Metrology Equipment

Leading Equipment Manufacturer Selects JVX7300RF-W for Process Development of Advanced Wafer Level Packaging

MIGDAL HAEMEK, Israel- — Jordan Valley announces the selection of their advanced JVX7300RF-W, by a world leading process equipment manufacturer. The tool was selected following extensive evaluation of tool capability, performance and productivity for development and customers' demonstration of advanced wafer level packaging and thin-film applications. Jordan Valley, a leading supplier of X-ray...

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Camtek Penetrates Another World Leading OSAT with Its New Growth Engine: Eagle-AP

Eagle-AP provides both 2D and 3D inspection and metrology on the same platform MIGDAL HAEMEK, Israel — Camtek Ltd. (NASDAQ: CAMT, TASE: CAMT), today announced the receipt of initial orders for Eagle-AP systems, its new generation of 2D and 3D inspection and metrology system. The orders were received from a world leading Outsourced Semiconductor Assembly and Test (OSAT) , which has not...

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Metrology System supports 3D wafer fabrication.

By offering wide range of metrology measurements that drive tighter process control for critical parameters in Logic, Flash, and DRAM, HelioSense100™ Optical CD System supports industry transition to multi-patterning small pitch manufacturing and 3D vertical devices. Standalone system is optimized by NovaMARS modeling software and Nova's high-performance computation solution, allowing customers...

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Interferometer suits large aperture form metrology.

Interferometer suits large aperture form metrology.

Able to characterize flat surfaces up to 12 in. in diameter, Verifire™ XL Fizeau Interferometer is suitable for measuring large plano surfaces, such as mirrors, semiconductor wafers, or optical windows. Instrument features integrated reference optic with proprietary full area calibration, enabling metrology to better than 30 nm PV over full 300 mm aperture. Verifire™ XL comes with integrated...

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X-Ray Based CMM is designed for metrology.

Along with 225 kV X-ray source with- 2 micron minimum detectability, CXMM 50 features built-in temperature control and vibration-isolated granite table that promote precise and accurate measurements. X-ray test system, suited for use as product development and QC tool, is fitted with- flat panel DDA detector and intended for inspection of workpieces up to 11 kg with envelope up to 30 x 30 cm....

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Inspection System supports advanced semiconductor packaging.

Inspection System supports advanced semiconductor packaging.

Designed for characterization and monitoring of processes used in wafer-level packaging, CIRCL-AP™ enables all-surface wafer defect inspection, review, and metrology at high throughput. ICOS® T830 provides fully automated optical inspection of IC packages, leveraging sensitivity with 2D and 3D measurements to determine final package quality for diverse device types and sizes. Both systems help...

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Creaform's HandySCAN 3D Wins Prestigious Red Dot: Product Design 2015

The Red Dot Award recognizes the HandySCAN 3D impressive industrial design that offers an unmatched user experience Lévis, Québec – Creaform, worldwide leader in portable 3D measurement solutions and 3D engineering services, today announced that it has won the venerable Red Dot Award: Product Design for 2015, which benchmarks and recognizes the innovation efforts of forward-thinking companies...

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Gear Inspection System operates in production environments.

Gear Inspection System operates in production environments.

Available for gears up to 300 mm in diameter, 300GMS®P Analytical Gear Inspection System provides surface finish and prismatic feature measurement. System compensates for thermal fluctuations and has patent-pending base design with active leveling system that attenuates production environment vibrations. In addition to environmental monitoring station that records temperature and humidity,...

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Park Systems Announces Joint Development Partnership with imec to Develop Nanoscale AFM Metrology Solutions for Semiconductor Manufacturing

SUWON, Korea- – Park Systems, world-leader in Atomic Force Microscopes (AFM) announced today they have signed a Joint Development Project (JDP) with nanoelectronics research center imec, to develop in-line AFM metrology solutions of future technology nodes including but not limited to surface roughness, thickness, critical dimension (CD), and sidewall roughness.-  The JDP will develop new...

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KLA-Tencor Extends Its 5D(TM) Patterning Control Solution with New Metrology Systems

KLA-Tencor Extends Its 5D(TM) Patterning Control Solution with New Metrology Systems

Comprehensive Overlay and Films Process Control Solutions Address Advanced IC Process Challenges MILPITAS, Calif.- — Today, KLA-Tencor Corporation (NASDAQ: KLAC) introduced two advanced metrology systems that support the development and production of 16nm and below IC devices: Archer™ 500LCM and SpectraFilm™ LD10. The Archer 500LCM overlay metrology system provides accurate overlay error...

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