Encapsulants

Polyurethane Potting Compound cures in 1 hour.
Encapsulants

Polyurethane Potting Compound cures in 1 hour.

Designed to cure within 1 hour at room temperature, 20-2183 features 2:1 mix ratio and low viscosity that makes it suitable for use in cable assemblies, potting electronics, molding parts, and encapsulating electronic components. Tough elastomeric material helps assemblies withstand thermal cycling, offers vibration resistance, and imparts low stress on electronic components during cure....

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Hot Melt Encapsulant offers thermal conductivity.
Encapsulants

Hot Melt Encapsulant offers thermal conductivity.

With ability to transfer heat through encapsulating layer, Thermally Conductive Technomelt® offers dual-function performance in single material solution. Product can be melted, molded, and cooled under low pressure, delivering encapsulation technique that protects delicate circuitry and PCB assemblies, while forming self-enclosed housing and enabling heat dissipation. Offering thermal...

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Epoxy Potting Compound resists thermal shock and cycling.
Encapsulation Equipment

Epoxy Potting Compound resists thermal shock and cycling.

PassingÂ- Navy Hex Bar Test, MIL-I-16923C, which consists of 10 cycles from -55 to +155°C, two-part epoxy resin 20-3301 protects electronic assemblies from thermal cycling and shock. Low viscosity epoxy flows quickly around components, giving users working time of 4–6 hr. Product is typically cured at 80°C for 1–2 hr, but post cure of 150°C for 3 hr will optimize...

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Encapsulants

YINCAE Advanced Materials Wins Global Technology Award at Productronica for World's First Solder Joint Encapsulant

Albany, NY – YINCAE Advanced Materials, LLC is proud to announce that our company was awarded the 2015 Global Technology Award in the adhesives, coatings, and encapsulants category! This ceremony took place on Tuesday, November 10th at the Productronica Global Exhibition in Munich, Germany. YINCAE Solder Joint Encapsulant was recognized as one of the products that made the greatest impact on...

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Electrolube Encapsulation Resin Provides Full Protection for Automotive Sensor
Resins

Electrolube Encapsulation Resin Provides Full Protection for Automotive Sensor

Thermal cycling tests involving Electrolube's ER1455 chemically resistant, two-part epoxy resin have proved the material's ability to protect and retain an automotive sensor subject to highly aggressive environmental conditions. Electrolube recently helped one of its customers, a prominent manufacturer of control units and sensor devices, to overcome an issue with one particular sensor...

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UV Cure Adhesive suits circuit assembly applications.
Encapsulants

UV Cure Adhesive suits circuit assembly applications.

Designed to cure rapidly when exposed to high-intensity UV light, 535-11M-7 Epoxy is suitable for lens bonding in camera modules, chip encapsulation in smart cards, and variety of general bonding applications in photonics assembly. Flexible, high-strength epoxy adhesive is non-conductive, low-outgassing, and does not contain antimony.

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Epoxy Potting Compound resists high temperatures.
Encapsulation Equipment

Epoxy Potting Compound resists high temperatures.

With 130°C relative temperature index rating, 50-3150RFR Black Epoxy with Catalyst 30 will survive elevated temperatures for long periods of time, which offers benefits as electronics get smaller and hotter. Compound is UL 746B listed and formulated to meet stringent non-burning requirements of UL 94 V-0. Typical applications include encapsulating power supplies, transformers, coils,...

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Epoxy Potting Compound suits applications to 365°F.
Miscellaneous Compounds

Epoxy Potting Compound suits applications to 365°F.

Offering thermal conductivity, electrical insulation, and low shrinkage after cure, Aremco-Bond™ 2315 is suited for potting and encapsulating densely packaged power supplies, rectifiers, ICs, oscillators, DACs, amplifiers, and relays. Black-pigmented product provides flexural strength of 12,300 psi and dielectric strength of 480 V/mil. Mixed in ratio of 100 parts resin to 25 parts hardener by...

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Encapsulants

Advanced Materials Pioneer, Inkron, Emerges from Stealth with Two Next Generation LED Product Lines

HELSINKI and LAS VEGAS –Â- Strategies in Light - Inkron Oy, a leading manufacturer of advanced materials for the lighting, LED, display, optical, semiconductor and printed electronics industries, emerged from stealth today to introduce two flagship product series for next generation LED applications in solid state lighting, display and mobile devices: the Inkron Die Attach (IDA) and Inkron...

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Encapsulants

Henkel to Debut New Solder Paste, Highlight Novel Protection and Thermal Materials at APEX 2015

At the upcoming APEX event, set to take place February 24 – 26 in San Diego, California, The Electronics Group of Henkel plans to unveil a breakthrough solder material, showcase several novel innovations that are lending new levels of protection and performance to next-generation devices and introduce the line of Bergquist thermal management materials. On day one of the show, Henkel plans to...

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