Encapsulants

Not Your Typical Flame Retardant
Miscellaneous Compounds

Not Your Typical Flame Retardant

CRANSTON, RI USA – You’ll Wish Every Thermally Conductive Compound Was This Easy To Use... But you won't have to... because 50-3152FR has everything you look for in a Thermally Conductive Potting Compound.Â- Ã‚  Aside from offering fast heat dissipation and stability during thermal cycling, 50-3152FR has some exceptional properties that make it stand out from the rest.  The...

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Electrolube Launch Electronics Protection Solutions in India
Resins

Electrolube Launch Electronics Protection Solutions in India

Protection of electronics is a large design concern, particularly if electronic equipment is to be deployed in aggressive environments or demanding climatic conditions. Electrolube, the solutions provider of electro-chemicals, will launch a range of complete protection solutions for electronics manufacturers in India this month following a surge in demand for the company's thermal management...

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Cost Effective Protection for Submersible Components - Urethane Elastomer Series for Underwater and Extreme Weather Applications
Encapsulants

Cost Effective Protection for Submersible Components - Urethane Elastomer Series for Underwater and Extreme Weather Applications

The 20-2330 Series of low durometer urethanes, ranging from Shore A 30 to Shore A 90, is perfect for protecting electronic and other components in extreme conditions.Â-  This Series has outstanding resistance to water, good chemical resistance, and provides great electrical insulation.  The products maintain their flexibility over a broad temperature range (from -40° to...

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Encapsulants

Epoxy Potting Compound provides chemical resistance.

Stable from -55 to 200°CÂ- for potting applications, EPOXICAST EC-1027E withstands thermal cycling and thermal shock, and does not shrink, crack, or delaminate under extreme conditions. Product also provides resistance to ammonia related electrical shorting of encapsulated sensors. Two-part, heat cure only compound comes in various sizes ranging from pint kits to 5-gallon kits.

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Miscellaneous Compounds

Thermally Conductive Two Component Silicone Meets UL 94V-0 Specification for Flame Retardancy

In addition to typical silicone properties such as flexibility and high temperature resistance, Master Bond MasterSil 156 passes the rigorous UL 94V-0 tests for flame retardancy. This two part silicone system is addition cured and does not require exposure to air for complete cross-linking. It has a convenient one to one mix ratio by weight and will not outgas while curing. Formulated for...

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Low Viscosity, Two Component Epoxy Has an Extended Working Life and Low Exotherm
Encapsulation Equipment

Low Viscosity, Two Component Epoxy Has an Extended Working Life and Low Exotherm

Suitable for large castings, Master Bond EP21LVSP6 combines a low viscosity and low exotherm with a working life of 3-5 hours. It can also be used for bonding, sealing and coating applications in aerospace, electronic, electrical, optical and other specialty industries. This two part epoxy offers has a non-critical one to one mix ratio, by weight or volume and its processing is facilitated with...

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High-Temperature Compound encapsulates electrical components.
Encapsulants

High-Temperature Compound encapsulates electrical components.

Ceramacast™ 576N large-grain, alumina-filled, ceramic compound exhibits temperature resistance to 3000°F, dielectric strength of 150 V/mil, and compressive strength of 10,200 psi. Resistant to moisture and chemicals, compound is supplied in powder form and mixed inÂ- ratio of 100 parts powder to 12–14 parts water by weight. It sets in 16 hr at room temperature or 1–2 hr at...

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Chip Encapsulants reach full cure in shadowed areas.
Encapsulants

Chip Encapsulants reach full cure in shadowed areas.

Designed withÂ- UV/Vis light and secondary ambient moisture-cure system, Dual-Cure 9101, 9102, and 9103 are suited for encapsulation applications where shadowed areas are present. Materials are tack free after UV cure, and 2-day moisture cure further shortens time for handling as well as final testing and assembly. With varying viscosities of 7,000, 17,000, and 25,000 cP, products are jet...

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Encapsulant/Adhesive suits printer head, circuit assembly jobs.
Electric Wire

Encapsulant/Adhesive suits printer head, circuit assembly jobs.

Exhibiting fracture toughness asÂ- well as chemical resistance to inks, 357-284 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive is designed to protect wire bonds and reduce stresses associated with thermal cycling. Product adheres to flexible circuits, FR4, and metal substrates and meets circuit assembly and semiconductor standards for ionic cleanliness (extractable ions) to...

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Encapsulants

WACKER Presents New Silicone Grades for Electronic and Medical-Technology Applications

Munich – PLASTIC Japan will see WACKER, a Munich-based chemical company, and Japanese silicone manufacturer Wacker Asahikasei Silicone unveiling innovative silicone products for the electronics, optoelectronics and medical-technology sectors. Among the products celebrating their premieres will be SEMICOSIL® 915 HT, a heat-resistant gel for encapsulating power electronic modules;...

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