DLP Chipsets support 3D printing and lithography applications.
Programmable by DLPC900 controller, Model DLP9000 offers 4 million pixels, or 2,560 x 1,600 micromirror array, while Model DLP6500 provides up to 2 million pixels, or 1,920 x 1,080 micromirror array. Both digital micromirror devices feature programmable pattern rates up to 9,500 Hz for fast 3D measurements and product builds. Optimized for wavelengths from 400–700 nm, chipsets are compatible...
Read More »ALi Presents Combo Satellite and Terrestrial Solutions Targeting African Markets
Taipei- – ALi Corporation, a leading Set-Top Box (STB) chipset solution provider, today announced it will showcase a series of solutions specially tailored for African countries at AfricaCast 2014. Today, many African countries are racing against time to ready themselves for the migration from analogue to digital broadcasting as the 2015 deadline for the switch-off is imminent. According to...
Read More »DSP Group's SoC Power SGW's Advanced Video-Over-ULE
DSP Group's Video-Over- ULE Solutions Offer Better Image Resolution and a Higher Frame Rate at an Affordable Price, Ideally Suited to IoT Applications LOS ALTOS, Calif. –- DSP Group-®, Inc. (Nasdaq:DSPG), a leading global provider of wireless chipset solutions for converged communications, announced today that Shenzhen Guo Wei Electronics Co. (SGW) a designer and manufacturer of...
Read More »Xilinx Demonstrates All Programmable Embedded Solutions for Machine Vision Applications at Vision Stuttgart 2014
SAN JOSE, Calif.- – Xilinx, Inc. (NASDAQ: XLNX) will demonstrate All Programmable embedded solutions for machine vision applications at Vision Stuttgart 2014. Through a series of demonstrations and presentations, Xilinx with their customers and ecosystem, will highlight the performance and flexibility of the Zynq-® All Programmable SoC in vision applications. The Zynq devices are chosen by...
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Everything You Need to Know About E-Textiles
This ebook provides an in-depth overview into everything you need to know about E-Textiles.
Read More »Application Processors target tablets and OTT set-top boxes.
Employing 28 nm LP process technology, OWL Series ATM7039s and ATM7059 feature quad-core ARM-® Cortex™ A9 CPU, PowerVR GPU core from Imagination Technologies, and 2K x 4K super high resolution decoding. Chipsets extend battery life and will support Android Lollipop operating system. In addition to low and mid-tier Android-® tablets, products are suited for OTT set-top boxes, smart monitors,...
Read More »Ultra Low Energy SoC targets IoT applications.
Integrating with home gateways based on Intel's Puma™ 6 SoC, ULE Solution provides full home coverage on dedicated interference-free RF spectrum. Product enables rich voice and visual content to be transferred from nodes to base and vice versa. Software-upgradable from standard DECT, which already exists in more than 25 million home gateways, ULE Solution eliminates need to add second...
Read More »DSL Chipset delivers broadband over installed copper cabling.
Built on 28 nm process technology, BCM65200 DSP and BCM65900 AFE VDSL Chipset offers solution for high-density G.vector DSLAMs as well as G.fast-based fiber-to-the-distribution point architectures. Chipset incorporates up to 36 lines of VDSL2 or 6 lines of G.fast, plus high-speed vector interfaces that eliminate need for external PHY and framing devices. Backward-compatible to existing VDSL/ADSL...
Read More »Tollgrade and Lantiq Offer Next Generation DSL Line Testing for All-IP Networks
Industry First end-to-end solution ushers in a new era of testing capabilities for high-speed DSL networks AMSTERDAM - Tollgrade Communications, Inc. and Lantiq announced today that they have partnered to offer broadband carriers a best-in-class, seamless and standardized line testing solution for Next Generation Networks (NGN). The solution combines Lantiq's MELT chipsets with Tollgrade's...
Read More »Broadcom Showcases End-to-End Automotive Connectivity Portfolio at Detroit SAE Convergence Event
Live Demonstration of Industry Leading Wired and Wireless Solutions Powering the World's Top Automotive Brands DETROIT –- At the 2014 SAE Convergence Conference Exhibition, Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, will showcase its full line of automotive connectivity technologies, including its...
Read More »Xilinx Showcases All Programmable Solutions for 400GE Applications at WDM Dallas 2014
SAN JOSE, Calif. –- Xilinx, Inc. (NASDAQ: XLNX) will showcase All Programmable solutions for 400GE applications at WDM Dallas 2014. Featured at the event will be the industry's first single chip 400GE solution from Xilinx utilizing Virtex-® UltraScale™ providing unprecedented levels of performance, system integration, and bandwidth. This demonstration will complement Xilinx presentations...
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What Can Test Devices Spin for You?
Test Devices helps you ensure the safety and efficiency of your high performance machines with cutting edge spin testing, rotor engineering, and precision balancing capabilities. Check out the video to learn more.
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