Press Release Summary:
Solderable Center Probe Socket provides 1.52 mm clearance for 0.80 mm and higher package pitch. It pressure mounts to adapter, which is soldered to pre-existing PCB footprint via standard reflow process. Socket features insertion loss of 1 dB up to 5 GHz and cycle life of over 100,000 insertions and withdrawals. Useful for virtually all packages up to 13 mm square, unit is particularly suited for SRAM and DRAM packages.
Original Press Release:
Aries Introduces Unique Solderable Center Probe Socket For Universal Device Package Debugging
Frenchtown, NJ, December 2004 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has announced the development of a unique, solderable center probe socket which enables users to debug a wide range of package types - BGA, UBGA, MLF, QFN and others - on the same package footprint. This new surface mount adapter securely connects to standard Aries center probe test sockets, providing a quick and highly reliable package test on populated PC boards.
The new debugging socket provides .060" (1.52mm) clearance for 0.80mm and higher package pitch. The socket pressure mounts to the adapter, which is soldered to the pre-existing PCB footprint via standard reflow process.
The new Aries debug socket features an insertion loss of only 1 dB up to 5 GHz. Socket cycle life is over 100,000 insertions and withdrawals. Useable for virtually all packages up to 13mm square, the new socket is particularly ideal for SRAM and DRAM packages.
Pricing for a new solderable center probe debug socket starts at $194 each at 100 pieces. Delivery is six weeks ARO.
For additional information, contact Aries Electronics, Inc., P.O. Box 130, Frenchtown, NJ 08825. Tel: 908/996-6841; Fax: 908/996-3891; E-mail: email@example.com; Web: www.arieselec.com, Data sheet #24013 - www.arieselec.com/products/24013.pdf.
Headquartered in Frenchtown, NJ, Aries Electronics, Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip(TM) product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.