Adhesives

Instant Epoxy withstands temperatures up to 400-

Bond-It(TM) 7056 adheres to smooth, rough, or porous surfaces, most plastics, metals, ceramics, glass, and wood and is suitable for joining dissimilar materials. It cures as fast as 4 min, with no fixtures or clamps, to form bond with tensile strength of 3,000 psi at room temperature. Product rebuilds surfaces and fills gaps measuring up to Â-¼ in. It has no sulphur like odors, volatiles, or...

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Acrylic Adhesive bonds needles and syringes.

Acrylic Adhesive bonds needles and syringes.

MDÂ-® Medical Device Adhesive 1193-M-VLV is low viscosity for quick, air-free dispensing into needle hub cavities. It bonds stainless steel cannula to polycarbonate, PVC, and polypropylene hubs. Product cures in fraction of a second when exposed to high intensity UV light. It produces clear bonds with minimal variation in tensile strength values. For in-line inspection, MD 1193-M-VLV contains...

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Silver-Filled Adhesive is used in applications to 1,200-

Silver-Filled Adhesive is used in applications to 1,200-

Pyro-Duct(TM) 597-A electrically and thermally conductive adhesive is formulated using high-purity silver powders combined with conductive binder system. It exhibits volume resistivity of 0.0002 ohm-cm at room temperature and tensile shear strength of 450 psi. Single component, water-dispersible system contains no organic resins or solvents. It sets at room temperature in 1-2 hr and heat cures in...

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Pressure Sensitive Adhesives target electronic market.

Pressure Sensitive Adhesives target electronic market.

MACbondÂ-® IR Series double-coated tapes offer high tack for solid bond. Moisture-stable liner keeps adhesive layer clean and flat, protecting against dust, dirt, and other particles. MACfilmÂ-® IF Series rubber and acrylic free films provide edge-to-edge bonding to variety of substrates. MACmountÂ-® IM Series double-coated, polyethylene foams are highly conformable and compressible,...

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Adhesive can be room temperature or heat cured.

Adhesive can be room temperature or heat cured.

Medium-viscosity Tra-Bond 816H04 maintains thermal conductivity even at high temperatures. It bonds to metals, silica, alumina, sapphire, and other ceramics, glass, and plastics. Adhesive is recommended for chip bonding applications, along with staking transistors, diodes, resistors, integrated circuits, and other heat sensitive components to circuit boards.

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Methacrylate Adhesives are surface activated.

Agomet(TM) adhesives consist of 6 adhesives and 4 hardeners that bond substrates via surface activation. This allows application of hardener/lacquer to substrate up to 30 days before resin is added to bond assembly. Able to join materials, thermoplastics, and composites, adhesives can be hand- and meter-mixed. Work lives range from 1-20 min, lap shear strengths vary from 3,000-4,000 psi, and...

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Adhesive bonds non-active package surfaces.

HysolÂ-® QMI 550SI low-CTE, silica-filled, dielectric die attach adhesive is hydrophobic and produces void-free bond lines that adhere to organic and metal surfaces. Product allows SkipPrebake(TM) and can be cured in-line using SkipCure(TM) processing 10 sec after bond line reaches 150Â-

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