Chip Sets

Circuits

Broadcom HEVC Technology Powers India's First Ultra HD Set-top Box Deployment from Tata Sky and Technicolor

Poised to Deliver Immersive Home Entertainment Experience to India TV Subscribers IRVINE, Calif. –Â- Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced that its BCM7252 high-efficiency video codec (HEVC) H.265 system-on-chip (SoC) will power Tata Sky's first generation Ultra HD set-top boxes...

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Circuits

ALi Partners with Prime to Provide Set-top Boxes Targeting Emerging Markets

TaipeiÂ- – ALi Corporation, a leading Set-Top Box (STB) solution provider, today announced it has joined forces with Prime Electronics and Satellitics Inc., a reputed manufacturer specialized in developing and manufacturing digital communication products, to provide various set-top box solutions targeting emerging markets worldwide. Mass production shipping of a DVB-T2 set-top box solution...

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Electronic Converters

Converter Chipset drives dual DSI-ready LCDs.

Measuring 7.0 x 7.0 x 1.2 mm with 0.65 mm ball pitch, Model TC358870XBG enables direct 4K HDMI video input to LCDs with MIPI dual Display Serial Interface, allowing small form factor, high-resolution mobile displays to be used in consumer and industrial applications. Device's 297 MHz HDMI input supports up to 3,840 x 2,160Â- @ 24 bpp at refresh rate of 30 fps and 2,560 x 1,600 @ 24...

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Device Driver Software

Reduce Cost and Weight of Cabling in Automotive Infotainment Applications with Serializer/Deserializer (SerDes) Chipsets

Maxim Integrated's automotive SerDes chipsets enable both shielded twisted pair (STP) and coax cabling, maximizing design flexibility. SAN JOSE, Calif.Â- – Engineers can now design high-resolution automotive infotainment applications with either traditional STP or lighter, less expensive coax cables using a new family of Gigabit Multimedia Serial Link (GMSL) SerDes chipsets from Maxim...

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Digital Memory

RDIMM and LRDIMM Chipsets support Intel Xeon processors.

Fully compliant with DDR4 JEDEC 1.0 specification, DDR4 RDIMM and LRDIMM Chipsets support Intel's Xeon Processor ES-2600 V3 product family. Products include DDR4 Registering Clock Driver and DDR4 Data Buffers. DDR4 LRDIMM, with one central RCD and 9 Data Buffers for each individual byte lane, can operate at 1 or 2 speed grades faster than comparable RDIMM. Chipsets target high performance...

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Projectors

Sales of Digital Cinema Projectors with Award-winning DLP Cinema® Technology Surpass 100,000-Screen Milestone

Major achievement recognized in pursuit of TI's vision to convert the motion picture industry from film-based projection to digital cinema LAS VEGAS - Texas Instruments (TI) (NASDAQ: TXN) today announced that more than 100,000 global movie theatre screens use its DLP Cinema technology. More than 8 out of 10 of the world's screens, from art houses to multiplexes, count on DLP Cinema to enable new...

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Circuits

MACOM to Show Expanded Product Portfolio for 100G Applications at OFC 2014

LOWELL, Mass. – M/A-COM Technology Solutions Inc. ( MACOM"), a leading supplier of high performance RF, microwave, and millimeter wave products, will showcase a complete and robust portfolio of CDRs, TIAs and laser drivers for 100G Applications and beyond at OFC 2014, in San Francisco from March 11-13. Leveraging a combination of semiconductor technologies, MACOM creates innovative and smarter...

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Circuits

Rohde & Schwarz Achieves LTE-A Cat6 Carrier Aggregation Full Stack Throughput Using R&S CMW500 and Qualcomm Gobi 9x35 Chipset

Rohde & Schwarz and Qualcomm Technologies have successfully demonstrated the ability of the latest Qualcomm Gobi chipset to sustain full protocol stack data rates for LTE category 6 (Cat6). This milestone gives mobile operators a clear path to the commercial launch of LTE-Advanced carrier aggregation.Â- Ã‚  Munich — In a joint effort, Rohde & Schwarz and Qualcomm Technologies, Inc.,...

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Miscellaneous Processors

Qualcomm Snapdragon Chipsets Power New Samsung Galaxy S5 and Samsung Galaxy Grand 2

Qualcomm Technologies continues to bring LTE-A carrier aggregation to the latest Samsung devices with Snapdragon 801; enables first LTE smartphone launch in volume tier with Snapdragon 400 BARCELONA, Spain — Qualcomm Incorporated (NASDAQ: QCOM) today announced that its wholly owned subsidiary, Qualcomm Technologies, Inc., is powering Samsung's newest flagship smartphone, the Samsung Galaxy S5....

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Semiconductors

Mobile World Congress: BEC Selects Altair Semiconductor for New Line of LTE Routers

Innovative Product Enables Service Even in Low Coverage Rural Areas BARCELONAÂ- – Altair Semiconductor (http://www.altair-semi.com), the world's leading provider of high-performance, single-mode LTE solutions, and BEC Technologies, a leading provider of advanced CPE solutions, today announced a partnership to embed Altair's single-mode LTE chipsets in a wide range of routers, gateways,...

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