) and high modulus to match existing mold compound properties, which enables wirebonds in same size die stack packages to survive thermal cycling. The material's high silica loading and low CTE is accompanied by very low shrinkage, thus minimizing warpage during stack up. However, despite its high silica loading, Hysol QMI600 has low viscosity and optimum thixotropy, enabling ease of dispensing and fillet formation during assembly.
Designed for applications that require high modulus and a low CTE, Hysol QMI600 is particularly well suited for die-to-die bonding in SCSP, BGA, QFN and other packages where die-to-die bonding is required. With excellent stability at elevated temperatures and hydrophobic properties, Hysol QMI600 produces void-free bond lines with superior adhesion to polyimide, silicon nitride, solder resist, bare silicon and several other surfaces that may present adhesion challenges for competitive products.
Like other Hysol QMI products that deliver exceptional performance, Hysol QMI600 allows users to realize maximum productivity and reduced manufacturing costs through Henkel's SkipCure(TM) process where the material can be SkipCured on the diebonder or on the wirebonder preheater. Manufacturers can begin production using oven cure and transition to SkipCure(TM) when production volumes increase.
In addition, Hysol QMI600 can be enhanced with Henkel's patented pliable polymeric spacers, which transform the material into a controlled collapse spacer paste (CCSP). This version of the product has the same wet and cured properties as the standard Hysol QMI600 version and has been used successfully in production to replace spacer die in same size die stack applications.
Several notable semiconductor packaging companies have already selected Hysol QMI600 as their material of choice for high-volume production of SCSPs. For more information on this material or any of Henkel's advanced semiconductor packaging products, call (949) 789-2500 or log onto www.electronics.henkel.com
About the electronics group of Henkel
Henkel is the world's leading and most progressive provider of qualified, compatible material sets for semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol, Loctite and Multicore brands, and its global customer support infrastructure, the electronics group of Henkel delivers world-class materials products, process expertise and total solutions across the board to enable tomorrow's electronic industry.
The Henkel Group operates in three strategic business areas - Home Care, Personal care, and Adhesives, Sealants and Surface Treatments of which the electronics group is part, serving transportation, electronics, aerospace, metal, durable goods, consumer goods, maintenance and repair and packaging industries, and offering a broad range of products for the craftsman and consumer. With brands and advanced technologies, Henkel makes people's lives easier, better, and more beautiful. 50,000 employees work for the Henkel Group worldwide. People in 125 countries around the world trust in brands and technologies from Henkel - "A Brand like a Friend".
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