Microchip Solves Interoperability Challenges of Delivering up to 90 Watts of Power Over Ethernet Wiring
Company’s Power over Ethernet (PoE) offering enables both pre-standard and IEEE 802.3bt-2018-compliant devices to be powered within existing Ethernet infrastructure Chandler, Ariz., Oct. 23, 2019 -- As the industry adopts the latest generation of PoE technology for managing data and power over a single Ethernet cable, users face the challenge of making pre-standard powered devices (PDs) work...
Read More »New Audio IC and Certified Module Help to Reduce Bill of Materials with Integrated Features
IS2083BM IC and BM83 module eliminates the need for an external host MCU to support application functionality. Integrate bluetooth low energy (BLE), data length extension (DLE) and LE secure connection (LE SC) that enables 2.5 times high data throughput. Features integrated power amplifier that includes up to +9.5 dBm output power.
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New TrueMask ILT Holistically Conceived and Purpose-Built System with Every Component
Enables IC manufacturers to implement stitchless, full-chip ILT for advanced-node designs in single day. Employs GPU-accelerated approach that emulates single, giant GPU/CPU pair that can compute an entire full-chip ILT solution. Provides larger process windows compared to conventional ILT or complex OPC.
Read More »New X720 60GHZ Chipset Supports Half and Quarter Channel Bandwidth
Features 16 multiplexed Rx/Tx ports for phased-array or dish antenna implementations, which enable multi-kilometer links. Achieves 5km link distances at a rate of 2Gb/s. Ideal for wireless access and small cell backhaul applications.
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6 Engineering & High-Performance Plastics Used for Machined Components
This resource breaks down six of the most commonly used high-performance plastics, properties and common applications, and questions to ask during material selection.
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New R-Car V3H SoCs Provides an End-to-end Pipeline Reference for Developers
Delivers reference software for camera obstacle detection (COD), LiDAR obstacle detection (LOD) and road feature detection (RFD). Designed with dedicated hardware accelerators for key algorithms including convolutional neural networks, dense optical flow, stereo disparity and object classification. Provides an optimized embedded solution for automotive front cameras in Level 2+ autonomous...
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New RS9116N-DBT Chipset Housed in Small 8.8 x 8 mm BGA Package
Integrates ARM Cortex M4 MCU, advanced hardware security and multiple wireless protocols at industry-leading power consumption point. Includes protocol stacks for Wi-Fi, BT, BLE, ZigBee and Thread. Ability to stream data at up to 100 Mbps combined with its compatibility with all generations of Wi-Fi.
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New Total eMMC IP Solution Available On TSMC's 40nm, 28nm, 16nm and 12nm Processes
Seamlessly integrates with Arasan eMMC 5.1 host controller IP and software. Improves HS400 speeds operating at 3.2Gbps, with command queuing. Increases reliability of operation by utilizing an enhanced strobe at the PHY layer.
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Altair's All-in-One Cellular IoT Solution to Drive Explosive Growth in 2019
Record Sales Predicted for Company's Dual-Mode LTE-M/NB-IoT Chipset, Featuring Market-Lowest Power Consumption, Optimal Size and Security Hod Hasharon, Israel, Feb. 5, 2019 /PRNewswire/ -- Altair Semiconductor, a leading provider of cellular IoT chipsets, announced today that its Cellular IoT chipset – ALT1250, is now featured in more than 10 modules, with tens of design wins in IoT...
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MediaTek Introduces Wi-Fi 6 Chips for Home and Enterprise Wireless Network Services
The Wi-Fi 6 (802.11ax) Chips are designed to support wireless access points, routers, gateways and repeaters. The units offer orthogonal frequency division multiple access for increasing the efficiency and capacity of wireless network devices. The chips come with target wake time (TWT) and multi-user MIMO (MU-MIMO) options that increases channel capacity while servicing multiple devices operating...
Read More »IDT Introduces First Integrated CMOS Chipset For 200G/400G SR Datacom Modules
Integrated Device Technology, Inc. introduces the first integrated CMOS HXT14450/HXR14450 chipset for 56GB/ch applications. It's designed for 200G/400G SR Ethernet optical transceivers and active optical cables (AOCs) which are used between servers and top-of-rack (TOR) switches. The HXT14450 is a four-channel, fully integrated transmitter with a CDR and VCSEL driver. Each channel has an...
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Tekna Manufacturing LLC Announces NFPA 99 Compliant Model 7200 Multiplace Chamber
Tekna is a leader in Monoplace and Multiplace Hyperbaric Chambers for Hyperbaric Oxygen Therapy (HBOT), offering products that set the standard for quality and innovation. Our new 7200 series of multiplace chambers is a state-of-the-art system that integrates advanced engineering with a plethora of features and options making it the industry's premier HBOT system. To learn more, see our video.
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