Encapsulants

New Potting Compound is UV 94V-0 Rated
Encapsulants

New Potting Compound is UV 94V-0 Rated

Features easy air release, excellent mechanical, thermal and shock resistance properties. Offers thermally conductive, room-temperature curing, and low shrinkage. Cured properties include shore hardness >65A, dielectric strength 650 VTM and thermal conductivity of 1.75 W/mK.

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New Encapsulant with Improved Moisture and Thermal Resistance
Encapsulants

New Encapsulant with Improved Moisture and Thermal Resistance

Multi-Cure® 9037-F cures in seconds upon exposure to UV/visible light and has secondary heat cure for shadow areas caused by high-profile components on printed circuit boards. Material features improved flexibility and resiliency for a variety of glob-top, chip-on-board, chip-on-flex, chip-on-glass and wire-tacking/bonding applications. Ideal for use as a corrosion guard for wire-bond...

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New 20-3035 Syntactic Epoxies are Resistant to Thermal and Mechanical Shock
Encapsulants

New 20-3035 Syntactic Epoxies are Resistant to Thermal and Mechanical Shock

The 20-3035 Syntactic Epoxy is offered in ready-to-use FreezeBond® premixed and frozen syringe. The product is made by incorporating hollow glass microspheres into a proprietary resin blend. The epoxy is designed for various curing agents for creating thermally insulative and lightweight casting. This compound exhibits low dielectric constant, low shrinkage on cure, low moisture absorption,...

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Electrolube UR5641 Flame Retardant Polyurethane Resin is halogen free.
Resins

Electrolube UR5641 Flame Retardant Polyurethane Resin is halogen free.

Protecting LED luminaires exposed to hazardous atmospheres, Electrolube UR5641 encapsulation resin is flame retardant and optically clear when cured. Resin is based upon aliphatic urethane chemistry, which resists yellowing effects of natural light. RoHS-2 compliant and boasting of cure time within 24 hours at 23°C or 4 hours at 60°C, UR5641 offers high dielectric strength at 11 kV/mm, thermal...

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Encapsulants

SMT 158HA Liquid Encapsulant offers a CTE of 20 ppm/K.

Designed for large component with small bumps, SMT 158HA Liquid Encapsulant offers 156°C glass transition temperature and high adhesion strength. Unit’s high viscosity allows air to escape from gaps in underfilling processes. SMT 158HA provides conditions to enable void free underfill and enable the devices to exhibiting lower thermal stress.

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Encapsulants

Silicone Potting Compound features lightweight formulation.

Utilizing advanced micro balloon technology fillers, 20-1634 Light Weight Silicone Potting Compound features specific gravity of 0.82, making it suited for applications that require low weight, flexibility, high heat resistance, and optimized electrical insulation properties. Two-component silicon elastomer features Shore A hardness of 34 and tensile strength of 125 psi. Formulated without...

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Encapsulants

UL 94 V-0 Potting/Encapsulating Compounds suit harsh environments.

Epoxy and urethane products that meet engineering design demands of electronic and aerospace assemblies include 20-2362 FR low-durometer, low-viscosity urethane as well as 50-2369 FR thermally conductive and thermal shock-resistant urethane. Suited for similar applications, 50-3150 FR thermally conductive epoxy can provide an RTI rating of 130°C with Cat 30, while 50-3152 FR thermally...

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3Sixty Mission Critical Launches New Service Offering UPS as a Service As A Cost Effective Alternative to UPS Equipment Ownership
Sponsored

3Sixty Mission Critical Launches New Service Offering UPS as a Service As A Cost Effective Alternative to UPS Equipment Ownership

At 3Sixty Mission Critical, we specialize in maintaining the performance and uptime of our customer's mission-critical applications. Our services are comprehensive and designed to take on the entire burden of maintenance. Our "UPS as a service" is just another example of how we develop out of the box solutions to help our customers operate more efficiently; see our video to earn more.

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