Encapsulants

Electrolube Encapsulation Resin Provides Full Protection for Automotive Sensor
Resins

Electrolube Encapsulation Resin Provides Full Protection for Automotive Sensor

Thermal cycling tests involving Electrolube's ER1455 chemically resistant, two-part epoxy resin have proved the material's ability to protect and retain an automotive sensor subject to highly aggressive environmental conditions. Electrolube recently helped one of its customers, a prominent manufacturer of control units and sensor devices, to overcome an issue with one particular sensor...

Read More »
UV Cure Adhesive suits circuit assembly applications.
Encapsulants

UV Cure Adhesive suits circuit assembly applications.

Designed to cure rapidly when exposed to high-intensity UV light, 535-11M-7 Epoxy is suitable for lens bonding in camera modules, chip encapsulation in smart cards, and variety of general bonding applications in photonics assembly. Flexible, high-strength epoxy adhesive is non-conductive, low-outgassing, and does not contain antimony.

Read More »
Epoxy Potting Compound resists high temperatures.
Encapsulation Equipment

Epoxy Potting Compound resists high temperatures.

With 130°C relative temperature index rating, 50-3150RFR Black Epoxy with Catalyst 30 will survive elevated temperatures for long periods of time, which offers benefits as electronics get smaller and hotter. Compound is UL 746B listed and formulated to meet stringent non-burning requirements of UL 94 V-0. Typical applications include encapsulating power supplies, transformers, coils,...

Read More »
Epoxy Potting Compound suits applications to 365°F.
Miscellaneous Compounds

Epoxy Potting Compound suits applications to 365°F.

Offering thermal conductivity, electrical insulation, and low shrinkage after cure, Aremco-Bond™ 2315 is suited for potting and encapsulating densely packaged power supplies, rectifiers, ICs, oscillators, DACs, amplifiers, and relays. Black-pigmented product provides flexural strength of 12,300 psi and dielectric strength of 480 V/mil. Mixed in ratio of 100 parts resin to 25 parts hardener by...

Read More »
Encapsulants

Advanced Materials Pioneer, Inkron, Emerges from Stealth with Two Next Generation LED Product Lines

HELSINKI and LAS VEGAS –Â- Strategies in Light - Inkron Oy, a leading manufacturer of advanced materials for the lighting, LED, display, optical, semiconductor and printed electronics industries, emerged from stealth today to introduce two flagship product series for next generation LED applications in solid state lighting, display and mobile devices: the Inkron Die Attach (IDA) and Inkron...

Read More »
Encapsulants

Henkel to Debut New Solder Paste, Highlight Novel Protection and Thermal Materials at APEX 2015

At the upcoming APEX event, set to take place February 24 – 26 in San Diego, California, The Electronics Group of Henkel plans to unveil a breakthrough solder material, showcase several novel innovations that are lending new levels of protection and performance to next-generation devices and introduce the line of Bergquist thermal management materials. On day one of the show, Henkel plans to...

Read More »
Flux

YINCAE President, Dr. Wusheng Yin, Presents: "The Future of Solder Joint Encapsulation" IPC Tech Summit 2014 in Raleigh, NC

Albany, NYÂ- – Dr. Wusheng Yin, President of YINCAE Advanced Materials LLC, will be presenting in the Technical Session on The Future of Solder Joint Encapsulation" at the upcoming IPC Tech Summit, with the event being held from Oct 28th to 30th in Raleigh, NC. Following is the Abstract taken from the paper on "The Future of Solder Joint Encapsulation" "Solder joint encapsulant adhesives...

Read More »
Polyurethane Potting Compound is environmentally friendly.
Miscellaneous Compounds

Polyurethane Potting Compound is environmentally friendly.

Intended for electronic applications with low toxicity requirements, 20-2121 Polyurethane is made from natural oil polyol, meets FDA food contact requirements, and does not contain TDI, MbOCA, or Mercury. Plant-based potting, casting, and encapsulating compound, exhibiting minimal shrinkage or exotherm, offers elastomeric properties that limit stress on electronics. Tensile strength is 2,000...

Read More »
Encapsulants

Dow Corning Spotlights Silicone Solutions for LED Lighting Design, Assembly and Protection at Two Key European Lighting Exhibitions

Company sees accelerating demand for next-generation silicones to support application development and expanding production among global customers. Seneffe, Belgium – As the adoption and production of LED illumination rapidly accelerates, lighting manufacturers worldwide are seeking new and innovative materials to push LED design boundaries, improve product reliability and help optimize...

Read More »
Encapsulants

Solder Joint Encapsulant for Ball Bumping Applications: BP 256

Albany, NYÂ- – YINCAE Advanced Materials, LLC is pleased to announce the release and availability of BP 256. It is a part of the innovative SMT 256/266 series, solder joint encapsulant. YINCAE's BP 256 is for BGA, CSP, Flip Chip, POP, and other ball bumping applications. The BP 256 can enhance solder joint reliability and eliminate solder joint cracking in microchip applications,...

Read More »
Precision Machining Solutions with Over 25 Years of Experience
Sponsored

Precision Machining Solutions with Over 25 Years of Experience

Quality, customer service, and unbeatable value are the hallmarks of Hogge Precision. Since 1989 we have built a reputation as the go-to precision machining source, servicing many demanding industries. For CNC machining and screw machining, there are few manufacturers that can match our capabilities and expertise. See our video to learn more.

Read More »

All Topics