Potting Compound may be used in applications to 2,800-
Used to pot heaters and thermocouples as well as cast parts, Ceramacast(TM) 584 is supplied as kit comprised of 584-P Powder and 584-L Liquid Binder. Magnesium oxide-based, silica-bonded ceramic compound exhibits 100 V/mil dielectric strength and 109 Ω-cm volume resistivity. With 4,500 psi compressive strength and 6.5 ppm/Ã-
Read More »High-Temperature Epoxy cures at room temperature.
Suited for potting, encapsulation, sealing, and bonding, Polymer System EP39MHT exhibits electrical insulation and chemical inertness for service up to 450Ã-
Read More »Flame Retardant Compounds suit encapsulating and potting.
Non-shrinking castable liquid, Cable Cast FR urethane encapsulates, insulates, and provides strain relief for electrical connectors and cables. Because it forms flexible jacket with abrasion, tear, and puncture resistance, it can also repair power cable jackets and insulation. Intended for potting aerospace inserts, clear-drying 5 MinuteÃ-® Epoxy FR adhesive/encapsulant paste fills gaps and...
Read More »Epoxy Potting Compound has mixed viscosity of 6,700 cp.
Targeted for electronic assembly manufacturers, 2-part 20-3063 epoxy potting and encapsulating compound has 1:1 mix ratio with resin pigmented black and catalyst white for visual indication that products have been properly mixed. It cures at room temperature to 75-80 Shore D hardness, has 45 min pot life, usable temperature range of -40 to 130Ã-
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Read More »Compound suits potting and encapsulation applications.
Two-component Master Bond EP30DP epoxy/urethane elastomer can be cast in thick cross sections without development of undue exotherm during cure. With service operating temperature of -80 to +250Ã-
Read More »Silicones suit deep potting and sealing applications.
One-part LoctiteÃ-® Nuva-SilÃ-® Silicones cure tack-free in seconds to depth of 2 in. upon exposure to UV or high-power visible light. Translucent in appearance, products offer weather, temperature, and moisture resistance, and will not degrade or yellow on long-term exposure to light. All offer built-in fluorescence detection system that allows automatic quality inspection. These...
Read More »Silicon-Based Materials suit optical interconnect applications.
Optical Coupling Gel, OE-4000 consists of 2-part, high-purity, transparent silicone gel used for refractive index matching for silica-to-fiber and other optical junctions. One-part transparent silicone elastomer, OE-4100 provides refractive index shifting potential for planar silica-on-silicon optical components. Two-part Photonic-Grade Encapsulant OE-4200 consists of soft silicone elastomer for...
Read More »Epoxy Potting Compound provides electrical insulation.
Two-component EP121AO-1 offers thermal conductivity as well as thermal and dimensional stability. It features chemical resistance even when exposed to adverse environmental conditions. Service operating temperature is 475-500Ã-
Read More »UV-Cure Encapsulants cure within 26-46 sec.
Hysol 3323, 3327, and 3329 are dam-and-fill products for encapsulation of wire-bonded dies used in Smart Card ICs. Used to form dam, high-viscosity Hysol 3323 has thixotropic nature and glass transition temperature (Tg) of 155Ã-
Read More »Thermal Encapsulant is intended for electronic power devices.
Combined with pre-qualified, turnkey dispensing process, DOW CORNINGÃ-® SE 4451 is designed to meet heat-management needs of electronic power devices. It exhibits thermal conductivity of 3W/mk @ 25Ã-
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