Chip Sets

Agere's Innovative Technology Enables Samsung to Roll Out World's Thinnest Cell Phones

ALLENTOWN, Pa., Dec. 6 /- Samsung Electronics has delivered to market the thinnest cell phone ever made. Incorporating Agere Systems' (NYSE:AGR) innovative chip packaging design, Samsung could make Ultra Edition 6.9 (X820 bar design) and Ultra Edition 9.9 (D830 clamshell design) cell phones the thinnest ever among its form factors. The technique is called package-on-package (stacking) in which a...

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Anadigics' Advanced Power Amplifiers Support Qualcomm's HSPA Solutions

ANADIGICS' Power Amplifiers Selected for MSM7200 HSUPA and MSM6280 HSDPA Reference Designs from QUALCOMM WARREN, N.J., Dec. 4 /- ANADIGICS, Inc. (NASDAQ:ANAD), a leading supplier of wireless and broadband solutions, today announced that the Company's WCDMA and GPRS/EDGE power amplifiers (PAs) have been specified by QUALCOMM for the Mobile Station Modem(TM) (MSM(TM)) MSM7200(TM) and MSM6280(TM)...

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STMicroelectronics Demonstrates Prototype Microchip Capable of Biological Sample Preparation and Manipulation

Silicon chip selectively collects and moves biological molecules, heralding cost-effective automated sample preparation for medical diagnostics GENEVA, Nov. 30 -- STMicroelectronics (NYSE:STM), one of the world's leading suppliers of microfluidic devices, has announced that it has designed a complete prototype device able to collect and manipulate specific biological molecules. Combined with ST's...

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Chipset supports 802.11n consumer electronics.

Designed for consumer electronic devices found in home networks, WLANPlus(TM) dual-band chipset supports both 2.4 and 5 GHz. It is fully compliant with 802.11n standard draft, 802.11a/b/g-based legacy devices, 802.11h (radar detection), 802.11i (security), and 802.11e Quality of Service. To double network coverage in home environment, WLANPlus solution also features Maximum Likelihood slicer and...

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Vicor V-·I Chip Components Reduce Energy Costs

Increase Efficiency and Power Density Andover, MA, November 13, 2006...Vicor Corporation (NASDAQ: VICR) today announced the availability of a full family of VÂ-·I Chip(TM) components, enabling complete power systems using Factorized Power Architecture (FPA). FPA separates or 'factorizes' regulation and voltage transformation functions into flexible, high-performance building blocks. VÂ-·I...

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Chipset supports Draft 2.0 of IEEE 802.11n standard.

Offering backward compatibility to 802.11 a/b/g and Draft 1.0 of 802.11n, Model AGN400(TM) enables development of PC OEM products that connect with all devices supporting any form of 802.11 standards. Featuring True MIMO Gen-N technology, chipset also supports interface buses for OEM products in retail, PC OEM, enterprise, consumer electronics, and service provider market segments.

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LVDS SerDes Chipsets feature embedded clock architecture.

Eliminating need for second oscillator, Model DS90UR241 serializer and DS90UR124 deserializer chipset serializes 24 bits of data over single differential pair (2 wires) at data rate of 1.03 Gbps. SerDes chipset drives high-quality video data over 10 m of cable. Features include random data lock feature that enables quick recovery from datastream disruptions, at-speed BIST link diagnostics, and...

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QUALCOMM Brings Broadband Mobility to an Expanded Range of Devices

- Company's New Snapdragon Platform to be a Catalyst for Future Innovation in Computing and Consumer Electronics - SAN DIEGO, Nov. 13 -- QUALCOMM Incorporated (NASDAQ:QCOM), a leading developer and innovator of advanced wireless technologies and data solutions, today announced a significant step toward realizing the Company's vision of universal mobility by introducing its Snapdragon(TM)...

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Atheros XSPAN Technology Featured in Industry's First Embedded Draft 1.0 802.11n Enterprise-Class Notebooks

New Lenovo ThinkPad Notebooks Offer Market-Leading Wireless Connectivity SANTA CLARA, Calif., Nov. 6 -- Atheros Communications, Inc. (NASDAQ:ATHR), a leading developer of advanced wireless solutions, today announced that Lenovo has introduced several new enterprise- class notebooks within the ThinkPad T60, R60, X60 and Z61 series featuring Atheros' XSPAN(TM) draft 1.0 802.11n wireless LAN (WLAN)...

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Metalink to Demonstrate Wireless Distribution of High-Definition Video at AeA Conference

Metalink's 802.11n WLANPlus Enables the Wireless Distribution of Multiple HD Video Streams With Wireline Quality Throughout the Home YAKUM, Israel, October 30 -- Metalink Ltd. (NASDAQ: MTLK), a provider of high-performance wireless and wireline broadband communication silicon solutions, today announced that it will be presenting at the AeA Classic Financial Conference at the Portola Plaza Hotel,...

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