New Encapsulants Products

Epoxy Compound features one to one mixing ratio.

Type 20-3650 electronic grade epoxy potting, casting, and encapsulating system exhibits excellent physical, thermal, and electrical insulation properties. Tensile strength is 11,000 psi and compressive strength is 15,500 psi. Compound is DOT non-hazardous, easy to mix, and will cure at room temperature or with mild heat. Operating temperature range is -60 to +150Ã-

Encapsulating Resin can cure with several agents.

Electronic grade, casting, potting, and encapsulating epoxy resin system No. 20-365140 adheres to metals, ceramics, and plastics. Physical properties include mixed viscosity of 32,500 cps at 25Ã-

Plastics Adhesive cures with heat or visible/UV light.

OPTOCAST AC-3801 one-component electronic grade, acrylate based formulation is room temperature stable and free radically initiated. Adhesive/sealant/encapsulant will adhere to polymeric and ceramic substrates when polymerized to flexible solid upon exposure to heat or UV and/or visible light in 320-520 nm range. Cured adhesive offers Shore D hardness of 40 to 45 and temperature range of -40 to...

Conductive Adhesives may replace soldering.

Syon(R) Tru-Bond(R) 206A, 214, 215, and Tru-Cast(R) III electrically conductive adhesives and potting compounds can be used to form conductive paths in applications where hot soldering would be impractical. They also provide thermal conductivity and can be used to bond or seal components or wiring in applications requiring heat dissipation. Low-shrink and nonshrink epoxy and epoxide formulations...

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Adhesive/Sealant bonds and encapsulates.

MNRC 04-1347 UV light curing resin is based on aliphatic urethane acrylate monomer blend. At 1 mil thickness, it cures in 10 to 15 seconds with UV light. Transparent liquid is suitable for clear bonds or encapsulation. It bonds to metal, ceramic, glass, and many plastics. MNRC 04-1347 is thixotropic at 25 deg C, and cures to 40-50 Shore A with elongation of 150%. Operating temperature range is...

Encapsulating Elastomers offer hydrolytic stability.

Two-component urethane series encapsulants have durometers from 25 to 55 Shore A. Unfilled materials maintain integrity over operating temperature range of -40 deg to 125 deg C. Glass transition temperature of -72 deg C makes them suitable for low temperature potting applications. They offer electrical insulation, thermal cycling stability, chemical resistance, and no shrinkage. Mixed viscosities...

Epoxy has longer pot life than anhydride-cured systems.

TRA-BOND 933-1 one-part, filled chip encapsulant provides moisture resistance and electrical insulation. Coefficient of thermal expansion minimizes stress effects on components and wiring during thermal shock tests.

Encapsulant/Potting Material exhibits

Ceramacast(TM) 510 aluminum oxide based, hydraulic-setting ceramic compound potting material can be used to encapsulate cartridge heaters and embed high temperature components to 3200Ã-ºF. Supplied as dry powder, Ceramacast 510 is bonded using calcium aluminate and as-cast. Its dried density is 180 lbs/ft3, and it exhibits exceptional thermal conductivity and dielectric strength of 75-100...

Moisture Resistant Encapsulant has smooth consistency.

Tra-Bond 933-1.5 electrically insulating epoxy encapsulant is formulated to provide smooth crowns over devices of wire bonds. Encapsulant provides protection from thermal and mechanical shock. Compound is stable at room temperature for up to three months, but is best kept stored at -40Ã-

Liquid Epoxy Encapsulant provides fast capillary flow.

HysolÃ-® FP4549FC package level underfill is designed to offer excellent adhesion to flip-chip assemblies containing no-clean flux residues. Qualified to perform in 260Ã-