Electronic Sockets

Electrical Equipment & Systems

DDR4 DIMM Socket reduces intermittent signal issues.

Providing reliable contact, JEDEC-compliant FCN-07 series improves intermatability between DDR4 memory card and PCB socket. Split-beam contact structure provides two points of contact on inserted memory card to ensure there are no intermittent signals due to dust particles, flux, or vibration during system start-up or life of project. With 2.4 mm (max) module seating plane, these 141 x 6.50 x...

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QFN Socket accommodates 6 x 6 mm package size.
Electrical Equipment & Systems

QFN Socket accommodates 6 x 6 mm package size.

Available for 0.5 mm pitch QFN40, Model CG-QFN-7009 operates at bandwidth up to 10 GHz with less than 1 dB of insertion loss. Socket features single latch snap lid with integrated spring loaded compression mechanism. Spring force can be adjusted for varying package thicknesses using set screw on top of lid. Mounted using supplied hardware on target PCB with no soldering, socket features contact...

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Copper Infiltration Using Wrought Wire Infiltrant - Process and Productivity Improvements for Automotive Components
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Copper Infiltration Using Wrought Wire Infiltrant - Process and Productivity Improvements for Automotive Components

For the past 60 years, the use of copper infiltration on ferrous metals in powder metallurgy has been a popular method for manufacturing high performance components. Recently, a new twist on an old idea has been developed in the form of a new wrought copper alloy wire. With excellent infiltration response as well as the ability to improve numerous physical and mechanical properties of ferrous materials, this new technology presents many advantages for PM processing and production. In this comprehensive white paper, you will explore all you need to know about this material, including an in-depth look at its chemical and physical properties. Using automotive components as examples, the white paper examines the benefits of this new form of copper infiltration compared to more traditional infiltration methods. Download now, and discover if this new technology is the solution for your high performance component application.

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SMT Socket accommodates wide range of pins.
Electrical Equipment & Systems

SMT Socket accommodates wide range of pins.

Designed to accommodate mating pins ranging from 0.8–1.5 mm in diameter, EZ-BoardWare PCB Socket is intended for SMT assembly and suited for high-volume applications. Contacts are stackable on 2.54 mm pitch spacing. Design features 2-point contact system which ensures secure retention while facilitating removal and replacement of socketed component. Supplied in industry-standard tape and reel...

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DDR3 SDRAM Socket accepts 0.8 mm pitch, 96-pin BGA ICs.
Electrical Equipment & Systems

DDR3 SDRAM Socket accepts 0.8 mm pitch, 96-pin BGA ICs.

Able to socket 8 x 14 mm, 7.5 x 13 mm, 9 x 13 mm, and 9 x 16 mm ICs with BGA package on any PCB without any soldering, SG-BGA-6410 operates at bandwidths up to 8 GHz with less than 1dB insertion loss. Design dissipates up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Footprint adds 2.5 mm on each side, and construction includes shoulder screw and...

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BGA Socket supports 1 mm pitch, 1924 pin BGA ICs.
Electrical Equipment & Systems

BGA Socket supports 1 mm pitch, 1924 pin BGA ICs.

Accommodating 45 x 45 mm and 47.5 x 47.5 mm package sizes, Model SG-BGA-6409 operates at bandwidths up to 8 GHz with less than 1 dB insertion loss. Socket can dissipate up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink. Constructed with shoulder screw and swivel lid, socket is mounted on target PCB with no soldering. Device offers contact resistance...

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Clamshell Spring Pin BGA Socket accommodates 36-ball FCCSP.
Electrical Equipment & Systems

Clamshell Spring Pin BGA Socket accommodates 36-ball FCCSP.

Operating from -55 to +180°C, CBT-BGA-7501 is configured to test 2.4 x 2.4 mm BGA package with 0.4 mm pitch, 36-position, 6 x 6 ball array configuration. Spring pin contactor, stamped with 14.3 g actuation force per ball, has cycle life of 125,000 insertions, self inductance of 0.98 nH, and insertion loss < 1 dB at 31.7 GHz. Current capacity of each contactor is 1.8 A @ 30°C temperature rise....

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BGA Socket accommodates 153-pin, 0.5 mm pitch, 8 GB ICs.
Electrical Equipment & Systems

BGA Socket accommodates 153-pin, 0.5 mm pitch, 8 GB ICs.

RoHS-compliant SFS-BGA153B-52 allows 0.5 mm pitch, 11.5 x 13 mm body, 14 x 14 array e-MMC module product housed in 153 ball BGA package to be placed in socket and operated without compromising performance in memory applications. Giga-snaP™ BGA socket adapter pair consists of SFS-BGA153B-52 female BGA sockets with BeCu pins assembled into substrate that matches male pin LSS-BGA153B-51 adapter....

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Precision Machined Parts for High Tech Applications
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Precision Machined Parts for High Tech Applications

For precision and value that sets the standard for quality and craftsmanship, EGS Production Machining is the source for precision and value. Our extensive capabilities and dedication to customer service allow us to deliver the optimal manufacturing solution. See our video to learn more.

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