Chip Sets

Circuits

Wireless Charging Chipset supports multi-mode operation.

Comprising power electronics, supervisory circuit, and resonator, multi-mode Model MT3188 is compatible with A4WP resonant wireless charging standard as well as Wireless Power Consortium and Power Matters Alliance inductive wireless charging standards. ICÂ- can be mounted on mobile device's main PCB or battery cover, and provides programmable output voltage from 1.5–5 V at 1.4 A....

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Data and Database Management Software

DSP Group at MWC 2015: Enabling Best-in-Class Voice Enhancement and Always-On Solutions for Mobile, Wearable and IoT Applications

LOS ALTOS, Calif.Â- — DSP Group®, Inc. (Nasdaq:DSPG) a leading global provider of wireless chipset solutions for converged communications, will showcase its portfolio of leading solutions for mobile, wearable and IoT applications at Mobile World Congress 2015. Addressing the growing demand for always-on smart voice and sensor fusion in both mobile devices and IoT applications, and...

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Circuits

Peraso PRS4000 Baseband SOC Selected by InterDigital for mm-Wave Mesh Backhaul

Innovative WiGig Solution Unveiled at Mobile World Congress 2015 TORONTOÂ- — Peraso Technologies Inc. a fabless semiconductor company specializing in the development of mm-wave wireless chipsets, announced today that InterDigital, a mobile technology research and development company, has selected its PRS4000 series of baseband SOCs as an integral component for their innovative backhaul...

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Communication Systems

Samsung Launches New Global Mass Market Galaxy J1 LTE Smartphone Powered by Marvell's Industry-Leading ARMADA Mobile PXA1908 Platform

Marvell's cost optimized quad-core 64-bit ARMADA Mobile PXA1908 platform features field proven 5-mode 4G LTE modem, integrated location and sensor fusion hub, and advanced ISP technology and supports the latest Android L operating system SANTA CLARA, Calif.,Â- – Marvell (NASDAQ:MRVL) - a worldwide leader in providing complete silicon solutions from mobile communications to storage,...

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Semiconductors

SK Telecom and Broadcom Enable First 4G LTE Small Cells with Carrier Aggregation Features

Innovative 4G LTE Small Cells Deliver Seamless Mobile Experience IRVINE, Calif. –Â- Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced that SK Telecom, Korea's largest telecommunications company, has selected Broadcom's latest small cell system-on-chip (SoC) devices with carrier...

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Circuits

LTE Chipsets support cellular Internet of Things and M2M.

Consisting of Category-1 and Category-0 chipsets, respectively, FourGee-1160 and FourGee-1150 feature low power consumption, extending battery operation. Units include embedded MCU subsystem with virtualized, customizable application layer and optimized security framework. Devices support VoLTE, OTDOA positioning, and seamless integration with industry standard GPS and A-GNSS chipsets. Featuring...

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Chip Sets

Asem Implements Valens' HDBaseT Technology for Improved Performance in the Industrial PC Market

NURNBERG, Germany –Â- EMBEDDED WORLD - Valens, the developer of HDBaseT™ technology, and Asem, leading industrial automation player in Europe, announced today that Asem has integrated Valens' Colligo HDBaseT chipsets for the delivery of uncompressed audio video, controls, USB, Ethernet and power, to displays located up to 100m away from the source equipment. With the Valens'...

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Circuits

Spreadtrum Announces Support for Tizen Operating System

Samsung's Z1, its first Tizen smartphone now launched in India, combines Spreadtrum's WCDMA chipsets with the Tizen operating system SHANGHAI –Â- Spreadtrum Communications, a leading fabless semiconductor company in China with advanced technology in 2G, 3G and 4G wireless communications standards, today announced that it has successfully completed the integration of the Tizen...

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Programmable Logic Controllers

Xilinx and Over 30 Alliance Program Members to Showcase Zynq All Programmable SoC Solutions at Embedded World 2015

Presentations and demonstrations to feature solutions for smarter automotive, industrial, and vision-based applications SAN JOSE, Calif.,Â- – Xilinx, Inc. (NASDAQ: XLNX) and over 30 Alliance Program Members will showcase Zynq® All Programmable SoCs at Embedded World 2015. Through a series of presentations and demonstrations, Xilinx will feature solutions for smarter automotive,...

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Image Processors

OmniVision and ASTRI Collaborate to Produce Heads-Up Display for Next Generation Automotive Applications

OVP7200 and OVP921 Enable Compact Design and Deliver 720p HD Video to ASTRI's New Heads-Up Display LAS VEGAS - OmniVision Technologies, Inc. (NASDAQ: OVTI), a leading developer of advanced digital imaging solutions, today announced from the Consumer Electronics Show in Las Vegas, that its high definition (HD) OVP7200 and OVP921 liquid-crystal on silicon (LCOS) chipset will be used in an...

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