Electronic Sockets

Electronic Sockets

QFN Sockets are suited for 0.5 mm pitch BGA 256 pin IC's.

Designed for 8 X 8 mm package size, SG-BGA-7121 and SG-BGA-7122 operate at bandwidths up to 10 GHz with less than 1 dB of insertion loss. Sockets dissipate several Watts without extra heat sinking and can handle up to 100 W with custom heat sink. Constructed with elastomer contactor, temperature range is -40°C to +100°C, pin self inductance is 0.11 nH, and mutual inductance is 0.028...

Read More »
Test Socket Contact features self-cleaning design.
Electronic Sockets

Test Socket Contact features self-cleaning design.

Suited for testing QFNs, MLFs, and other leadless devices, Synergetix Dyno Contact(TM) features monolithic design, which scrubs across surface of device lead, penetrating contaminants through hundreds of thousands of insertions. Unit is plated with Endura Plating process, which offers resistance to intermetallic contamination. Contact provides 500,000 mechanical life cycles and contact resistance...

Read More »
Interposers suit wafer-level chip scale package testing.
Electronic Sockets

Interposers suit wafer-level chip scale package testing.

Consisting of plastic assembly containing semiconductor probe technology, Synergetix Test Socket Interposers facilitate testing of WLCSPs in vertical probing applications. Extremely linear compression against wafer helps maximize mechanical life. Suited for high-current applications, interposers feature average cleaning cycle of every 50,000 touchdowns, and contact replacement is rarely necessary...

Read More »
Electronic Sockets

Center Probe Test Socket facilitates device burn-in.

Accommodating devicea 6.5 mm or smaller, high-frequency center probe test socket is suited for use with test and dynamic burn-in of CSP/MicroBGA/DSP/LGA/SRAM/DRAM/Flash devices. Socket is comprised of compression spring probes made of heat-treated beryllium-copper alloy plated with 0.75 Â-µm gold per Mil-G-45204 over 0.75 µm nickel per SAE-AMS-QQ-N-290. Spring probes feature contact...

Read More »
Electronic Sockets

QFN Socket operates at bandwidths up to 40 GHz.

Designed for 0.5 mm pitch QFN 24 pin IC's, DG-QFN24C-01 socket comes in 4 x 4 mm package with less than 1 dB of insertion loss. Constructed with low inductance diamond particle interconnect contactor, it can dissipate up to several watts without extra heat sinking and handle up to 100 W with custom heat sink. Unit features operating temperature range of -70 to +200°C and contact resistance...

Read More »
Samtec Adds New Rugged, Power & I/O Interconnect Products
Electronic Sockets

Samtec Adds New Rugged, Power & I/O Interconnect Products

Samtec has added new rugged interface products, including PowerStrip/35 high power interconnects, AccliMate(TM) and LifeJack(TM) I/O interfaces and Tiger Eye micro rugged discrete wire system, to its standard product offering. PowerStrip/35 high power connector strips (PES/PET Series) can handle up to 35 amps and are available as an all power interface, or as a combination signal/power system...

Read More »
Aries Electronics' New Test and Burn-In and RF Sockets
Electronic Sockets

Aries Electronics' New Test and Burn-In and RF Sockets

Bristol, Pa. September 2008 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has recently updated its CSP/BGA test and burn-in and RF sockets, including 13 mm squared, 27 mm squared, 40 mm squared and 55 mm squared models, to accommodate devices with pitches down to 0.3 mm. With this new pitch capability, Aries' sockets are suitable...

Read More »
Electronic Sockets

BGA Socket has cycle life of 500,000 insertions.

Designed for 11 x 11 mm, 0.65 mm pitch, 15 x 15 array 225 balls, ASE 225 LTFBGA SS-BGA225G-01 is 10 GHz high endurance socket that can be used for hand test and burn-in applications. With 16 g actuation force per ball and -40 to +150°C temperature range, spring pin contactor has self inductance of 1.3 nH, insertion loss of less than 0.25 dB at 4.5 GHz (less than 3dB at 10GHz), capacitance...

Read More »
Electronic Sockets

Test Sockets accommodate devices with pitches down to 0.3 mm.

RF test sockets, for use with PCBs, and CSP/BGA test and burn-in sockets, for use with burn-in-boards (BIB), feature solderless, gold over nickel-plated pressure mount compression spring probes that are mounted with 4 SS screws, which allows for height variations in device thickness. Units also include 4-point spring probe crown to insure scrub on solder ball oxides. Signal path during test is...

Read More »
Electronic Sockets

Socket is designed for use with silicon USB blades.

Suited for military and industrial applications, SBS Series SiliconBlade Socket can be used with SiliconDrive II USB Blade. Rugged, lightweight, and vertical unit includes Edge Rate contact system which offers Signal Integrity with high impedance control, reduced broadside coupling, and vibration dampening features. Deep polarizing guide rails add mechanical support and assure proper USB Blade...

Read More »
Triad's JSU Series of Power Supplies Provide Robust, Low Cost Solutions
Sponsored

Triad's JSU Series of Power Supplies Provide Robust, Low Cost Solutions

Triad Magnetics is an established leader in power supply innovation, offering product lines that span a wide range of diverse industries and applications. Adding to their long list of successful product launches, Triad announces the release of the new cutting-edge JSU Series of power supplies. To learn about all of its advantages and advanced features, see our video.

Read More »

All Topics