Electronic Sockets

BGA Package Converter speeds system board development.
Electronic Sockets

BGA Package Converter speeds system board development.

Model PC-BGA256B/BGA256E-B-01 is designed to receive 23 x 23 mm BGA, 16 x 16 array, 1.27 mm pitch on top and converts 1:1 pin mapping to 17 x 17 mm BGA, 16 x 16 array, 1 mm pitch on bottom, allowing new development system board to be tested with previous version of BGA device. Convertor can also be reversed by removing solder balls from 1 mm pitch side and adding them on 1.27 mm pitch side, and...

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Electronic Sockets

Elastomer Socket accommodates 0.5 mm pitch, 25-pin WCSP.

Designed for 2.75 x 2.75 mm package size, Model SG-BGA-7188 verifies function of IC in development system. Unit operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss and contact resistance of 20 mW per I/O. Mounted using supplied hardware on target PCB with no soldering, socket incorporates quick insertion method using integrated compression plate. Temperature range is -35 to...

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Electronic Sockets

BGA Socket provides accessibility for thermal control.

Designed for 13.5 x 8 x 1.2 mm package, Model SG-BGA-7199 supports 0.65 mm pitch 176 ball BGA and operates at bandwidths up to 10 GHz with less than 1 dB insertion loss. Contact resistance is typically 20 mW per I/O. Socket incorporates quick insertion method and has mechanism for attaching thermal stream accessories. Operating from -35 to +100°C, device verifies function of IC in...

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QFN Socket survives temperatures from -55 to +155°C.
Electronic Sockets

QFN Socket survives temperatures from -55 to +155°C.

Addressing performance requirements for 0.4 mm pitch devices, SBT-QFN-4008 is designed to JEDEC STD.MO-220 and features contact design with outside spring and flat etched plungers. Contactor is stamped spring pin with 34 g actuation force per pin and cycle life of 100,000 insertions. Self inductance of contactor is 1 nH, insertion loss is less than 1 dB at 7 GHz, and capacitance is 0.4 pF....

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Stamped Spring Pin Socket enables UART testing to 5 Mbps @ 1.8 V.
Electronic Sockets

Stamped Spring Pin Socket enables UART testing to 5 Mbps @ 1.8 V.

Designed for testing 7 x 7 mm QFN packages with 0.5 mm pitch, 48 positions, and center ground pad, CBT-QFN-7002 addresses requirements for testing UART serial to parallel data converter. Contactor consists of stamped spring pin with 26 g actuation force per ball and cycle life of 500,000 insertions; self inductance is 0.88 nH, insertion loss is less than 1 dB at 15.7 GHz, and capacitance is 0.097...

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Semiconductor Test Socket has modular design.
Electronic Sockets

Semiconductor Test Socket has modular design.

Y-RED volume test socket features top side removable insert and tool-free cover mounting to minimize changeover times when testing semiconductors. Unit includes spring probe with crown plunger tip for BGA, and conical plunger tip for LGA and QFN packages. Its 2-piece pin has contact resistance below 50 mW and is stable for up to 500,000 mating cycles. Available for standard temperature range of...

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BGA Socket is designed for 0.4 mm pitch 221 pin BGA.
Electronic Sockets

BGA Socket is designed for 0.4 mm pitch 221 pin BGA.

Designed for 7.5 x 7.5 x 0.82 mm package size, SG-BGA-7163 helps test IC for monolithic integration of GSM Baseband, RF transceiver, mixed signal, power management and RAM in a single-chip. Socket operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss and offers typical contact resistance of 20 mW per I/O. Mounted on PCB using supplied hardware without soldering, socket offers...

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Double Stacked BGA Socket simultaneously tests processor and memory.
Electronic Sockets

Double Stacked BGA Socket simultaneously tests processor and memory.

Facilitating simultaneous testing of processor and memory, CBT-BGA-7002 has stamped spring pin contactor with 26 g actuation force per ball and cycle life of 500,000 insertions. Self inductance of contactor is 0.88 nH, insertion loss is less than 1 dB at 15.7 GHz, and capacitance is 0.097 pF. Featuring floating guide for precise ball to pin alignment, socket is mounted using supplied hardware on...

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BGA Socket is designed for 1 GB Mobile DDR2-S4 SDRAM.
Electronic Sockets

BGA Socket is designed for 1 GB Mobile DDR2-S4 SDRAM.

Suited for high speed probing of memory chip and debugging of system during design phase, SG-BGA-7182 socket offers typical contact resistance of 20 mW per I/O and connects all pins with 10 GHz bandwidth on all connections. Compact socket is mounted using supplied hardware on target PCB with no soldering, and incorporates quick insertion method, enabling fast changeover of ICs. Temperature range...

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BGA Clamshell Socket operates at bandwidths up to 10 GHz.
Electronic Sockets

BGA Clamshell Socket operates at bandwidths up to 10 GHz.

Designed for 8 x 8 mm package size, CG-BGA-5009 socket for 0.4 mm pitch BGA 400 pin ICs connects all pins with 10 GHz bandwidth on all connections, with less than 1 dB of insertion loss. Socket offers pin self inductance of 0.11 nH and mutual inductance of 0.028 nH, 0.028 pF capacitance to ground, and current capacity of 2 A per pin. Featuring integrated heat sinking mechanism, unit has -35 to...

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