Electronic Sockets

Electronic Sockets

IC Socket tests high-speed devices.

Mounted in test fixture that suppresses reflection noise and power supply fluctuations, IC Socket employs micro-machining technology, minimizing self-inductance down to less than 0.4 nH. With device interface, high-speed devices with operating frequencies of over 1 GHz can be tested at-speed. Operating from -30 to 125°C, socket supports BGA, FBGA, and CSP packages as well as ball pitch .75, 0.8,...

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FB-DIMM Memory Socket enables server memory expansion.
Electronic Sockets

FB-DIMM Memory Socket enables server memory expansion.

Vertical memory module connectors accept DDR2 FB-DIMM (Fully Buffered Dual In-Line Memory Module) assemblies and have card-edge contact design that protects against stubbing. Enabling data rates to 4.8 Gbps, interface utilizes serial differential signaling. Sockets provide mechanical voltage keying and end latches for module retention and ejection. Designed to JEDEC Socket Outline SO-003,...

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Electronic Sockets

Test Socket suits devices from 28-40 mm

Measuring 3.507 x 2.750 x 1.759 in, RF Center Probe Test Socket offers manual testing of devices with pitches down to 0.50 mm, in applications with speeds from 1 GHz to over 18 GHz. Socket provides minimal signal loss via signal path of .077 in. Solderless, pressure-mount compression spring probes allow socket to be mounted to and removed from test board. Contact forces are 9-12 g per contact for...

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Electronic Sockets

Test and Burn-In Socket suits applications up to 1 GHz.

Test and Burn-In Socket accommodates devices from 41-55 mm-² and lead pitches from 0.45-2.54 mm. Spring-loaded, cam-actuated pressure pad applies force against device after socket lid has been closed and latched. Reversing cam removes force prior to unlatching spring-loaded lid. With signal path of 1.92 mm during test, socket is suited for test and burn-in of IC devices such as SRAM, DRAM, DSP...

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BGA/LGA Socket includes customized heat sink.
Electronic Sockets

BGA/LGA Socket includes customized heat sink.

Suited for high-end graphics processors, 1,400-contact Pin-Ball Socket can be soldered directly to existing footprint of PC board. Aluminum heatsink provides thermal dissipation of excess heat generated by graphics processors. BGA/LGA socket provides 2 mm of clearance for end components and can be used for 0.80, 1.00, and 1.27 mm pitch packages up to 50 mm. It incorporates spring probe technology...

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Transistor Sockets offer simple installation.
Electronic Sockets

Transistor Sockets offer simple installation.

Low-profile, TO-3 Power Transistor Sockets aid in installation of JEDEC-TO-3 MPM Power Transistors by eliminating need to use insulated bushings. Design incorporates collector strip terminal with 6-20 formed threads at either end of socket to facilitate mounting. Additional design elements include nylon tops to accommodate .030, .045, and .090 in. chassis thicknesses and electro-plated, spring...

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Electronic Sockets

Sockets protect image sensors during board processing.

Offered in standard, footprint-specific, and custom configurations, image sensor sockets feature screw-machined terminals and multi-fingered contacts. Standard sockets are available in FR-4 insulators in thru-hole and surface-mount designs. With options such as molded or Peel-A-Way® insulators and lead-free designs, products are suited for applications from scanners to security systems to...

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Electronic Sockets

Center Probe Socket debugs range of package types.

Solderable Center Probe Socket provides 1.52 mm clearance for 0.80 mm and higher package pitch. It pressure mounts to adapter, which is soldered to pre-existing PCB footprint via standard reflow process. Socket features insertion loss of 1 dB up to 5 GHz and cycle life of over 100,000 insertions and withdrawals. Useful for virtually all packages up to 13 mm square, unit is particularly suited for...

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Retention Mechanism protects graphics card.
Electronic Sockets

Retention Mechanism protects graphics card.

Board-level retention mechanism for PCI Express graphics cards protects against electrical interrupts and mechanical damage caused by system-level shocks and vibration. Flexible arm extends away from slot and includes molded post that snaps into notch on bottom of add-in card. Device solders to motherboard adjacent to x16 PCI Express card edge connector, and engages with hockey stick shaped hook...

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SMT Socket offers current rating of 7 A.
Electronic Sockets

SMT Socket offers current rating of 7 A.

Able to accommodate power or signal connection, SMT Bottom Entry, Through Board Socket is suited for high density applications and demanding environments. Mating pin sizes include 0.025 in. square and 0.027-0.032 in. diameter round pins. Material is 0.0005 in. thick beryllium copper with bright tin finish over copper. Socket is available in tape and reel in standard tape pocket format, allowing...

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