Encapsulants

Moisture Resistant Encapsulant has smooth consistency.
Encapsulants

Moisture Resistant Encapsulant has smooth consistency.

Tra-Bond 933-1.5 electrically insulating epoxy encapsulant is formulated to provide smooth crowns over devices of wire bonds. Encapsulant provides protection from thermal and mechanical shock. Compound is stable at room temperature for up to three months, but is best kept stored at -40°C or colder, since filler may settle.

Read More »
Liquid Epoxy Encapsulant provides fast capillary flow.
Encapsulants

Liquid Epoxy Encapsulant provides fast capillary flow.

Hysol® FP4549FC package level underfill is designed to offer excellent adhesion to flip-chip assemblies containing no-clean flux residues. Qualified to perform in 260°C reflow applications, FP4549FC heat cures in 30 minutes at 165°C, and meets JEDEC Level-3 260°C requirements. This high-purity, low-stress liquid epoxy encapsulant is designed for use in fine pitch...

Read More »

All Topics

COVID-19 Response Suppliers COVID-19 Response:
Can Your Company Help Provide Critical Supplies?

We are using the power of our platform to aid in the mass shortage of critical supplies. If your company can help provide supplies, capabilities, or materials for products such as N-95 Masks and Tyvek SuitsPlease let us know.

COVID-19 Response Suppliers