BGA/LGA Socket includes customized heat sink.

Press Release Summary:




Suited for high-end graphics processors, 1,400-contact Pin-Ball Socket can be soldered directly to existing footprint of PC board. Aluminum heatsink provides thermal dissipation of excess heat generated by graphics processors. BGA/LGA socket provides 2 mm of clearance for end components and can be used for 0.80, 1.00, and 1.27 mm pitch packages up to 50 mm. It incorporates spring probe technology with spring force of 17 g at .025 in. deflection.



Original Press Release:



Aries Unveils 1400-Plus Ball High Density Pinball Socket with Heatsink for High-End Graphics Processors



Frenchtown, NJ, March 2005 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has introduced a high pin count (over 1400 ball) version of its unique PinBall Socket, featuring a customized heat sink, designed for high-end graphics processors.

The new Pin-Ball Socket can be soldered directly to the existing footprint of a PC board, further increasing packaging density. An Aluminum heatsink provides effective thermal dissipation of excess heat generated by the high performance graphics processors for which the socket is designed. The versatile BGA/LGA socket provides 2mm of clearance for end components and can be used for 0.80, 1.00 mm and 1.27 mm pitch packages up to 50 mm, in any footprint configuration and on any size board.

The new socket incorporates Aries high reliability spring probe technology, with a spring force of 17 grams at .025" deflection. The spring is BeCu alloy, and the pins are gold-plated brass alloy. The socket insulator is Torlon or PEEK with stainless steel hardware. The socket can be furnished with either a 2-bolt (for 15 mm packages and smaller) or 4-bolt (for 16-50 mm packages) hold-down.

Pricing for a 1400 contact Pin-Ball Socket is $1500 each (including heat sink) in single-piece quantities. Delivery is 4 weeks ARO.

For additional information, contact Aries Electronics, Inc., P.O. Box 130, Frenchtown, NJ 08825. Tel: 908/996-6841; Fax: 908/996-3891; E-mail: info@arieselec.com; Web:www.arieselec.com, Data sheet #25022- arieselec.com/products/25022.pdf.

Headquartered in Frenchtown, NJ, Aries Electronics, Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip(TM) product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.

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