Encapsulants

Miscellaneous Compounds

Flame Retardant Potting Compound stays flexible in cold temps.

Designed to meet UL 94 V-0 flammability standard, 20-2362 FR remains soft in very low temperatures down to -72°C. Polyurethane potting and encapsulating compound is suited for cushioning and protecting sensitive electronic components since it provides vibration resistance and does not stress components. Compliant with REACH and RoHS, product is also moisture-resistant and will not damage...

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Encapsulants

When Electronic Assemblies Need to Perform at Low Temperatures and Self-Extinguish... Rely on 50-2185 FR

The recently developed 50-2185 FR has a unique combination of properties. This urethane potting compound provides a low glass transition temperature, low durometer, high thermal conductivity, and flame retardancy. The 50-2185 FR offers excellent heat transfer, low exotherm and excellent electrical insulating properties. This unique urethane system is an ideal material for the potting of...

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Encapsulation Equipment

Does Weight Matter?

Epoxies, Etc. Develops Low Density Epoxy... 20-3035 Epoxy Syntactic Foam System The weight of 20-3035 is less than half of most commercially available potting and encapsulating compounds. This epoxy syntactic foam system utilizes technologically advanced micro balloons. This provides for a low density, low coefficient of thermal expansions, low shrinkage, and a stiff finished product. This unique...

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Encapsulants

DuPont Photovoltaic Encapsulants and Bürkle Collaborate for Faster Encapsulation, Helping Ypsator® Double Module Output vs. Other Laminators

DuPont(TM) PV5400 Series Encapsulant Helps Bürkle's Latest 3-Step PV Laminator Increase Lamination Output without Expanding Factory Space WILMINGTON, Del. - DuPont Photovoltaic Encapsulants and Bürkle North America, Inc., a wholly-owned division of Bürkle GmbH, of Freudenstadt, Germany, announce that they have worked together to speed up module lamination with the Bürkle Ypsator®...

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Encapsulants

Solutia Launches New Vistasolar® EVA Encapsulant in Europe

DIETENHEIM, Germany - Solutia Inc. (NYSE: SOA) announced today the launch of their new Vistasolar® 488 ethylene vinyl acetate (EVA) encapsulant for solar module manufacturers based in Europe, Middle East, and Africa. This new formulation is designed to help module manufacturers lower the cost of manufacturing by improving production throughput and product yields. Solutia, the market leader for...

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Miscellaneous Compounds

Ellsworth Adhesives Offers Devcon Flame Retardant Products

GERMANTOWN, WI - May, 2011 - Ellsworth Adhesives, a leading global distributor of adhesive products and equipment, now offers Devcon Flame Retardant products including Devcon 5 Minute I-FR and Devcon 10 Minute Epoxy I-FR. Devcon Flame Retardant products are ideal for applications requiring a self-extinguishing structural system. The products are recommended for potting inserts and edge sealing...

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Epoxy Potting Compound meets NASA's outgassing requirements.
Miscellaneous Compounds

Epoxy Potting Compound meets NASA's outgassing requirements.

Suited for casting, potting, and encapsulating, 20-3652 adheres to metals, ceramics, and plastics. Dielectric grade epoxy features Shore D hardness of 88, tensile strength of 9,000 psi, flexural strength of 15,000 psi, and operating temperature range of -65 to +160°C. When cured with Catalyst No. 190 and Catalyst No. 105, resin system meets NASA's outgassing requirements.

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Epoxy Potting Compound suits applications up to 365°F.
Encapsulation Equipment

Epoxy Potting Compound suits applications up to 365°F.

Intended for potting and encapsulating in electrical and electronic applications, Aremco-Bond(TM) 2315 provides flexural strength of 12,300 psi, volume resistivity of 1.0 x 1015, and dielectric strength of 480 V/mil. Black-pigmented, thermally conductive product offers resistance to acids, alkalis, organic fluids, and salts. Featuring mixed ratio of 100 parts resin to 25 parts hardener by weight,...

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Encapsulants

Fast-Fixturing Bonding and Potting Products Speed Solar Junction Box Fabrication

Rapid Cure Silicones Virtually Eliminate Work-in-Process Rocky Hill, Conn. - To speed solar panel assembly and eliminate the need for racked parts, Henkel Corporation has introduced new fast-fixturing silicone adhesives and potting compounds for use on PV junction box assemblies. Developing fixture strength in just 2 to 3 minutes and handling strength in less than 20 minutes, UL 94-listed...

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Flexible Epoxy withstands cryogenic conditions.
Encapsulation Equipment

Flexible Epoxy withstands cryogenic conditions.

Serviceable over wide range of 4 K to 250°F, Polymer System EP37-3FLF cures at room temperature in 2-3 days or faster at elevated temperatures. Optically clear, 2-component epoxy offers non-critical 1:1 mix ratio and low mixed viscosity of 1,400-1,500 cps. With bond shear strength exceeding 2,000 psi and T-peel strength of 25 pli, flexible epoxy bonds to metals, glass, ceramics, rubber, and...

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