New JEDEC DDR5 Verification IP Uses Next-generation Native SystemVerilog UVM Architecture
Enables design and verification of next-generation memory devices with ease-of-use, fast integration and optimum performance, resulting in accelerated verification closure. Operates at up to 6400 Mb/s support key features of DDR5 standard including device size, burst length, DIMM topologies and RAS features. Ideal for broad range of enterprise applications including cloud, IoT, high-performance...
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New JEDEC DDR5 Verification IP Uses Next-generation Native SystemVerilog UVM Architecture
Enables design and verification of next-generation memory devices with ease-of-use, fast integration and optimum performance, resulting in accelerated verification closure. Operates at up to 6400 Mb/s support key features of DDR5 standard including device size, burst length, DIMM topologies and RAS features. Ideal for broad range of enterprise applications including cloud, IoT, high-performance...
Read More »New 112G XSR/USR PHY for Data Center, Networking, 5G, HPC and AI/ML Applications
112G XSR/USR PHY is a critical enabler of the D2D and D2OE interconnects for chiplet architectures. Chiplet connectivity solution has been demonstrated in silicon to exceed the challenging reach/BER performance of the CEI-112G XSR specification. Supports NRZ and PAM-4 signaling at various data rates for maximum design flexibility.
Read More »New 112G XSR/USR PHY for Data Center, Networking, 5G, HPC and AI/ML Applications
112G XSR/USR PHY is a critical enabler of the D2D and D2OE interconnects for chiplet architectures. Chiplet connectivity solution has been demonstrated in silicon to exceed the challenging reach/BER performance of the CEI-112G XSR specification. Supports NRZ and PAM-4 signaling at various data rates for maximum design flexibility.
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A True Game-Changer For Walk-In Unit Frame Performance
This white paper outlines the eight reasons why the FUSIONFRAME system is the superior thermal envelope system. Download now to find out more.
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New CDR SR Solutions for Ethernet Switches Over 70 m of OM3 Fiber and 100 m of OM4 Fiber
GN2558 is a quad PAM4 CDR with an integrated VCSEL driver. GN2559 provides high receiver performance with fast adaptation and startup. Includes configurable output equalization enabling robust electrical interfaces.
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New CDR SR Solutions for Ethernet Switches Over 70 m of OM3 Fiber and 100 m of OM4 Fiber
GN2558 is a quad PAM4 CDR with an integrated VCSEL driver. GN2559 provides high receiver performance with fast adaptation and startup. Includes configurable output equalization enabling robust electrical interfaces.
Read More »New DesignWare IP Portfolio Enables High Data Rates
Enable designers to achieve aggressive performance, power and density requirements of their designs, while lowering integration risk. Help designers to incorporate necessary functionality into their designs while benefiting from the significant power and performance boost of our 5nm process technology. Ideal for DDR5, LPDDR5 and HBM2/2E delivers maximum memory bandwidth and power efficiency.
Read More »New DesignWare IP Portfolio Enables High Data Rates
Enable designers to achieve aggressive performance, power and density requirements of their designs, while lowering integration risk. Help designers to incorporate necessary functionality into their designs while benefiting from the significant power and performance boost of our 5nm process technology. Ideal for DDR5, LPDDR5 and HBM2/2E delivers maximum memory bandwidth and power efficiency.
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New Thermal Jumper Chip Available in Six Case Sizes from 0603 to 2512
Temperature reduction allow designers to increase power handling capability of devices or extend their life at existing operating conditions. Features aluminum nitride substrate with high 170 W/m°K thermal conductivity. Transfers heat from electrically isolated components by providing a thermal conductive pathway to a ground plane or common heatsink.
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New Thermal Jumper Chip Available in Six Case Sizes from 0603 to 2512
Temperature reduction allow designers to increase power handling capability of devices or extend their life at existing operating conditions. Features aluminum nitride substrate with high 170 W/m°K thermal conductivity. Transfers heat from electrically isolated components by providing a thermal conductive pathway to a ground plane or common heatsink.
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What Can Test Devices Spin for You?
Test Devices helps you ensure the safety and efficiency of your high performance machines with cutting edge spin testing, rotor engineering, and precision balancing capabilities. Check out the video to learn more.
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