Encapsulants

Epoxy Compound withstands exposure to thermal cycling.
Encapsulants

Epoxy Compound withstands exposure to thermal cycling.

EP30FL Epoxy Potting and Encapsulation compound has low viscosity and can be used in both thick and thin cross sections. Generating low exotherm during cure, it cures at room temperature with low shrinkage. Electrically insulated compound adheres to both similar and dissimilar substrates, is 100% reactive, does not contain any volatiles, and withstands mechanical shock and vibration.

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Epoxy Adhesive/Encapsulant is flame retardant.
Encapsulants

Epoxy Adhesive/Encapsulant is flame retardant.

Self-extinguishing, 5 Minute® Epoxy FR fills gaps and bonds rigid substrates such as metals, glass, ceramics, concrete, and wood. Mixed as dispensed, product has 115,000 cps viscosity, 3-5 min working time, 10-15 min fixture time, and 2-3 hr functional cure time. Once cured, it offers tensile shear strength of 2,800 psi on cold-rolled steel and dielectric strength of 490 V/mil. Bonds...

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Potting/Encapsulation Compound resists thermal shock.
Miscellaneous Compounds

Potting/Encapsulation Compound resists thermal shock.

Two-component, epoxy-sealing EP110F6, for potting, encapsulation, and casting, has 1-2 mix ratio by weight and cures upon exposure to elevated temperatures. It provides electrical insulation and resists thermal cycling and shock. Medium-viscosity liquid passes Navy Hex Bar Test, MILI-16923C, consisting of 10 cycles from -55 to +155°C. It resists chemicals and adheres to wide range of...

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Fire Retardant Coating protects fragile substrates.
Encapsulants

Fire Retardant Coating protects fragile substrates.

EURO-SEAL 7000 polyurethane encapsulant, suited for use on carved architectural EPS and polyurethane foam elements, provides protection from thermal expansion and UV degradation and strengthens mechanical impact resistance. Able to dry to touch within 10 sec, 2-component, spray-applied polyurethane coating forms hard, chemical-, moisture-, and fire-retardant encapsulation. It enables fabricators...

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Potting Compound seals electrical components/wiring.
Encapsulants

Potting Compound seals electrical components/wiring.

Syon® Tru-Cast® 111 thermally conductive epoxide formulation fills voids completely and cures with minimal air entrapment. Black, aluminum-oxide-filled compound can be used as structural adhesive to create heat-sink lap joints. Depending on curing agent used, mixed viscosity rages from 2,000-20,000 cps, pot life varies from 30 min to 3.5 hr, and functional cure time takes from 24 hr @...

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RTV Silicones are suited for electrical applications.
Encapsulants

RTV Silicones are suited for electrical applications.

Solarite SI-200 Series Room Temperature Vulcanizing (RTV), 2-component, electrical potting and casting silicones are available in hardness ranges from 80A (semi-rigid) to 00 (gels). Gels are re-enterable and cure to elastic Shore 00 form with no surface residue. Products are UL-94V-0 approved, cure with high gloss, and produce void-free castings in potted electrical devices. Characteristics...

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Potting Compound dispenses from disposable static mixers.
Encapsulants

Potting Compound dispenses from disposable static mixers.

Following dispensing, Trigger Cure(TM) 9-20675 A/B 2-part potting compound forms Â-¼ in., UV-cured layer on top in 20 seconds or less that provides protection and integrity to surface. Interior gels within 15-20 minutes at room temperature to depths of 1 in. or more. Optimum properties are achieved in 48 hours at room temperature. With no exotherm, soft, rubbery encapsulant protects and...

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Encapsulants

Polyurethane Potting Compound protects electronic SMT parts.

Flexible polyurethane potting and encapsulating resin system 20-2353 imparts no stress on delicate/sensitive electronic surface mount components during cure or when thermal cycled in electronic assemblies. Suited for continuous exposure in wet environments, it does not absorb any moisture and maintains flexibility down to -70°C. Product offered as alternative to Silicone systems due to its...

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Encapsulants

Reflow Encapsulant provides single-pass curing.

With blue color to aid visual inspection, SE-CURE® 9126 single-pass reflow encapsulant is suited for mounting eutectic tin/lead flip chip and fine-pitch chip-scale packaging (CSP) components to rigid substrates. Single-component, liquid, epoxy-based flux and underfill encapsulant may be used in high humidity and temperature environments where dwell time between material dispense and chip...

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