Encapsulants

Electrolube Launches Isocyanate-Free Clear Polyester Resin at SMT Hybrid Packaging
Resins

Electrolube Launches Isocyanate-Free Clear Polyester Resin at SMT Hybrid Packaging

Electrolube, the global manufacturer at the forefront of electro-chemicals technology, will launch an innovative clear polyester resin and showcase the company's newest "green" and Silicone Resin products for the electronics, automotive and industrial manufacturing industries, at SMT Hybrid Packaging on the 8-10 May at the Messezentrum in Nuremberg, booth 7-524. The new PE7500 Clear Polyester...

Read More »
Wire Bond Encapsulant acts as flexible circuit bonding adhesive.
Encapsulants

Wire Bond Encapsulant acts as flexible circuit bonding adhesive.

Intended for printer head and circuit assembly applications, 357-348 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive imparts protection while reducing stresses associated with thermal cycling. Product exhibits chemical resistance to inks and adheres to flexible circuits, FR4, and metal substrates. Properties meet circuit assembly and semiconductor standards for ionic cleanliness...

Read More »
Encapsulants

Epoxy Potting Compound withstands temperatures up to 392°F.

Used to encapsulate small electrical components in medical device industry, EC-1014M-1 meets NASA outgassing standards and offers optimal performance in extreme environments of heat and caustic chemicals. Thermally conductive potting compound provides Shore D hardness of 90 when cured, which enables resistance to physical shock. In addition to pint, quart, gallon, and 5 gallon sizes, product is...

Read More »
Award-Winning MACROMELT Portfolio Extended with the Addition of Material with Highest RTI Rating in Its Class
Miscellaneous Compounds

Award-Winning MACROMELT Portfolio Extended with the Addition of Material with Highest RTI Rating in Its Class

Henkel's award-winning low-pressure molding MACROMELT technology portfolio has recently been expanded to include a material designed specifically for high thermal stability and chemical resistance. The product, MACROMELT MM6208, has all of the inherent benefits consistent with MACROMELT technology, but has a high (95°C) Relative Temperature Index (RTI) rating making it ideal for certain...

Read More »
Ceramic-Silicone Potting Compound suits applications to 900°F.
Encapsulants

Ceramic-Silicone Potting Compound suits applications to 900°F.

Used to insulate moisture-sensitive electrical components, including cartridge heaters and high power case resistors, Sil-Bond(TM) 905 demonstrates moisture resistance with weight gain of less than 1% after exposure to 900°F and 24 hours water immersion. Shrinkage rate is also less than 1% and dielectric strength is greater than 250 V/mil. Supplied as powder and liquid system, compound...

Read More »
Ceramic Compound is suited for high-temperature heaters.
Repair Compounds

Ceramic Compound is suited for high-temperature heaters.

Provided in powder form and mixed in ratio of 100 parts powder to 18-20 parts water, Ceramacast(TM) 645N fused silica-based ceramic compound can be used to encapsulate small ceramic and metal housings used in devices such as heaters, flowmeters, and pressure and temperature sensors to 3,000°F. Material bonds to ceramics and metals and exhibits minimal thermal conductivity, dielectric...

Read More »
Miscellaneous Compounds

Flame Retardant Potting Compound stays flexible in cold temps.

Designed to meet UL 94 V-0 flammability standard, 20-2362 FR remains soft in very low temperatures down to -72°C. Polyurethane potting and encapsulating compound is suited for cushioning and protecting sensitive electronic components since it provides vibration resistance and does not stress components. Compliant with REACH and RoHS, product is also moisture-resistant and will not damage...

Read More »
Encapsulants

When Electronic Assemblies Need to Perform at Low Temperatures and Self-Extinguish... Rely on 50-2185 FR

The recently developed 50-2185 FR has a unique combination of properties. This urethane potting compound provides a low glass transition temperature, low durometer, high thermal conductivity, and flame retardancy. The 50-2185 FR offers excellent heat transfer, low exotherm and excellent electrical insulating properties. This unique urethane system is an ideal material for the potting of...

Read More »
Encapsulation Equipment

Does Weight Matter?

Epoxies, Etc. Develops Low Density Epoxy... 20-3035 Epoxy Syntactic Foam System The weight of 20-3035 is less than half of most commercially available potting and encapsulating compounds. This epoxy syntactic foam system utilizes technologically advanced micro balloons. This provides for a low density, low coefficient of thermal expansions, low shrinkage, and a stiff finished product. This unique...

Read More »
Encapsulants

DuPont Photovoltaic Encapsulants and Bürkle Collaborate for Faster Encapsulation, Helping Ypsator® Double Module Output vs. Other Laminators

DuPont(TM) PV5400 Series Encapsulant Helps Bürkle's Latest 3-Step PV Laminator Increase Lamination Output without Expanding Factory Space WILMINGTON, Del. - DuPont Photovoltaic Encapsulants and Bürkle North America, Inc., a wholly-owned division of Bürkle GmbH, of Freudenstadt, Germany, announce that they have worked together to speed up module lamination with the Bürkle Ypsator®...

Read More »

All Topics