Adhesives

High-Strength Adhesive bonds thin metals.

Metal Welder(TM) structural methacrylate adhesive is designed for bonding metal to other metals or to dissimilar substrates. It provides impact and peel resistance on bare, painted, plated or galvanized metals. Adhesive cures at room temperature in 1 hour. It produces permanent, load-bearing bonds that are resistant to weathering, humidity, temperatures to 250 deg F, and thermal shock. Tensile...

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Low-Shrink Adhesives provide doublet and lens bonding.

Low-Shrink Adhesives provide doublet and lens bonding.

High-clarity, UV/visible light-curing adhesives offer viscosities from 300 to 25,000 cP and elongation from 120 to 175%. Fiber-optic adhesives include OP-52 medium-viscosity grade and OP-54 low-viscosity, wicking grade for butt bonding, bundling, and splitting. OP-18 may be peeled off like tape, and OP-19 and OP-19G are water soluble grades. Adhesives cure in seconds and offer moisture...

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Light-Curable Epoxies respond to visible and UV light.

Cationic Type V157 and V197 epoxies can be applied and irradiated with long-wave UV light in the range of 325-380 nm or with visible light in the range of 400-500 nm. Wide-range response lets adhesives be processed with many different existing light sources. Response to longer wave visible light is beneficial when bonding various engineering plastics such as Kapton and Lexan, which do not...

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Hot-Melt Adhesive shows how much has been applied.

Hot-Melt Adhesive shows how much has been applied.

PUR-FECT LOK(R) 34-969A polyurethane, reactive adhesive allows user to see if application device is dispensing correct amount based on shade of blue. Lighter shade indicates bond strength may not be sufficient and darker shade represents too much adhesive. Moisture-cured, 100% solids adhesive offers immediate handling strength and deflection resistance. Applications include assembly bonding,...

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Low Viscosity Epoxy suits many applications.

Low Viscosity Epoxy suits many applications.

Clear TRA-BOND 2113 adhesive makes strong bonds to glass, ceramics, metals and plastics, and is resistant to weather, salts, mild acids and alkalis, organics and inorganics. It can be used for bonding, laminating, sealing and small volume potting. Epoxy has good wetting and flowability, low CTE and operating temperature up to 130Â-

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Clean Adhesives do not interfere with touch screens.

ARclean(TM) 9008 and ARclean(TM) 9033 electronically clean adhesives can be used for perimeter spacer bonding in resistive touch screens and similar sensitive electronic devices. They minimize corrosion and reduce fogging and potential oxidation of oxide surfaces and conductive circuitry. Non-corrosive and low outgassing, they have virtually no effect on electrical performance properties. Both...

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Adhesive reduces/eliminates stretch wrapping.

SKID-LOCKÂ-® Quickset-50 adhesive provides high shear strength and low tensile strength, making it suitable for palletizing loads. It prohibits stacked boxes from shifting during storage while permitting load to be broken when lifted straight up. Adhesive can be applied by brush, squeeze bottle, or pressurized extrusion/spray systems. It cleans easily and requires little or no maintenance.

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UV Coatings suit fiber-optic applications.

UV Coatings suit fiber-optic applications.

15C, 15D, and WCC2B one-part, UV fiber-coating materials are suitable for application to optical fiber. Adhesives can be supplied for miles or millimeters of cable. Adhesives protect cable behind fiber-optic devices and limit process time.

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Transfer Adhesive bonds electronic components.

ARcladÂ-® 9032 1-mil, electrically conductive, acrylic, pressure-sensitive transfer adhesive has durable polyester film release liner. Thin tape quickly builds strong bond, and is highly conductive in Z-axis. ARcladÂ-® 9032 is suitable for fabricating EMI shields, electrical interconnections, and ground plane assemblies. It is manufactured with plastic cores for compatibility with...

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Adhesive has high temperature resistance.

122-24 two-component, nitride filled, thermally conductive, low stress under fill adhesive is suitable for application by screen printing, dipping, and syringe dispensing. Product bonds silicon die to FR-4 boards in IC packaging applications. 122-24 provides outstanding adhesion to FR-4 boards as well as other substrates that have dissimilar coefficients of thermal expansion.

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