Electronic Sockets

Electrical Equipment & Systems

Hi-Temp CSP Sockets enable testing of any area-array device.

Accommodating use from -55 to +200°C, AR4HT Series incorporate low-profile (0.45 mm) contact structure that provides compliance for ATE testing and burn-in. Sockets work with various area-array devices, including BGA, LGA, QFN, DFN, CSP, MLCC, and POP, as well as bumped die with full and partial arrays. With life expectancy of 10,000+ actuations, products can accommodate IC devices with pitch of...

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Electrical Equipment & Systems

Elastomer BGA Socket is intended for testing eMMC devices.

Designed for testing 0.5 mm pitch, 14 x 18 mm eMMC BGA device, SG-BGA-7219 connects all pins with 10 GHz bandwidth and operates with less than 1 dB insertion loss. Contact resistance is 20 mohm per I/O (typ), and mounting is accomplished via supplied hardware on target PCB without any soldering. Quick insertion method, using shoulder screws and swivel socket lid, accelerates IC change-out, while...

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Electrical Equipment & Systems

BGA Socket accommodates 1 mm pitch, 1760 pin BGA IC's.

Designed for 42.5 x 42.5 mm package size, Model SG-BGA-6348 operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. Socket dissipates 35 W with active heat sinking and features contact resistance of 20 mW per pin, 0.01 pF capacitance to ground, and current capacity of 2 A per pin. Mounted on target PCB with no soldering, socket is constructed with screw mounting and has...

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Electrical Equipment & Systems

High Speed, High Density Demands Drive Evolution of Samtec's SEARAY(TM) Line

Samtec is continuing to evolve its line of SEARAY(TM) Open Pin Field Interconnects to support the demands of high speed applications requiring highly reliable, high pin count solutions. The latest additions to Samtec's SEARAY(TM) family are a Right Angle design ideal for perpendicular and high speed micro backplane applications and a Press-Fit design that combines the flexibility and convenience...

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Copper Infiltration Using Wrought Wire Infiltrant - Process and Productivity Improvements for Automotive Components
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Copper Infiltration Using Wrought Wire Infiltrant - Process and Productivity Improvements for Automotive Components

For the past 60 years, the use of copper infiltration on ferrous metals in powder metallurgy has been a popular method for manufacturing high performance components. Recently, a new twist on an old idea has been developed in the form of a new wrought copper alloy wire. With excellent infiltration response as well as the ability to improve numerous physical and mechanical properties of ferrous materials, this new technology presents many advantages for PM processing and production. In this comprehensive white paper, you will explore all you need to know about this material, including an in-depth look at its chemical and physical properties. Using automotive components as examples, the white paper examines the benefits of this new form of copper infiltration compared to more traditional infiltration methods. Download now, and discover if this new technology is the solution for your high performance component application.

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SMT LGA Socket accommodates Intel Core i7 and Xeon 5 CPUs.
Electrical Equipment & Systems

SMT LGA Socket accommodates Intel Core i7 and Xeon 5 CPUs.

Validated to Intel® design guides, SMT LGA 2011 socket is designed for Intel® Core(TM) i7 and Xeon 5 CPUs. Contacts include solder balls for surface mounting onto PCB, and hex-ball array promotes housing strength while minimizing occupied space. Integrated lever mechanism generates Z-axis compression load, and bolster plate limits PCB bowing during compression. Product is available with either...

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Electrical Equipment & Systems

Extreme Temperature Test Socket handles 4.5 x 4.5 mm QFN devices.

Designed to test 0.4 mm pitch, 32-lead QFN devices with center ground pad, Model CBT-QFN-7008 features temperature range of -55 to +155°C. Etched spring pin contactor, with cycle life of 500,000 insertions, provides 0.95 nH self inductance, insertion loss of less than 1 dB at 7 GHz, and 0.097 pF capacitance. Current capacity of each contactor is 4.1 A at 60°C temperature rise. In addition,...

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Shrink DIP .070 in. Pitch Strips come in right-angle options.
Electrical Equipment & Systems

Shrink DIP .070 in. Pitch Strips come in right-angle options.

Single-row, right-angle sockets and headers can be combined with vertical .070 in. pitch connectors for various interconnect configurations. Right-angle header and socket pair suit board edge daisy chain applications or mix-and-match with vertical sockets and headers for perpendicular mating of boards. With 871 series, sockets accept device leads as well as mate with 870 header series. Sockets...

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BGA IC Socket is designed for 27 x 27 mm package size.
Electrical Equipment & Systems

BGA IC Socket is designed for 27 x 27 mm package size.

Designed to socket 27 x 27 mm, 1 mm pitch, 616-pin BGA ICs on any PCB, SG-BGA-6346 operates at bandwidths up to 8 GHz with less than 1 dB insertion loss. Socket dissipates 4.5 W with passive heat sinking and 40 W with active. Contact resistance is 20 mohms typ per pin, and mounting to target PCB is accomplished without any soldering. Socket is constructed with shoulder screw and swivel lid, which...

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BGA Socket supports LTE femtocell SoCs.
Electrical Equipment & Systems

BGA Socket supports LTE femtocell SoCs.

Suited for hand test and temperature characterization as well as debugging in femtocell development, Model CBT-BGA-6015 has stamped spring pin contactor with 19 g actuation force per ball and cycle life of 500,000 insertions. Contactor features self inductance of 0.93 nH, insertion loss of less than 1 dB at 23.2 GHz, and contact resistance of less than 16 mW. Specific configuration of package to...

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Electrical Equipment & Systems

Extreme Temperature Socket accommodates 4 x 4 mm QFN device.

Addressing requirements for testing Amkor 24-lead QFN, CBT-QFN-7005 features stamped spring pin contactor with 26 g actuation force per ball and cycle life of 500,000 insertions. Contactor properties include 0.88 nH self inductance, less than 1 dB @ 15.7 GHz insertion loss, 0.097 pF capacitance, and 4 A @ 80°C temperature rise current capacity. Operating from -55 to +180°C, socket offers wave...

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