Test and Burn-In Socket suits applications up to 1 GHz.

Press Release Summary:

Test and Burn-In Socket accommodates devices from 41-55 mm² and lead pitches from 0.45-2.54 mm. Spring-loaded, cam-actuated pressure pad applies force against device after socket lid has been closed and latched. Reversing cam removes force prior to unlatching spring-loaded lid. With signal path of 1.92 mm during test, socket is suited for test and burn-in of IC devices such as SRAM, DRAM, DSP and Flash, as well as CSP, MicroBGA, LCC, LGA, QFP, QFN, and MLF packages.

Original Press Release:

New CSP Test and Burn-In Socket from Aries Accommodates Devices From 41 mm² to 55 mm²

Frenchtown, NJ, June 2005- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has introduced a test and burn-in socket that accommodates device packages from 41 mm2 up to 55 mm2 in applications up to 1 GHz. The new size, which features a standard molded socket format, is ideal for the test and burn-in of IC devices such as SRAM, DRAM, DSP and Flash, as well as packages including CSP, MicroBGA, LCC, LGA, QFP, QFN and MLF. The socket can accommodate lead pitches from 0.45 mm to 2.54 mm.

A spring-loaded, cam-actuated pressure pad applies force against the device after the socket lid has been closed and latched and the cam is in position. Reversing the cam removes the force prior to unlatching the spring-loaded lid.

The socket features easy mounting and removal from the burn-in board (BIB) via solderless pressure-mount compression spring probes accurately located by two molded plastic alignment pins and secured with four stainless steel screws.

The signal path of the new socket during test is only 1.92 mm (.077"). At pitches above 0.80 mm using a large probe, 1 dB of bandwidth at 1 GHz can be achieved. Operating temperature of the socket ranges from -55°C to +150°C (-67°F to +302°F), and estimated contact life is 500,000 cycles. The socket's molded components are UL94V-0 PEEK and/or Ultem.

Compression spring probes are heat-treated beryllium copper alloy, plated with 30 µ" min. (.75 µm) gold per Mil-G-45204 over 50 µ" min. (1.25 µm) nickel per QQ-N-290. This gold over nickel plating on the probes leaves very small witness marks on the bottom surface of the solder balls. The insertion force of spring probe contacts is 9 g to 12 g per contact for 0.50 mm to 0.75 mm pitches, and 17 g to 20 g per contact for 0.80 mm pitches and larger. All hardware is stainless steel.

As with all Aries sockets, the new burn-in and test socket is available in custom materials, platings, sizes and configurations to suit specific customer applications.

Pricing for a 50-lead socket starts at $68.25 per unit in quantities of 10. Delivery is four weeks ARO.

For additional information, contact Aries Electronics, Inc., P.O. Box 130, Frenchtown, NJ 08825. Tel: 908/996-6841; Fax: 908/996-3891; E-mail: info@arieselec.com; Web: www.arieselec.com, Data sheet #23017- www.arieselec.com/products/23017.pdf. Europe contact Tel: +44 870 240 0249; Email: europe@arieselec.com.

Headquartered in Frenchtown, NJ, Aries Electronics, Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip(TM) product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.

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