Encapsulants

Encapsulants

Dam and Fill Encapsulants meet lead-free requirements.

Hysol® FP4451TD(TM) and FP4800(TM) meet stringent JEDEC level testing requirements and enable wirebonded cavity-down SuperBGA® and Viper(TM) BGA packages. Suited for package level applications, Hysol FP4451TD offers aspect ratio of 0.70 height-to-width and enables dam heights greater than 1 mm. Self-leveling, liquid encapsulant, Hysol FP4800 withstands solder temperatures to...

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Miscellaneous Compounds

Ceramic Compound offers high-temperature thermal insulation.

Fused silica-based Ceramacast(TM) 645N is suited for encapsulating small ceramic and metal housings used in high temperature devices such as flow meters, pressure sensors, and temperature sensors to 3,000°F. Product offers dielectric strength of 300 V/mil, compressive strength of 7,000 psi, and chemical resistance. Supplied in powder form, compound is mixed with water and sets at room...

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Encapsulants

Encapsulants/Lens Materials suit LED applications.

Offering high refractive indexes from 1.4 to over 1.5, InvisiSil Encapsulants offer adhesion to range of case and electrode materials including ceramics, polyamides, and silver and gold electrodes. They provide stability under thermal stress and UV light, resisting yellowing and delamination from substrate. InvisiSil Lens Materials are high hardness silicone materials that can be liquid injection...

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Encapsulation Equipment

Potting Compound suits high-temperature applications.

Thermally conductive Aremco-Bond(TM) 2315 is black-pigmented, 100% solids epoxy compound used for electrical and electronic potting applications to 365°F. Along with electrical insulation, product exhibits chemical resistance to acids, alkalis, organic fluids, and salts. Flexural strength is 12,300 psi, dielectric strength is 480 V/mil, and dielectric constant is 4.7 @ 1 kHz. Cured product...

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Encapsulants

Potting Compound may be used in applications to 2,800°F.

Used to pot heaters and thermocouples as well as cast parts, Ceramacast(TM) 584 is supplied as kit comprised of 584-P Powder and 584-L Liquid Binder. Magnesium oxide-based, silica-bonded ceramic compound exhibits 100 V/mil dielectric strength and 109 Ω-cm volume resistivity. With 4,500 psi compressive strength and 6.5 ppm/°F CTE, product sets within 5-10 min at room temperature. Full cure...

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High-Temperature Epoxy cures at room temperature.
Encapsulants

High-Temperature Epoxy cures at room temperature.

Suited for potting, encapsulation, sealing, and bonding, Polymer System EP39MHT exhibits electrical insulation and chemical inertness for service up to 450°F. This 2-component system cures at ambient or elevated temperatures, is 100% reactive, and contains no VOCs. Able to bond similar and dissimilar substrates, cured product is thermoset solid featuring resistance to thermal and/or...

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Flame Retardant Compounds suit encapsulating and potting.
Encapsulants

Flame Retardant Compounds suit encapsulating and potting.

Non-shrinking castable liquid, Cable Cast FR urethane encapsulates, insulates, and provides strain relief for electrical connectors and cables. Because it forms flexible jacket with abrasion, tear, and puncture resistance, it can also repair power cable jackets and insulation. Intended for potting aerospace inserts, clear-drying 5 Minute® Epoxy FR adhesive/encapsulant paste fills gaps and...

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Encapsulants

Epoxy Potting Compound has mixed viscosity of 6,700 cp.

Targeted for electronic assembly manufacturers, 2-part 20-3063 epoxy potting and encapsulating compound has 1:1 mix ratio with resin pigmented black and catalyst white for visual indication that products have been properly mixed. It cures at room temperature to 75-80 Shore D hardness, has 45 min pot life, usable temperature range of -40 to 130°C, and dielectric strength of 450 V/mil.

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Compound suits potting and encapsulation applications.
Encapsulants

Compound suits potting and encapsulation applications.

Two-component Master Bond EP30DP epoxy/urethane elastomer can be cast in thick cross sections without development of undue exotherm during cure. With service operating temperature of -80 to +250°F, product is formulated to cure at room temperature or more rapidly at elevated temperatures. Cured compound offers abrasion resistance and electrical insulation. Polymer system has Shore A...

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Encapsulants

Silicones suit deep potting and sealing applications.

One-part Loctite® Nuva-Sil® Silicones cure tack-free in seconds to depth of 2 in. upon exposure to UV or high-power visible light. Translucent in appearance, products offer weather, temperature, and moisture resistance, and will not degrade or yellow on long-term exposure to light. All offer built-in fluorescence detection system that allows automatic quality inspection. These...

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