Electronic Sockets

Electronic Sockets

Socket accommodates 656-pin, 0.8 mm pitch BGA IC.

Model SF-BGA656A-B-64F allows 0.8 mm pitch, 23 x 23 mm body, 28 x 28 array LG XD(TM) Engine to be socketed and operate without compromising performance in HDTV applications. Giga-snaP(TM) BGA socket adapter pair consists of SF-BGA656A-B-64F female BGA sockets with machined pins epoxy over molded into assembly that matches male pin LS-BGA656A-61 adapter. In latter, user attaches target 656 ball LG...

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Unshielded USB 2.0 Couplers offer secure panel-mounting.
Electronic Sockets

Unshielded USB 2.0 Couplers offer secure panel-mounting.

Able to be mounted on virtually any panel thickness, models ECF504B-UAA (A-A, black), ECF504B-UBA (B-A, black), ECF504-UAA (A-A, beige), and ECF504-UBA (B-A, beige) allow USB cables to be passed through panels and enclosures. Unshielded products use ECF style flange-mount design and also feature 30 Â-µin., gold-plated contacts that promote connection reliability with repeated mating cycles.

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IC Socket accommodates 0.4 mm pitch, 56-pin QFN packages.
Electronic Sockets

IC Socket accommodates 0.4 mm pitch, 56-pin QFN packages.

Designed for 7 x 7 mm package size, Model DG-QFN56B-01 operates at bandwidths up to 40 GHz with less than 1 dB of insertion loss. Socket is constructed with shoulder screw, swivel lid, and diamond particle interconnect contactor capable of 100,000 insertions. Mounted on target PCB with no soldering, device operates from -70 to +200°C and dissipates 12 W with lid mounted heat sink and fan....

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Open Bottom PCB Receptacles feature organic fibre plugs.
Electronic Sockets

Open Bottom PCB Receptacles feature organic fibre plugs.

Available in 14 sizes/styles with precision-machined brass housing, OFP® Solder Barrier Receptacles are discrete sockets for through-hole soldering into printed circuit boards. Organic fibre plugs prevent solder, paste, or flux from contaminating internal contact during placing and soldering process. When device/mating lead is plugged into receptacle, OFP® is knocked out, allowing...

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Solderless LED Socket supports Nichia chip-on-board LEDs.
Electronic Sockets

Solderless LED Socket supports Nichia chip-on-board LEDs.

Providing mechanical and electrical connection of LED onto heat sink, Type NL2 Socket features poke-in wire termination method for 18-22 AWG solid, 18-20 AWG pre-bonded, and 18 AWG stranded wires. One-piece connector assembly has UV-resistant housing, molded polarity indicator, and cleared area designated for reflector mounting that accepts custom or commercially available optics. Applications...

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Electronic Sockets

BGA Socket connects all pins with 40 GHz bandwidth.

Used to socket 16 x 16 x 0.8 mm BGA packages on any application board, SM-BGA-9006 operates at bandwidths up to 40 GHz with less than 1 dB insertion loss. It dissipates few watts with compression screw and can be customized up to 100 W with modified fin design on top of screw and adding axial flow fan. Constructed with elastomer contactor, socket features shoulder screw and swivel lid that...

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Electronic Sockets

Hi-Temp CSP Sockets enable testing of any area-array device.

Accommodating use from -55 to +200°C, AR4HT Series incorporate low-profile (0.45 mm) contact structure that provides compliance for ATE testing and burn-in. Sockets work with various area-array devices, including BGA, LGA, QFN, DFN, CSP, MLCC, and POP, as well as bumped die with full and partial arrays. With life expectancy of 10,000+ actuations, products can accommodate IC devices with...

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Electronic Sockets

Elastomer BGA Socket is intended for testing eMMC devices.

Designed for testing 0.5 mm pitch, 14 x 18 mm eMMC BGA device, SG-BGA-7219 connects all pins with 10 GHz bandwidth and operates with less than 1 dB insertion loss. Contact resistance is 20 mohm per I/O (typ), and mounting is accomplished via supplied hardware on target PCB without any soldering. Quick insertion method, using shoulder screws and swivel socket lid, accelerates IC change-out, while...

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Electronic Sockets

BGA Socket accommodates 1 mm pitch, 1760 pin BGA IC's.

Designed for 42.5 x 42.5 mm package size, Model SG-BGA-6348 operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. Socket dissipates 35 W with active heat sinking and features contact resistance of 20 mW per pin, 0.01 pF capacitance to ground, and current capacity of 2 A per pin. Mounted on target PCB with no soldering, socket is constructed with screw mounting and has...

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Electronic Sockets

High Speed, High Density Demands Drive Evolution of Samtec's SEARAY(TM) Line

Samtec is continuing to evolve its line of SEARAY(TM) Open Pin Field Interconnects to support the demands of high speed applications requiring highly reliable, high pin count solutions. The latest additions to Samtec's SEARAY(TM) family are a Right Angle design ideal for perpendicular and high speed micro backplane applications and a Press-Fit design that combines the flexibility and convenience...

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