Encapsulants

New 20-3035 Syntactic Epoxies are Resistant to Thermal and Mechanical Shock
Encapsulants

New 20-3035 Syntactic Epoxies are Resistant to Thermal and Mechanical Shock

The 20-3035 Syntactic Epoxy is offered in ready-to-use FreezeBond® premixed and frozen syringe. The product is made by incorporating hollow glass microspheres into a proprietary resin blend. The epoxy is designed for various curing agents for creating thermally insulative and lightweight casting. This compound exhibits low dielectric constant, low shrinkage on cure, low moisture absorption,...

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Electrolube UR5641 Flame Retardant Polyurethane Resin is halogen free.
Resins

Electrolube UR5641 Flame Retardant Polyurethane Resin is halogen free.

Protecting LED luminaires exposed to hazardous atmospheres, Electrolube UR5641 encapsulation resin is flame retardant and optically clear when cured. Resin is based upon aliphatic urethane chemistry, which resists yellowing effects of natural light. RoHS-2 compliant and boasting of cure time within 24 hours at 23°C or 4 hours at 60°C, UR5641 offers high dielectric strength at 11 kV/mm, thermal...

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Encapsulants

SMT 158HA Liquid Encapsulant offers a CTE of 20 ppm/K.

Designed for large component with small bumps, SMT 158HA Liquid Encapsulant offers 156°C glass transition temperature and high adhesion strength. Unit’s high viscosity allows air to escape from gaps in underfilling processes. SMT 158HA provides conditions to enable void free underfill and enable the devices to exhibiting lower thermal stress.

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Encapsulants

Silicone Potting Compound features lightweight formulation.

Utilizing advanced micro balloon technology fillers, 20-1634 Light Weight Silicone Potting Compound features specific gravity of 0.82, making it suited for applications that require low weight, flexibility, high heat resistance, and optimized electrical insulation properties. Two-component silicon elastomer features Shore A hardness of 34 and tensile strength of 125 psi. Formulated without...

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Encapsulants

UL 94 V-0 Potting/Encapsulating Compounds suit harsh environments.

Epoxy and urethane products that meet engineering design demands of electronic and aerospace assemblies include 20-2362 FR low-durometer, low-viscosity urethane as well as 50-2369 FR thermally conductive and thermal shock-resistant urethane. Suited for similar applications, 50-3150 FR thermally conductive epoxy can provide an RTI rating of 130°C with Cat 30, while 50-3152 FR thermally...

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Polyurethane Potting Compound cures in 1 hour.
Encapsulants

Polyurethane Potting Compound cures in 1 hour.

Designed to cure within 1 hour at room temperature, 20-2183 features 2:1 mix ratio and low viscosity that makes it suitable for use in cable assemblies, potting electronics, molding parts, and encapsulating electronic components. Tough elastomeric material helps assemblies withstand thermal cycling, offers vibration resistance, and imparts low stress on electronic components during cure....

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Hot Melt Encapsulant offers thermal conductivity.
Encapsulants

Hot Melt Encapsulant offers thermal conductivity.

With ability to transfer heat through encapsulating layer, Thermally Conductive Technomelt® offers dual-function performance in single material solution. Product can be melted, molded, and cooled under low pressure, delivering encapsulation technique that protects delicate circuitry and PCB assemblies, while forming self-enclosed housing and enabling heat dissipation. Offering thermal...

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Epoxy Potting Compound resists thermal shock and cycling.
Encapsulation Equipment

Epoxy Potting Compound resists thermal shock and cycling.

PassingÂ- Navy Hex Bar Test, MIL-I-16923C, which consists of 10 cycles from -55 to +155°C, two-part epoxy resin 20-3301 protects electronic assemblies from thermal cycling and shock. Low viscosity epoxy flows quickly around components, giving users working time of 4–6 hr. Product is typically cured at 80°C for 1–2 hr, but post cure of 150°C for 3 hr will optimize...

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