Metrology Equipment

Latest 6DoF Laser Trackers Meet IEC Standards for Shock, Vibration and Extreme Thermal Conditions

Latest 6DoF Laser Trackers Meet IEC Standards for Shock, Vibration and Extreme Thermal Conditions

The 6DoF Laser Trackers are available in Vantage E6 and Vantage S6 models with an operating range of 35 and 80 m respectively. The units are offered with a capacity to measure and scan over tens of meters without loss in accuracy and line of sight issues. They are suitable for use in applications such as automotive, aerospace, construction, heavy equipment and shipbuilding industries. The...

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QVI Launches Fusion 350 Metrology System for High Speed 2D Parts Measurement at IMTS 2018

QVI Launches Fusion 350 Metrology System for High Speed 2D Parts Measurement at IMTS 2018

The Fusion 350 Large Field of View Metrology System is used for characterizing large or small parts. The unit provides high accuracy imaging of area up to 100 mm. It comes with 450 x 450 mm measuring area and flexible dual magnification optics, AutoID and Feature Extraction options. The system is embedded with QVI ZONE3® Express CAD-based 3D metrology software. The Fusion 350 is offered with...

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Measurement Work Cell adjusts to manufacturing needs.

Measurement Work Cell adjusts to manufacturing needs.

Built on COTS work cell systems integrated with measurement solutions, 360-° Flexible Measurement Cell is suited for automotive and aero structure applications, including power train, and closure panel fabrication. Intelligence measurement systems rapidly return operational data to organizations, enabling fabricators to benefit from data-driven manufacturing process. Scalable, portable, and...

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Glebar Focuses on Automation Enhancements at IMTS 2016

Systems feature ability to be fitted with robots, cleaning and drying stations and inspection systems for truly “turnkey hands off” automation CHICAGO – Glebar Company kicks off IMTS 2016 (booth N-7317) here with a focus on the latest automation enhancements for its centerless grinding and gauging systems which address the increasing demand for more precision manufactured components in the...

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Inspection Systems support semiconductor manufacturing.

Inspection Systems support semiconductor manufacturing.

Configurable for wafer or panel substrates, Firefly™ Inspection and Metrology System provides high-resolution inspection in front- and back-end applications. It can detect defects smaller than 1 micron in fan-out wafer level packaging, CMOS image sensors, MEMS and RF sensors. With 2D inspection sensitivity down to 2 microns, Dragonfly™ System targets large die, multi-chip advanced packaging...

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HEIDENHAIN to Offer Daily Motion Control Presentations at IMTS Booth -See Schedule Online Here - http://www.heidenhain.us/wp-content/uploads/TakeTen.pdf

SCHAUMBURG, IL – Bringing its international expertise in the area of motion control to the International Manufacturing Technology Show (IMTS) in Chicago’s McCormick Place (Sept. 12 – 17), HEIDENHAIN CORPORATION will offer five different concise presentations covering the latest in manufacturing technology at their booth (#E-5226) each day of the show.-  Each presentation will last a...

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Hexagon Manufacturing Intelligence Unveils New Data-Driven Automation Solution at IMTS

Press Conference Scheduled for Wednesday, September 14, 2016 at 1pm in Booth E-5202 North Kingstown, RI – Hexagon Manufacturing Intelligence North America today announced its Integrated Solutions Business group will unveil a new-to-the-market Automation solution at IMTS (International Manufacturing Technology Show) 2016, McCormick Place, Chicago, IL from September 12 – 16, 2016. This...

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Leading Logic and Foundry Manufacturers Select Bruker X-Ray Metrology Tools

Leading Logic and Foundry Manufacturers Select Bruker X-Ray Metrology Tools

Small-Spot Capabilities of JVX7300LSI System Enable Development of Advanced Technology Nodes SAN FRANCISCO, July 12, 2016 - At SEMICON West, Bruker today announced that multiple leading logic and foundry manufacturers have selected Bruker's JVX7300LSI X-ray metrology system to support their ramp and development for 10 nanometer (nm) and 7/5 nm technology nodes. The JVX7300LSI tool is equipped...

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Rudolph Receives Multi-System Order for over $11 Million from a Leading OSAT for Fan-out Wafer Level Packing Inspection

Rudolph Inspection, Metrology and Analysis selected for large-scale ramp of Fan-out Wafer Level Package Production (FOWLP). Wilmington, Mass. — Rudolph Technologies, Inc. (NYSE: RTEC), a leader in the design, development, manufacture and support of defect inspection, lithography, metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide,...

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