Encapsulants

Epoxy Compound serves potting applications from -67 to 365°F.
Encapsulants

Epoxy Compound serves potting applications from -67 to 365°F.

Available for electrical and electronic potting applications, thermally conductive Aremco-Bond(TM) 2318 is medium-viscosity (16,000 cP mixed), black-pigmented epoxy compound with 12,300 psi flexural strength and 1,135 psi tensile-shear strength. Other properties include volume resistivity of 3.0 x 1015, dielectric strength of 460 V/mil, and dielectric constant of 4.8 at 1 kHz. Recommended cure...

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DuPont(TM) PV5400 Series Lonomer Encapsulant Reduces Cost, Increases Strength in New Axuntek CIGS Modules
Solar Panels

DuPont(TM) PV5400 Series Lonomer Encapsulant Reduces Cost, Increases Strength in New Axuntek CIGS Modules

WILMINGTON, Del. - Axuntek Solar Energy Co., Ltd. has announced its new IEC-certified Copper Indium Gallium (di)Selenide (CIGS) thin film solar cell modules using DuPont(TM) PV5400 series ionomer encapsulant. These frameless solar modules, which are the first adoption of DuPont(TM) PV5400 into CIGS technology, take advantage of the ionomer's excellent clarity and low moisture ingress, which...

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Encapsulants

Silicone Encapsulant protects solar modules.

By surrounding fragile solar cells of crystalline PV module with flexible, stress dissipating silicone matrix, SilTRUST Encapsulant helps maximize performance in harsh outdoor environments while optimizing light-to-electricity conversion yield. Refractive index of transparent encapsulant closely matches that of glass, minimizing energy-dissipating reflection of sunlight away from solar cell. At...

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Electrolube Launches a Hazard-Free, Flame Retardant Polyester Resin at SMT Hybrid Packaging
Resins

Electrolube Launches a Hazard-Free, Flame Retardant Polyester Resin at SMT Hybrid Packaging

With a number of Electrolube's new products showcasing for the first time at SMT Hybrid Packaging, the global electro-chemicals manufacturer has announced it will launch a further new isocyanate free encapsulation resin alongside the company's newest silicone resin products and CO2 reducing aerosol technologies. PE7600 is a high performance, opaque, flame retardant encapsulation resin developed...

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Electrolube Launches Isocyanate-Free Clear Polyester Resin at SMT Hybrid Packaging
Resins

Electrolube Launches Isocyanate-Free Clear Polyester Resin at SMT Hybrid Packaging

Electrolube, the global manufacturer at the forefront of electro-chemicals technology, will launch an innovative clear polyester resin and showcase the company's newest "green" and Silicone Resin products for the electronics, automotive and industrial manufacturing industries, at SMT Hybrid Packaging on the 8-10 May at the Messezentrum in Nuremberg, booth 7-524. The new PE7500 Clear Polyester...

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Wire Bond Encapsulant acts as flexible circuit bonding adhesive.
Encapsulants

Wire Bond Encapsulant acts as flexible circuit bonding adhesive.

Intended for printer head and circuit assembly applications, 357-348 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive imparts protection while reducing stresses associated with thermal cycling. Product exhibits chemical resistance to inks and adheres to flexible circuits, FR4, and metal substrates. Properties meet circuit assembly and semiconductor standards for ionic cleanliness...

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Encapsulants

Epoxy Potting Compound withstands temperatures up to 392°F.

Used to encapsulate small electrical components in medical device industry, EC-1014M-1 meets NASA outgassing standards and offers optimal performance in extreme environments of heat and caustic chemicals. Thermally conductive potting compound provides Shore D hardness of 90 when cured, which enables resistance to physical shock. In addition to pint, quart, gallon, and 5 gallon sizes, product is...

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Award-Winning MACROMELT Portfolio Extended with the Addition of Material with Highest RTI Rating in Its Class
Miscellaneous Compounds

Award-Winning MACROMELT Portfolio Extended with the Addition of Material with Highest RTI Rating in Its Class

Henkel's award-winning low-pressure molding MACROMELT technology portfolio has recently been expanded to include a material designed specifically for high thermal stability and chemical resistance. The product, MACROMELT MM6208, has all of the inherent benefits consistent with MACROMELT technology, but has a high (95°C) Relative Temperature Index (RTI) rating making it ideal for certain...

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Ceramic-Silicone Potting Compound suits applications to 900°F.
Encapsulants

Ceramic-Silicone Potting Compound suits applications to 900°F.

Used to insulate moisture-sensitive electrical components, including cartridge heaters and high power case resistors, Sil-Bond(TM) 905 demonstrates moisture resistance with weight gain of less than 1% after exposure to 900°F and 24 hours water immersion. Shrinkage rate is also less than 1% and dielectric strength is greater than 250 V/mil. Supplied as powder and liquid system, compound...

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Ceramic Compound is suited for high-temperature heaters.
Repair Compounds

Ceramic Compound is suited for high-temperature heaters.

Provided in powder form and mixed in ratio of 100 parts powder to 18-20 parts water, Ceramacast(TM) 645N fused silica-based ceramic compound can be used to encapsulate small ceramic and metal housings used in devices such as heaters, flowmeters, and pressure and temperature sensors to 3,000°F. Material bonds to ceramics and metals and exhibits minimal thermal conductivity, dielectric...

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