Electronic Sockets

Electronic Sockets

Extreme Temperature Test Socket handles 4.5 x 4.5 mm QFN devices.

Designed to test 0.4 mm pitch, 32-lead QFN devices with center ground pad, Model CBT-QFN-7008 features temperature range of -55 to +155°C. Etched spring pin contactor, with cycle life of 500,000 insertions, provides 0.95 nH self inductance, insertion loss of less than 1 dB at 7 GHz, and 0.097 pF capacitance. Current capacity of each contactor is 4.1 A at 60°C temperature rise. In...

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Shrink DIP .070 in. Pitch Strips come in right-angle options.
Electronic Sockets

Shrink DIP .070 in. Pitch Strips come in right-angle options.

Single-row, right-angle sockets and headers can be combined with vertical .070 in. pitch connectors for various interconnect configurations. Right-angle header and socket pair suit board edge daisy chain applications or mix-and-match with vertical sockets and headers for perpendicular mating of boards. With 871 series, sockets accept device leads as well as mate with 870 header series. Sockets...

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BGA IC Socket is designed for 27 x 27 mm package size.
Electronic Sockets

BGA IC Socket is designed for 27 x 27 mm package size.

Designed to socket 27 x 27 mm, 1 mm pitch, 616-pin BGA ICs on any PCB, SG-BGA-6346 operates at bandwidths up to 8 GHz with less than 1 dB insertion loss. Socket dissipates 4.5 W with passive heat sinking and 40 W with active. Contact resistance is 20 mohms typ per pin, and mounting to target PCB is accomplished without any soldering. Socket is constructed with shoulder screw and swivel lid, which...

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BGA Socket supports LTE femtocell SoCs.
Electronic Sockets

BGA Socket supports LTE femtocell SoCs.

Suited for hand test and temperature characterization as well as debugging in femtocell development, Model CBT-BGA-6015 has stamped spring pin contactor with 19 g actuation force per ball and cycle life of 500,000 insertions. Contactor features self inductance of 0.93 nH, insertion loss of less than 1 dB at 23.2 GHz, and contact resistance of less than 16 mW. Specific configuration of package to...

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An Introduction to Plastic Injection Molding
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An Introduction to Plastic Injection Molding

We developed this eBook with designers, engineers and purchasing specialists in mind. It is written to provide a basic understanding of plastic injection molding presses, processes and costs. Our goal is to make our customers more knowledgeable about what goes into making a plastic part.

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Electronic Sockets

Extreme Temperature Socket accommodates 4 x 4 mm QFN device.

Addressing requirements for testing Amkor 24-lead QFN, CBT-QFN-7005 features stamped spring pin contactor with 26 g actuation force per ball and cycle life of 500,000 insertions. Contactor properties include 0.88 nH self inductance, less than 1 dB @ 15.7 GHz insertion loss, 0.097 pF capacitance, and 4 A @ 80°C temperature rise current capacity. Operating from -55 to +180°C, socket...

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Surface-Mount LGA Socket targets Opteron 6000 processor.
Electronic Sockets

Surface-Mount LGA Socket targets Opteron 6000 processor.

Validated to performance of Opteron 6000 series server processor, LGA 1944 socket includes contacts that have 0.6 mm dia solder balls for surface mounting onto PCB. Top side of unit provides cantilever beam interface to processor. Socket's actuation mechanism generates compression load and is designed for use with AMD bolster plate part number 49Z0000042. Cap is also included that facilitates...

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Solderless LED Sockets terminate Bridgelux RS LEDs.
Electronic Sockets

Solderless LED Sockets terminate Bridgelux RS LEDs.

Type BR socket is one-piece connector assembly that features poke-in wire termination method for 18-22 AWG solid wires, 18-20 AWG pre-bonded wires, and 18 AWG stranded wires. Included standoff posts position unit onto heat sink and four M3 or #4 screws are required to secure and complete assembly. Housing material is UV-resistant for outdoor use, and RoHS-compliant unit also features wire strain...

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Electronic Sockets

High-Performance BGA Socket accomodates 23 x 23 mm packages.

Model SM-BGA-9000 for 23 x 23 mm, 0.8 mm pitch BGA packages operates at bandwidths up to 40 GHz with less than 1 dB of insertion loss. It dissipates 4.5 W with heat sink compression screw and can be customized up to 100 W with modified fin design and adding axial flow fan. Operating in temperatures from -55 to +150°C, unit offers contact resistance of 15 mW/pin as well as current capacity...

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Triple Stacked BGA Socket tests processor, memory, and memory probe.
Electronic Sockets

Triple Stacked BGA Socket tests processor, memory, and memory probe.

Model CBT-BGA-7007 features 0.5 mm pitch stamped spring pins with 26 g actuation force/ball, and 0.4 mm pitch etched spring pins with 34 g actuation force/ball, both which have cycle life of 500,000 insertions. Socket also features floating guide for precise ball-to-pin alignment. Operating in temperatures from -55 to +180°C, it is designed to test 12 x 12 mm, 0.4 mm BGA package in bottom...

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BGA Socket operates at bandwidths up to 8 GHz.
Electronic Sockets

BGA Socket operates at bandwidths up to 8 GHz.

BGA socket SG-BGA-6345 is for 1.118 mm pitch, 729 pin (27 x 27) BGA IC's in 31 x 31 mm package size. Operating at bandwidths up to 8 GHz with less than 1dB of insertion loss, sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Shoulder screw and swivel lid incorporate quick insertion method for fast changeout....

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