Malvern Instruments Ltd
Malvern Worcestershire WR14 1XZ GBR
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Microscopes enable in-plane anisotropic materials analysis.
MultiModeÃ-® and Dimension(TM) scanning probe microscopes use Torsional Resonance Mode(TM) (TRmode(TM)), which measures tip-sample interactions through torsional resonance of microscope cantilever to provide lateral characterization of sample surfaces. TRmode can be used in conjunction with TappingMode(TM), offering researchers complementary lateral and vertical data for virtually every SPM...
Read More »Activated Epoxy bonds dissimilar materials.
Bond-It(TM) 7050 Activated Epoxy forms high-strength bonds to Nylon, PVC, most metals, high performance composites, glass, ceramics, and combinations of dissimilar materials. In most cases, no special surface preparations are required. Cured at room temperature for 400Ã-
Read More »Gas Analyzer detects trace level contamination in bulk gases.
MultiGas? Purity? Analyzer is composed of process FTIR spectrometer, high-optical throughput sampling cell, and applications-specific analysis software. It provides real-time, low-level impurity detection in high purity ammonia and nitrogen trifluoride to improve LED/semiconductor device yields and bulk gas production.
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Temperature Transmitter incorporates HART-® protocol.
Model Mp82700H 2-Wire Temperature Transmitter measures 1/7 in. diameter x 1 in. high and fits standard DIN B small connection heads. It features selectable 4-20 mA or 20-4 mA output, 500 Vdc total isolation, 0.1% selectable On/Off linearization, digital filtering, and Ã-
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Pressure Transmitters suit process monitoring applications.
Series ST 2000 Transmitters feature microprocessor-based electronics, which provide 2-wire, 4-20 mA output signals proportional to measured variables. Microprocessor enhances accuracy by compensating signal for temperature effects. Eight gauge-pressure models range from -14.5 to 6,671 psi and 3 absolute-pressure models range from 0-165 psia. LCD provides local display of process variable. Process...
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Vibrating Fluid Bed Processor dries fibrous products.
Equipped with natural frequency drive system that handles difficult-to-fluidize fibrous materials, unit employs long-stroke, low-frequency operation that positively conveys wet products through processor as drying occurs. Unit has thermal insulation system and construction that allows hood, air distribution/conveying deck, and plenum to expand independently. Rubber piston drive absorbs...
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Turnkey System calibrates color of LED display panels.
With 14-bit dynamic range, PM-LED CCD-based colorimeter system performs color and luminance measurements and automatically corrects display control electronics based on said measurements to achieve desired results. Product consists of PM-1400 series CCD camera, control PC, and ProMetric 7.0 software for data acquisition, image processing, and instrument control. Product can be configured to...
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Gas Spring attaches to stock rails.
SL stock lifter gas spring with counterbore for rail attachments eliminates need for pins, bushings, or other devices to guide rails up and down as metal stock travels through die. Device attaches to stock rails and is available with stroke lengths from 25 to 210 mm. Force range is adjustable between 112-800 lb. Updated spring can be ordered with or without stock lifter cap.
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Label System provides more product information.
Seven-panel bottle label enables nutritional supplement manufacturers to provide detailed product information at point of sale. Top panel of ReseaLabels(TM) peels back to reveal information on reverse side. Four-panel insert is bound between top panel and bottom panel that adheres to product. Pages of label are turned like a book.
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Epoxy encapsulates microelectronic chips.
TRA-BOND 933-2 one component, electrically insulating epoxy encapsulant is for encapsulating microelectronic chips. Epoxy provides environmental and mechanical protection, exhibits longer work life and lower moisture sensitivity than anhydride-cured systems. Low coefficient of thernmal expansion minimizes stress effects on components and wiring during thermal shock tests.
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