Encapsulants

Liquid Epoxy Encapsulant provides fast capillary flow.
Encapsulants

Liquid Epoxy Encapsulant provides fast capillary flow.

Hysol® FP4549FC package level underfill is designed to offer excellent adhesion to flip-chip assemblies containing no-clean flux residues. Qualified to perform in 260°C reflow applications, FP4549FC heat cures in 30 minutes at 165°C, and meets JEDEC Level-3 260°C requirements. This high-purity, low-stress liquid epoxy encapsulant is designed for use in fine pitch...

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