Encapsulants

Applicators

Ellsworth Adhesives to Showcase Key Suppliers' Technologies at Assembly Technology Expo 2008

Germantown, WI - Ellsworth Adhesives, a leading global provider of adhesives, specialty chemicals and engineered solutions will exhibit technologies from leading suppliers at the 2008 Advanced Technologies Expo, September 23-25, 10 a.m. - 4 p.m., daily at the Donald E. Stephens Convention Center in Rosemont, IL, booth 444. This event offers attendees an outstanding opportunity to keep pace with...

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Encapsulants

UV-Active Silicones target microelectronics industry.

Available in 1- and 2-component systems based on polyorganosiloxanes, SEMICOSIL® UV Elastomers cure at room temperatures within minutes. Curing rate can be controlled by appropriate selection of elastomer, UV dose, and process temperatures. Product generates no by-products during curing, making it suited for encapsulation of electronic components.

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Encapsulants

Epoxies, Etc Announces New IllumaBond(TM) Brand

June 2008 Epoxies, Etc... proudly announces IllumaBond(TM) as the brand name of its innovative product line of UV Curable Adhesives, Potting Compounds, and Coatings. The branding of the UV Curable Products is a further commitment to the exciting technology of Ultraviolet Chemistry. IllumaBond(TM) UV Curable Products provide instant cure-on-demand production to our customers. There is no messy,...

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Encapsulants

Epoxies, Etc... Announces New IllumaBond(TM) Brand

CRANSTON, RHODE ISLAND, USA Epoxies, Etc... proudly announces IllumaBond(TM) as the brand name of its innovative product line of UV Curable Adhesives, Potting Compounds, and Coatings. The branding of the UV Curable Products is a further commitment to the exciting technology of Ultraviolet Chemistry. IllumaBond(TM) UV Curable Products provide instant cure-on-demand production to our customers....

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Condensation Cured Silicone withstands temperatures to 400°F.
Encapsulants

Condensation Cured Silicone withstands temperatures to 400°F.

With 2.2 Btu-in./hr/ftÂ-²/°F thermal conductivity, Master Sil 150 is 2-part, condensation cured liquid silicone system which can be used for potting and encapsulation. It features Shore A hardness of 40, 230% elongation at break, 11 x 10-4 cm/cm°C thermal expansion, and less than 0.4% linear shrinkage. Able to protect sensitive electronic components/assemblies from dust,...

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Encapsulants

Encapsulation and Delivery System suits skin care products.

With SatinFX(TM), both hydrophobic and hydrophilic actives can be encapsulated in variety of skin care products. System provides stability over time, which helps prevent oxidation of actives and discoloration of finished product. SatinFX also enables encapsulation of incompatible ingredients to provide multiple performance benefits, such as sunless tanning products that also provide anti-aging...

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Flux

Epoxy Flux can be used for advanced package configurations.

Reflow curable encapsulant material, Hysol® FF6000(TM), combines flux functionality and underfill protection into one solution. It is formulated to provide flux for lead-free solder joint formation and, when cured, delivers protection against mechanical stress. In-line approach eliminates neeed for dispensing equipment as well as time required for underfill application and cure. Areas of...

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Epoxy Resin offers dimensional stability.
Resins

Epoxy Resin offers dimensional stability.

Suited for bonding, encapsulation, and coating, 2-component EP21LM-3 develops tensile modulus greater than 100,000 psi and tensile shear strength greater than 2,300 psi. Viscosity of 37,000 cps enables product to flow evenly and smoothly without application of pressure. When cured, polymer has Shore D hardness of 64 and resists thermal cycling as well as water, oil, fuels, and most organic...

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Silicone Potting Compound assures complete fill-in.
Encapsulants

Silicone Potting Compound assures complete fill-in.

Suitable for casting, potting, and encapsulation, 2-component MasterSil 151 cures at room temperature or more rapidly at elevated temperatures. It features elongation at break of 160%, Shore A hardness of 45, and dielectric strength of 460 V/mil. Optically clear product offers resistance to vibration, impact, shock, and thermal cycling. With service operating temperature range of -65 to...

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Potting Compound has flexible, low-viscosity formulation.
Encapsulants

Potting Compound has flexible, low-viscosity formulation.

Able to be used in thick and thin cross sections, EP30FL epoxy potting and encapsulation compound is 100% reactive and does not contain any volatiles. It cures at room temperature with minimal shrinkage and adheres to similar as well as dissimilar substrates. Recommended for use in environments exposed to thermal cycling, solution can withstand mechanical shock and vibration. Hardened compound...

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