Encapsulants

Dimensionally Stable Epoxy Based UV Curable System with High Temperature Resistance
Encapsulants

Dimensionally Stable Epoxy Based UV Curable System with High Temperature Resistance

Cures Completely Tack-Free Without Requiring UV Light HACKENSACK, NJ - Master Bond LED401 is a breakthrough system based on LED technology. This adhesive, sealant, coating and encapsulant cures tack-free upon exposure to a 405 nm wavelength light source, without any oxygen inhibition. Optically clear, it is also safer and easier to handle than similar UV systems as LED lights emit substantially...

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Thermally Conductive Silicone protects electronics.
Encapsulants

Thermally Conductive Silicone protects electronics.

With 1:1 mix ratio, flexible 50-1952 cushions electronics from vibration and impact, and is specially formulated for quick thermal transfer away from heat generating electronic devices. Non-corrosive silicone potting and encapsulating compound is made without use of harsh solvents or other toxic materials and is not hazardous to ship. Operating from -65 to +235°C, low-exotherm...

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Overmolding Printed Circuit Board Assemblies (PCBA's)
Circuit Board Assembly Services

Overmolding Printed Circuit Board Assemblies (PCBA's)

Printed circuit boards Assemblies (PCBA's) have been around since the early 1900's and have become common place in most electronic devices used today. PCBA's are designed and used in a wide array of applications because of their size and ability to work with peripheral devices. Since PCBA's are so functional and dynamic they are integrated into many custom and unique assemblies. Given that PCBA's...

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Silicone Compound is designed for potting and encapsulating.
Miscellaneous Compounds

Silicone Compound is designed for potting and encapsulating.

Free of any flammable or toxic solvents, 2-partÂ- 50-1225 has -65 to +210°C service temperature, will cure in deep sections, and will not support or promote flame. Compound is designed for electronic packages that require flow around components, thermal conductivity, and ability to sustain environmental extremes. While material flexibility will cushion electronics through aging and...

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Thermally Conductive Epoxy suits bonding applications to 400°F.
Encapsulants

Thermally Conductive Epoxy suits bonding applications to 400°F.

Mixed in ratio of 1 part base resin to 1 part activator by weight, Aremco-Bond™ 860 exhibits optimal adhesion to high temperature plastics such as polyimides and composites, as well as ceramics, glass, and high expansion metals. Aluminum nitride filled epoxy curesÂ- in 24 hr at room temperature or in 2 hr at 200°F. After curing, product exhibits thermal conductivity of 8.5...

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Electrolube Launch New Polyester and Silicone Resins at SMTA International
Resins

Electrolube Launch New Polyester and Silicone Resins at SMTA International

Electrolube, the global manufacturer at the forefront of chemicals technology for the electronics, automotive and industrial manufacturing industries, will launch an innovative clear polyester resin and showcase the company's newest silicone and "green" aerosol products at SMTA International in Florida, booth 637. The conference and exhibition will take place from the 14-18 October at the Walt...

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Encapsulants

United Resin Introduces Halogen Free Systems!

Royal Oak, Michigan - November 9, 2012- United Resin Corporation is pleased to introduce new Halogen free systems. Designed to be in compliance with IEC-61249-21 concerning the limitation of certain amounts of chlorine, bromine, and halogens. The COB systems are Epoxy Dam Control, Epoxy Fill System, Low and High Profile Glop Tops and Low Chlorine Encapsulant. The SMT system is Cicuitbond. All...

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Electrolube Showcase Silicone Resin and Demonstrate 2 Part Material Dispensing at Electronex
Resins

Electrolube Showcase Silicone Resin and Demonstrate 2 Part Material Dispensing at Electronex

Electrolube, the global chemicals manufacturer for the electronics, automotive and industrial manufacturing industries, will showcase the company's fastest selling silicone resin, developed for the LED industry, at Electronex on the 12-13th September at the Australian Technology Park in Sydney. There will also be a demonstration using an air-driven dispensing system to show how 2 part materials...

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Resins

Potting Compound is quick, convenient and easy to use.

Used for potting and encapsulating, 20-2028 lightweight (11 lb/ftÂ-³) closed cell liquid urethane foaming resin system has 1:1 mix ratio and 10 min demolding time. This potting foam does not utilize MOCA or TDI, promoting safe use, while low density facilitates repairs if mistakes are made first time around. Resistant to chemical solvents, moisture, thermal shock, and impact, product is...

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Electrolube Showcases New Silicone Resins, Conformal Coatings, and Non-Silicone Thermal Products at NEPCON South China
Resins

Electrolube Showcases New Silicone Resins, Conformal Coatings, and Non-Silicone Thermal Products at NEPCON South China

Electrolube, the global manufacturer at the forefront of chemicals technology for the electronics, automotive and industrial manufacturing industries, will showcase its newest SC Silicone range and non-silicone thermal products to the Chinese market at NEPCON South China 2012, taking place between the 28th to the 30th August at the Shenzhen Convention & Exhibition Centre. The new SC range of...

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