Encapsulants

Encapsulation Equipment

Potting Compound suits high-temperature applications.

Thermally conductive Aremco-Bond(TM) 2315 is black-pigmented, 100% solids epoxy compound used for electrical and electronic potting applications to 365°F. Along with electrical insulation, product exhibits chemical resistance to acids, alkalis, organic fluids, and salts. Flexural strength is 12,300 psi, dielectric strength is 480 V/mil, and dielectric constant is 4.7 @ 1 kHz. Cured product...

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Encapsulants

Potting Compound may be used in applications to 2,800°F.

Used to pot heaters and thermocouples as well as cast parts, Ceramacast(TM) 584 is supplied as kit comprised of 584-P Powder and 584-L Liquid Binder. Magnesium oxide-based, silica-bonded ceramic compound exhibits 100 V/mil dielectric strength and 109 Ω-cm volume resistivity. With 4,500 psi compressive strength and 6.5 ppm/°F CTE, product sets within 5-10 min at room temperature. Full cure...

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High-Temperature Epoxy cures at room temperature.
Encapsulants

High-Temperature Epoxy cures at room temperature.

Suited for potting, encapsulation, sealing, and bonding, Polymer System EP39MHT exhibits electrical insulation and chemical inertness for service up to 450°F. This 2-component system cures at ambient or elevated temperatures, is 100% reactive, and contains no VOCs. Able to bond similar and dissimilar substrates, cured product is thermoset solid featuring resistance to thermal and/or...

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Flame Retardant Compounds suit encapsulating and potting.
Encapsulants

Flame Retardant Compounds suit encapsulating and potting.

Non-shrinking castable liquid, Cable Cast FR urethane encapsulates, insulates, and provides strain relief for electrical connectors and cables. Because it forms flexible jacket with abrasion, tear, and puncture resistance, it can also repair power cable jackets and insulation. Intended for potting aerospace inserts, clear-drying 5 Minute® Epoxy FR adhesive/encapsulant paste fills gaps and...

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Encapsulants

Epoxy Potting Compound has mixed viscosity of 6,700 cp.

Targeted for electronic assembly manufacturers, 2-part 20-3063 epoxy potting and encapsulating compound has 1:1 mix ratio with resin pigmented black and catalyst white for visual indication that products have been properly mixed. It cures at room temperature to 75-80 Shore D hardness, has 45 min pot life, usable temperature range of -40 to 130°C, and dielectric strength of 450 V/mil.

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Compound suits potting and encapsulation applications.
Encapsulants

Compound suits potting and encapsulation applications.

Two-component Master Bond EP30DP epoxy/urethane elastomer can be cast in thick cross sections without development of undue exotherm during cure. With service operating temperature of -80 to +250°F, product is formulated to cure at room temperature or more rapidly at elevated temperatures. Cured compound offers abrasion resistance and electrical insulation. Polymer system has Shore A...

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Encapsulants

Silicones suit deep potting and sealing applications.

One-part Loctite® Nuva-Sil® Silicones cure tack-free in seconds to depth of 2 in. upon exposure to UV or high-power visible light. Translucent in appearance, products offer weather, temperature, and moisture resistance, and will not degrade or yellow on long-term exposure to light. All offer built-in fluorescence detection system that allows automatic quality inspection. These...

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Encapsulants

Silicon-Based Materials suit optical interconnect applications.

Optical Coupling Gel, OE-4000 consists of 2-part, high-purity, transparent silicone gel used for refractive index matching for silica-to-fiber and other optical junctions. One-part transparent silicone elastomer, OE-4100 provides refractive index shifting potential for planar silica-on-silicon optical components. Two-part Photonic-Grade Encapsulant OE-4200 consists of soft silicone elastomer for...

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Epoxy Potting Compound provides electrical insulation.
Encapsulants

Epoxy Potting Compound provides electrical insulation.

Two-component EP121AO-1 offers thermal conductivity as well as thermal and dimensional stability. It features chemical resistance even when exposed to adverse environmental conditions. Service operating temperature is 475-500°F for limited time periods and 400-450°F for prolonged exposures. Medium-viscosity liquid adheres to metallic and non-metallic surfaces. It has 100:80 mix ratio...

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Encapsulants

UV-Cure Encapsulants cure within 26-46 sec.

Hysol 3323, 3327, and 3329 are dam-and-fill products for encapsulation of wire-bonded dies used in Smart Card ICs. Used to form dam, high-viscosity Hysol 3323 has thixotropic nature and glass transition temperature (Tg) of 155°C. Hysol 3327 and 3329 are low-viscosity materials used for fill process. Coefficient of thermal expansion is 45 ppm below Tg and 130 ppm above Tg. Curing time...

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