Electronic Sockets

Electronic Sockets

LGA/BGA Socket offers optional built-in bias springs.

Land grid array/ball grid array (LGA/BGA) socket, suitable for ASIC applications, offers pressure mount contacts on top and bottom. Made from beryllium-copper alloy, with 30 micro in. gold per MIL-G-45204 over 50 micro in. nickel per QQ-N-290, socket also incorporates liquid crystal polymer (LCP). LGA/BGA socket is available in custom materials, plating, sizes, and configurations.

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PCB Interfaces provides up to 300 I/Os per connector.
Electronic Sockets

PCB Interfaces provides up to 300 I/Os per connector.

FleXYZ interfaces provide flexibility in X, Y, and Z axes by specifying number of rows, pins per row, and desired board spacing with standard interconnects. YTT Series headers and YTW Series board stackers mate with YTQ and YTS Series sockets to provide board spacings from 0.329 to 1.165 in. By using YTE Series elevated socket, board spacing can be increased to 1.705 in. Interconnects have 4-6...

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Electronic Sockets

Test Sockets are designed for high temperatures.

DIP Test Sockets, for 350°C and 500°C applications, have high temperature ceramic body and high conductivity stainless steel contacts. Normally closed contacts provide twin beam wiping action. They are plated with 50Â-µ in. gold over 50µ in. nickel. Sockets accept .300 in. center to .600 in. center row-row devices, up to 28 positions with leads on .100 in. pitch. They are...

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Electronic Sockets

BGA Sockets come with pitches of 1.00 or 1.27 mm.

Model BGA adapter has 3 polarizing locating pins for alignment of adapter with socket and 3-finger female contacts that provide wiping action. Socket has stamped and formed contact pins. When mated together, socket and adapter measure only 0.125 in. high. Extremely low insertion and withdrawal forces provided by gold-plated mating contact system, make socket and adapter suitable for high I/O or...

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Electronic Sockets

RF Test Sockets keep the pressure on.

Spring-loaded lids on radio frequency (RF) test sockets provide consistent lead pressure. Precise pressure requirements can be met with mix-and-match springs from 1/2 to 25 lbs. Each socket comes with floating leadbacker built into every lid, and lids can be used throughout RF/microwave, automated handling and burn-in/life testing applications. Each socket has Microstrip Contacts, which can be...

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Electronic Sockets

Test Sockets have contact force of 30 g.

RF high-frequency CSP/BGA test sockets have spring probe contacts that provide 500,000+ insertion/withdrawal cycles with no loss of contact force or increase in contact resistance. Sockets offer short signal paths of 0.098 in. for 1.00 mm and 1.27 mm pitch packages. Self-inductance of sockets is 0.62 nH and contact resistance is 30m Ohms after 500,000 cycles. Propagation delay is 45 psec and...

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