Adhesive can be room temperature or heat cured.
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Press Release Summary:
Medium-viscosity Tra-Bond 816H04 maintains thermal conductivity even at high temperatures. It bonds to metals, silica, alumina, sapphire, and other ceramics, glass, and plastics. Adhesive is recommended for chip bonding applications, along with staking transistors, diodes, resistors, integrated circuits, and other heat sensitive components to circuit boards.Original Press Release:
Extreme Exposure
Have you heard about our new thermally conductive adhesive:
Tra-Bond 816H04?
This medium viscosity adhesive maintains its thermal conductivity
even at high temperatures. Tra-Bond 816H04 can be room temperature or heat cured. It is able to bond to metals, silica,
alumina, sapphire and other ceramics, glass, plastics, and many
other materials.
Tra-Bond 816H04 is recommended for chip bonding applications,
along with staking transistors, diodes, resistors, integrated circuits, and other heat sensitive components to printed circuit boards.
If you would like to know more about Tra-Bond 816H04 or any other
Tra-Con products, please contact the application engineering staff at 1-800-TRACON1 (1-800-872-2661), or visit our website at www.tra-con.com. Don't forget to ask about our free samples!
