Encapsulants

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YINCAE President, Dr. Wusheng Yin, Presents: "The Future of Solder Joint Encapsulation" IPC Tech Summit 2014 in Raleigh, NC

Albany, NYÂ- – Dr. Wusheng Yin, President of YINCAE Advanced Materials LLC, will be presenting in the Technical Session on The Future of Solder Joint Encapsulation" at the upcoming IPC Tech Summit, with the event being held from Oct 28th to 30th in Raleigh, NC. Following is the Abstract taken from the paper on "The Future of Solder Joint Encapsulation" "Solder joint encapsulant adhesives...

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Polyurethane Potting Compound is environmentally friendly.
Miscellaneous Compounds

Polyurethane Potting Compound is environmentally friendly.

Intended for electronic applications with low toxicity requirements, 20-2121 Polyurethane is made from natural oil polyol, meets FDA food contact requirements, and does not contain TDI, MbOCA, or Mercury. Plant-based potting, casting, and encapsulating compound, exhibiting minimal shrinkage or exotherm, offers elastomeric properties that limit stress on electronics. Tensile strength is 2,000...

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Encapsulants

Dow Corning Spotlights Silicone Solutions for LED Lighting Design, Assembly and Protection at Two Key European Lighting Exhibitions

Company sees accelerating demand for next-generation silicones to support application development and expanding production among global customers. Seneffe, Belgium – As the adoption and production of LED illumination rapidly accelerates, lighting manufacturers worldwide are seeking new and innovative materials to push LED design boundaries, improve product reliability and help optimize...

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Encapsulants

Solder Joint Encapsulant for Ball Bumping Applications: BP 256

Albany, NYÂ- – YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant. YINCAE's BP 256 is for BGA, CSP, Flip Chip, POP, and other ball bumping applications. The BP 256 can enhance solder joint reliability and eliminate solder joint cracking in microchip applications,...

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Electrolube Encapsulation Resin Meets Tough Specifications for Wind Turbine Electrical Installation
Miscellaneous Compounds

Electrolube Encapsulation Resin Meets Tough Specifications for Wind Turbine Electrical Installation

Wind turbines present some of the most challenging environments for electrical and electronic installations. Often subject to extremely high humidity levels, high temperatures and vibration, these installations require specialised protection measures above and beyond what would normally be needed under less aggressive conditions. This was the case recently, when Electrolube was approached by a...

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Potting Compound encapsulates high-temp resistance heaters.
Encapsulants

Potting Compound encapsulates high-temp resistance heaters.

Consisting of hydraulic-setting, phosphate-bonded, zirconium oxide filled ceramic compound, Ceramacast™ 646N is suitable for encapsulating and potting high temperature electrical components such as resistance heaters, hot gas igniters, thermocouples, and strain gauges used in applications to 3,000°F. Cured material demonstrates shrinkage rate of less than 1%, volume resistivity of 109...

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Encapsulants

Henkel Expands Line of Loctite® LED-Compatible Adhesives

Bonding, Sealing, Potting and Threadlocking Products Meet Challenging Chemical Compatibility Standards Rocky Hill, Conn. -- Henkel has expanded its comprehensive offering of LED-compatible Loctite® adhesives, sealants, potting materials and threadlockers. The LED-compatible line now includes 38 products that improve the reliability and help lower the manufacturing costs of these lighting...

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Styrenic TPE Materials suit automotive window encapsulation.
Encapsulants

Styrenic TPE Materials suit automotive window encapsulation.

Based on styrene block copolymer (SBC) chemistry, Sarlink® ME-2600 Series comprises 55, 65, and 75 Shore A styrenic thermoplastic elastomer (TPE-S) injection molding compounds with specific gravities of 0.93–0.94. Products suit window encapsulation applications for automotive manufacturers and help conserve weight to meet emissions and fuel-efficiency standards. Properties maximize flow,...

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Streamline Your Smart Connected Device Assembly Process with UV-Curable Materials
Encapsulants

Streamline Your Smart Connected Device Assembly Process with UV-Curable Materials

From conformal coatings to encapsulants to edgebond materials and display lamination, Dymax Corporation provides innovative, solvent-free, UV light-curing technology solutions for smart connected device assembly. The company offers many cost-reducing solutions that turn problems like shadowed areas, cure confirmation, and production throughput into non-issues.Â-  The newly released selector...

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Optically Clear, Condensation Curing Silicone Offers Superior Dielectric Properties
Encapsulants

Optically Clear, Condensation Curing Silicone Offers Superior Dielectric Properties

Developed for potting and encapsulation applications where an addition cured silicone cannot be used, Master Bond MasterSil 152 is a two component, condensation curing system that only requires air for complete cross-linking. Unlike addition cured systems, there are no substrates that will inhibit the cure. This system fully cures at room temperature in 24-48 hours and has low exotherm. MasterSil...

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Gorbel Introduces New Mobile Fall Protection Unit
Sponsored

Gorbel Introduces New Mobile Fall Protection Unit

Providing adequate fall protection is always a critical consideration and one that in many cases can be difficult to ensure. The new Mobile Fall Protection Unit is designed to facilitate positive fall protection in applications that would typically be difficult or impossible to provide with standard methods. To learn all about the advantages and convenience, see our video.

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