Inspection Equipment

Ascentech to Exhibit Optilia Inspection, GEN3 Systems Solutions at SMTA Ohio Expo & Tech Forum August 4th, 2016
Inspection Equipment

Ascentech to Exhibit Optilia Inspection, GEN3 Systems Solutions at SMTA Ohio Expo & Tech Forum August 4th, 2016

Chester, Connecticut, USA – Ascentech LLC will exhibit and demonstrate new test and process optimization instruments and solutions at the upcoming SMTA Ohio Expo Tech Forum August 4th 2016 in Independence (Cleveland) Ohio.Â-  Products will include the Optilia High Definition Camera Inspection System and GEN3 Systems Solder Saver, a solder/dross separation tool, the award-winning GENSONIC...

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Inspection Equipment

Camtronics, S.A. Purchases Scienscope X-Scope 2000

Chino, CA - July 2016 - Scienscope International, a complete inspection solutions provider, is pleased to announce the recent sale of an X-Scope 2000 to Camtronics, S.A., a contract manufacturer for the aerospace, medical, telcom, and industrial sectors. Camtronics recently purchased an X-SCOPE 2000 X-Ray Inspection System from Scienscope: a full featured, high-performance x-ray inspection system...

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Inspection Equipment

Camtronics, S.A. Purchases Scienscope X-Scope 2000

Chino, CA - July 2016 - Scienscope International, a complete inspection solutions provider, is pleased to announce the recent sale of an X-Scope 2000 to Camtronics, S.A., a contract manufacturer for the aerospace, medical, telcom, and industrial sectors. Camtronics recently purchased an X-SCOPE 2000 X-Ray Inspection System from Scienscope: a full featured, high-performance x-ray inspection system...

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Inspection Equipment

Wafer Defect Inspection/Review Systems aid IC device manufacture.

Employing diverse technologies, 3900- and 2930 Series broadband plasma optical inspectors, Puma™ 9980 laser scanning inspector, CIRCL™5 all-surface inspection cluster, Surfscan® SP5XP unpatterned wafer inspector, and eDR7280™ e-beam review and classification tool form wafer inspection solution that enables discovery and control of yield-critical defects at all stages of IC...

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Wetting Tester simulates SMT mounting and reflow processes.
Simulators

Wetting Tester simulates SMT mounting and reflow processes.

Malcom SP-2 helps test wettability of solder paste and components while simulating SMT mounting and reflow process. By simulating actual temperature that solder paste undergoes during preheat and reflow, instrument lets user identify deficiencies in flux activity or component wettability. Simulation of SMT mounting and reflow process with standard variable enables development of accurate,...

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Inspection Equipment

Wafer Defect Inspection/Review Systems aid IC device manufacture.

Employing diverse technologies, 3900Â- and 2930 Series broadband plasma optical inspectors, Puma™ 9980 laser scanning inspector, CIRCL™5 all-surface inspection cluster, Surfscan® SP5XP unpatterned wafer inspector, and eDR7280™ e-beam review and classification tool form wafer inspection solution that enables discovery and control of yield-critical defects at all stages of IC...

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Wetting Tester simulates SMT mounting and reflow processes.
Simulators

Wetting Tester simulates SMT mounting and reflow processes.

Malcom SP-2 helps test wettability of solder paste and components while simulating SMT mounting and reflow process. By simulating actual temperature that solder paste undergoes during preheat and reflow, instrument lets user identify deficiencies in flux activity or component wettability. Simulation of SMT mounting and reflow process with standard variable enables development of accurate,...

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Universal Process / Temperature Controllers

Rudolph Receives Multi-System Order for over $11 Million from a Leading OSAT for Fan-out Wafer Level Packing Inspection

Rudolph Inspection, Metrology and Analysis selected for large-scale ramp of Fan-out Wafer Level Package Production (FOWLP). Wilmington, Mass. — Rudolph Technologies, Inc. (NYSE: RTEC), a leader in the design, development, manufacture and support of defect inspection, lithography, metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide,...

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X-Ray Scanners

OSI Systems Receives Orders for $9 Million for Security Inspection Systems

HAWTHORNE, Calif. - OSI Systems, Inc. (NASDAQ: OSIS) today announced that its Security division, Rapiscan Systems, received two orders from an international customer totaling approximately $9 million for multiple units of Eagle-® Cargo and Vehicle Inspection (CVI) systems; 600 series Baggage and Parcel Inspection (BPI) systems; Metor people screening systems; and related services and support....

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Universal Process / Temperature Controllers

Rudolph Receives Multi-System Order for over $11 Million from a Leading OSAT for Fan-out Wafer Level Packing Inspection

Rudolph Inspection, Metrology and Analysis selected for large-scale ramp of Fan-out Wafer Level Package Production (FOWLP). Wilmington, Mass. — Rudolph Technologies, Inc. (NYSE: RTEC), a leader in the design, development, manufacture and support of defect inspection, lithography, metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide,...

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