Adhesives

Dymax to Exhibit at MD&M West 2022 Trade Show

Torrington, Connecticut – March 31, 2022... Dymax Corporation, leading manufacturer of rapid and light-curing materials and equipment, will exhibit at MD&M West from April 12-14, 2022, at the Anaheim Convention Center in Anaheim, CA, in booth 1901. Dymax specialists will be on hand to discuss and demonstrate a wide range of light-curing technologies unique to the company, including See-Cure and...

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UL Certified Epoxy Encapsulant Resists Arcing without Igniting

UL Certified Epoxy Encapsulant Resists Arcing without Igniting

Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required. Electrical arcing is a challenge for numerous electronic or electrical devices; this occurs when electricity jumps from one connection to another, resulting in an electrical breakdown. The air surrounding the current becomes ionized and...

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Silver Filled, Low Outgassing Epoxy for EMI/RFI Shielding

Silver Filled, Low Outgassing Epoxy for EMI/RFI Shielding

Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements. It has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C. With a viscosity of 10,000-15,000 cps, EP4S-80 has a smooth flow and is easily brushable, making it ideal for EMI/RFI shielding and static dissipation. This formulation can also be used in a...

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New Structural Bonding Adhesive with Viscosity of 10,000 cP

New Structural Bonding Adhesive with Viscosity of 10,000 cP

Protects EV components against shock, vibration and other damaging forces. Cures tack free in seconds upon exposure to UV/Visible light energy and LED curable at 385 nm wavelength. Ideal for shallow potting and sealing of connectors, thermal switches and sensors as well as for tamper proofing applications.

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New LED405FL3 Adhesive with Refractive Index of 1.51

New LED405FL3 Adhesive with Refractive Index of 1.51

A single component, LED curing adhesive, sealant, coating and encapsulating compound. Properties include electrical insulation as well as resistance to thermal cycling, shock and vibration. RoHS compliant compound, solvent free and available in syringes, ½ pint, pint and quart containers.

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Highly Thermally Conductive, NASA Low Outgassing Silver Filled Epoxy

Highly Thermally Conductive, NASA Low Outgassing Silver Filled Epoxy

Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity of 16-17 W/(m·K). It cures rapidly at temperatures of around 250-300°F [~ 125-150°C], and has an unlimited working life at room temperature. The material features a thixotropic paste consistency and is not pre-mixed and frozen. It is well suited for automatic dispensing equipment or...

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Highly Flexible UV Curable Adhesive Meets ISO 10993-5 Standard for Cytotoxicity

Highly Flexible UV Curable Adhesive Meets ISO 10993-5 Standard for Cytotoxicity

Master Bond UV15X-6Med-2LV is a UV curable, non-cytotoxic adhesive that features optical clarity and abrasion resistance. Not only can it be utilized for bonding, but it can also be employed for sealing, coating, and encapsulating purposes. It has a high degree of flexibility with an elongation that exceeds 100% and a low tensile modulus of 20,000-50,000 psi at room temperature. This flexibility...

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How SpinSelect Can Save You Time and Money
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How SpinSelect Can Save You Time and Money

Thanks to the unique SpinSelect™ Multi-Pocket selectable quick change tool holder, it's time to rethink the range, complexity and volume of parts that your lathe can produce. Our Spin-Select™ tool was created to increase productivity and consistency by decreasing downtime associated with lathe cutting tool and insert setups or changeovers. This product is a game-changer for the industry and we're pleased to show you why.

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