New Adhesives Products

New Epoxy Adhesive is Curable at Room Temperature Ranging up to 120 Degrees C

GPC 251A/B2612 is available in convenient packaging options including pre-measured bi-paks and has a 1:1 mix ratio. Combines properties of high conductivity, flexibility, high tensile strength and low stress. Ideal for mounting of connectors, components and sensors to wearable devices.

New Born2Bond Adhesives Suitable for Use in Mass Production

Enable users to improve efficiencies, increase design opportunities and improved sustainability. Ideal for assembling smartphones, medical devices, electronic devices, electric vehicles and luxury packs.

SEMICON WEST 2016 is 2 Weeks Away, Visit YINCAE Booth 6448

Albany, NY- – The SEMICON West 2016, North America’s premier Microelectronics event is less than two weeks away! SEMICON West 2016 will be held at the Moscone Center in San Francisco, CA from July 12th to 14th. We sincerely invite you to stop by our Booth 6448 to learn more about YINCAE Advanced Materials.- YINCAE offers a variety of exclusive Adhesives, Thermal Interface, and...

Temporary Bonding Adhesive aids thin wafer handling.

High temperature wafer processing adhesives (WPA) withstand processing up to 330-

Designing a cast or forged component? What Industrial Designers Need to Know About ‘Design for Manufacturing' Before Reaching for a Pencil.

To learn more about how you can save time and money with design for manufacturing strategies, download now.

Nanosilica Filled, Dual Cure Adhesive Meets NASA Low Outgassing Specifications

Master Bond UV22DC80 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating with the ability to cure under UV light and/or with heat. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 milliwatts/cm2 of energy. This type of formulation allows for polymerization in “shadowed out” areas with...

Acrylic Emulsion PSAs target permanent, removable applications.

As coater-ready adhesive for permanent applications,- Aroset™ APS 1295 adheres to various surfaces, resists water, and forms bond at temperatures- down to- -20-

Thermoplastic Adhesive suits temporary mounting applications.

Adhering- to ceramics, glasses, and metals, Crystalbond™ 509 is suitable for temporarily mounting substrates that require dicing, grinding, or polishing operations. Thermoplastic adhesive is applied by preheating mounting plate to 250-

Soft Silicone Adhesives suit skin applications.

Designed specifically for wound care, Silbione-® HC2 2022 medium-viscosity silicone gel is compatible with most coating processes and applicable on wide range of substrates, including PU films, perforated films, and open knit fabrics. Product is manufactured in ISO 8 clean room in ISO 13485 facility to ensure microbial safety on breached skin. For wearable devices, scar management, and...

UV-Cured Epoxy Adhesive increases electronic assembly reliability.

Developed to pass reliability requirements in disk drive, camera module, photonics, and circuit assembly applications, 535-11M-3 eliminates crowning (warpage) of sliders in Head Gimbal Assemblies. This non-conductive, low-outgassing, flexible adhesive does not contain antimony and can be used in other bonding applications in Head Stack Assembly as well as for lens bonding in camera modules, chip...

UL Listed, Easy to Use Potting Compound

50-3152FR Thermally Conductive Compound Self-Extinguishes and Mixes in Equal Parts CRANSTON, RI USA — Epoxies, Etc. continues to formulate new products to meet industry need, this time creating a unique thermally conductive potting compound.- While many thermally conductive compounds meet the stringent non-burning requirements of UL's 94 V-0 standard, few have the added advantage of being...

Trotec Laser Offers Customizable Industrial Laser Marking Solutions for Any Application

Trotec's laser marking solutions provide your company with configurable workstations and intuitive, customizable software. Check out our video to learn more.