Broadcom HEVC Technology Powers India's First Ultra HD Set-top Box Deployment from Tata Sky and Technicolor
Poised to Deliver Immersive Home Entertainment Experience to India TV Subscribers IRVINE, Calif. –Â- Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced that its BCM7252 high-efficiency video codec (HEVC) H.265 system-on-chip (SoC) will power Tata Sky's first generation Ultra HD set-top boxes...
Read More »ALi Partners with Prime to Provide Set-top Boxes Targeting Emerging Markets
TaipeiÂ- – ALi Corporation, a leading Set-Top Box (STB) solution provider, today announced it has joined forces with Prime Electronics and Satellitics Inc., a reputed manufacturer specialized in developing and manufacturing digital communication products, to provide various set-top box solutions targeting emerging markets worldwide. Mass production shipping of a DVB-T2 set-top box solution...
Read More »Converter Chipset drives dual DSI-ready LCDs.
Measuring 7.0 x 7.0 x 1.2 mm with 0.65 mm ball pitch, Model TC358870XBG enables direct 4K HDMI video input to LCDs with MIPI dual Display Serial Interface, allowing small form factor, high-resolution mobile displays to be used in consumer and industrial applications. Device's 297 MHz HDMI input supports up to 3,840 x 2,160Â- @ 24 bpp at refresh rate of 30 fps and 2,560 x 1,600 @ 24...
Read More »Reduce Cost and Weight of Cabling in Automotive Infotainment Applications with Serializer/Deserializer (SerDes) Chipsets
Maxim Integrated's automotive SerDes chipsets enable both shielded twisted pair (STP) and coax cabling, maximizing design flexibility. SAN JOSE, Calif.Â- – Engineers can now design high-resolution automotive infotainment applications with either traditional STP or lighter, less expensive coax cables using a new family of Gigabit Multimedia Serial Link (GMSL) SerDes chipsets from Maxim...
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Advantages of Thermoset Plastics vs. Engineered Thermoplastics and Metal Parts
Thermosets and engineered thermoplastics are sometimes better suited to differing situations, but they do have some overlap in relevant use cases.
Read More »RDIMM and LRDIMM Chipsets support Intel Xeon processors.
Fully compliant with DDR4 JEDEC 1.0 specification, DDR4 RDIMM and LRDIMM Chipsets support Intel's Xeon Processor ES-2600 V3 product family. Products include DDR4 Registering Clock Driver and DDR4 Data Buffers. DDR4 LRDIMM, with one central RCD and 9 Data Buffers for each individual byte lane, can operate at 1 or 2 speed grades faster than comparable RDIMM. Chipsets target high performance...
Read More »Sales of Digital Cinema Projectors with Award-winning DLP Cinema® Technology Surpass 100,000-Screen Milestone
Major achievement recognized in pursuit of TI's vision to convert the motion picture industry from film-based projection to digital cinema LAS VEGAS - Texas Instruments (TI) (NASDAQ: TXN) today announced that more than 100,000 global movie theatre screens use its DLP Cinema technology. More than 8 out of 10 of the world's screens, from art houses to multiplexes, count on DLP Cinema to enable new...
Read More »MACOM to Show Expanded Product Portfolio for 100G Applications at OFC 2014
LOWELL, Mass. – M/A-COM Technology Solutions Inc. ( MACOM"), a leading supplier of high performance RF, microwave, and millimeter wave products, will showcase a complete and robust portfolio of CDRs, TIAs and laser drivers for 100G Applications and beyond at OFC 2014, in San Francisco from March 11-13. Leveraging a combination of semiconductor technologies, MACOM creates innovative and smarter...
Read More »Rohde & Schwarz Achieves LTE-A Cat6 Carrier Aggregation Full Stack Throughput Using R&S CMW500 and Qualcomm Gobi 9x35 Chipset
Rohde & Schwarz and Qualcomm Technologies have successfully demonstrated the ability of the latest Qualcomm Gobi chipset to sustain full protocol stack data rates for LTE category 6 (Cat6). This milestone gives mobile operators a clear path to the commercial launch of LTE-Advanced carrier aggregation.Â-  Munich — In a joint effort, Rohde & Schwarz and Qualcomm Technologies, Inc.,...
Read More »Qualcomm Snapdragon Chipsets Power New Samsung Galaxy S5 and Samsung Galaxy Grand 2
Qualcomm Technologies continues to bring LTE-A carrier aggregation to the latest Samsung devices with Snapdragon 801; enables first LTE smartphone launch in volume tier with Snapdragon 400 BARCELONA, Spain — Qualcomm Incorporated (NASDAQ: QCOM) today announced that its wholly owned subsidiary, Qualcomm Technologies, Inc., is powering Samsung's newest flagship smartphone, the Samsung Galaxy S5....
Read More »Mobile World Congress: BEC Selects Altair Semiconductor for New Line of LTE Routers
Innovative Product Enables Service Even in Low Coverage Rural Areas BARCELONAÂ- – Altair Semiconductor (http://www.altair-semi.com), the world's leading provider of high-performance, single-mode LTE solutions, and BEC Technologies, a leading provider of advanced CPE solutions, today announced a partnership to embed Altair's single-mode LTE chipsets in a wide range of routers, gateways,...
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Innovative Dampney Coating Systems Suit Even the Most Specialized Applications
Dampney's high performance coating systems provide protection against extreme weather, chemicals, and corrosive environments for atmospheric, immersion, and underground applications. Check out the video to learn more.
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