New Encapsulants Products

Underfill Material enables recovery of substrates and PCBs.

Manufactured in lead-free environments, LoctiteÃ-® 3536 underfill material is designed to fill space beneath fine-pitch CSP and BGA packages. It cures at low temperature which minimizes thermal stress to other components on printed circuit board and allows for in-line curing. Product protects solder joints against mechanical strains such as shock, drop, and vibration, and offers manufacturing...

Potting/Encapsulating Compound has water-clear formula.

Designed for applications requiring clarity, semi-flexible 20-2620 is non-yellowing and will not place excess stress on electronic components. This 2-component polyurethane compound offers weather resistance and can be used outdoor applications without exhibiting any degradation. Compound, available in TriggerBondÃ-®, cures at room temperature and has 1:1 mix ratio.

Silicone Material suits electronic packaging applications.

Low outgassing, one-part material EPM-2411-2 glop-top is designed for encapsulation of chip packages in devices where outgassing-related contamination poses problem. Product exhibits low stress and wide operating temperature ranges characteristically associated with silicone-based materials. It is stored and shipped frozen in 3 and 30 cc syringes as well as 3 and 6 oz tubes.

Ceramic Compound has compressive strength of 11,500 psi.

Ceramacast(TM) 646N is hydraulic-setting, phosphate-bonded, zirconium oxide filled ceramic compound used for encapsulating and potting high temperature electrical components to 3,000Ã-ºF. Supplied as dry powder, potting compound sets hydraulically in 16-24 hr at room temperature. Cured material demonstrates volume resistivity of 109 W-cm and dielectric strength of 250 V/mil.

A Guide to Robotic Cells in Automation: Electronics & Auto Parts

This white paper provides an overview into robotic cells in automation electronics and auto parts.

Epoxy Compound offers electrical potting and encapsulation.

Providing optimized wetting characteristics, 2-part TRA-CAST 3103 adheres to glass, ceramics, and most metals and plastics. When fully cured, product offers electrical insulator with impact and thermal shock resistance. Material can be room temperature or heat cured and exhibits ultimate Tg of 80Ã-

UV Curable Adhesive targets electronics manufacturing.

One-component 60-7105 adhesive, coating, and potting compound cures within seconds when exposed to UV light. With viscosity of 3,000 cps, product self-levels around intricate electronic designs, can cure in deep sections, and adheres to most substrates. Adhesive is available in pre-packaged syringes, quarts, and gallons.

Dam and Fill Encapsulants meet lead-free requirements.

HysolÃ-® FP4451TD(TM) and FP4800(TM) meet stringent JEDEC level testing requirements and enable wirebonded cavity-down SuperBGAÃ-® and Viper(TM) BGA packages. Suited for package level applications, Hysol FP4451TD offers aspect ratio of 0.70 height-to-width and enables dam heights greater than 1 mm. Self-leveling, liquid encapsulant, Hysol FP4800 withstands solder temperatures to 260Ã-

Ceramic Compound offers high-temperature thermal insulation.

Fused silica-based Ceramacast(TM) 645N is suited for encapsulating small ceramic and metal housings used in high temperature devices such as flow meters, pressure sensors, and temperature sensors to 3,000Ã-

Encapsulants/Lens Materials suit LED applications.

Offering high refractive indexes from 1.4 to over 1.5, InvisiSil Encapsulants offer adhesion to range of case and electrode materials including ceramics, polyamides, and silver and gold electrodes. They provide stability under thermal stress and UV light, resisting yellowing and delamination from substrate. InvisiSil Lens Materials are high hardness silicone materials that can be liquid injection...

Potting Compound suits high-temperature applications.

Thermally conductive Aremco-Bond(TM) 2315 is black-pigmented, 100% solids epoxy compound used for electrical and electronic potting applications to 365Ã-

560 and 572 Series IP67 Waterproof Inline Plug and Socket Connectors with Shock and Vibration Resistance

EDAC's new line of IP67 waterproof plug and socket connectors represent the cutting edge of waterproof connection technology. Part of the 560 and 572 series of connectors, they utilize innovative design concepts to deliver a level of performance and value that is unmatched in the industry. See our video to learn more.