Newport Corp.

P.O. Box 19607
Irvine, CA 92606

Robot System provides precise, repeatable wafer handling.

Automated edge-grip system provides safe 300 mm wafer handling. Smart robot can see and measure environment with built-in optical sensor in end-effector and self-teach functionality. It detects wafer presence, measures wafer position, and calculates wafer center with 0.005 in. accuracy. Wafer is picked up and moved back before precisely controlled actuator is deployed to secure wafer against rest...

Mechanical Power Transmission

Motorized Actuators have 50 mm travel range.

LTA series motorized micrometer replacement actuators utilize DC motors with high-resolution encoders, which provide precise, closed-loop operation with minimal incremental motion of 50 nm. They have parallel motor and non-rotating drive shaft configuration and include user-adjustable limit switches. Model LTA-HS provides speeds up to 5 mm/sec, while LTA-HL is optimized for high load...

Communication Systems & Equipment

Sources and Amplifiers suit laboratory applications.

Leveraging diode-pumped erbium doped fiber technology, Broadband ASE (amplified spontaneous emission) sources and EDFAs (erbium doped fiber amplifiers) are packaged for test and measurement of photonics components in 1550 nm spectral region. Self-contained BBS-410 and BBS-430 sources generate broadband output as high as 25 mW. Fully-integrated FPA-410 and FPA-415 EDFAs feature signal gains of...

Underfill Dispenser is suited for Flip Chip assembly.

Model MRSI-175UF is available with single or dual dispense heads, rotary or linear positive displacement pumps with typical Cpk performance in excess of 1.33, and single or dual conveyors that incorporate universal fixturing. System uses closed-loop, encoder-based control feedback and offers parallel processing conveyors that reduce time associated with preheat, load, unload, transfer, and...

Adhesives & Sealants

Flip Chip Bonder offers 8 micron placement accuracy.

Mach FC Plus is based on parallel processing, gantry machine platform designed for high-speed bonding. Picking, flipping, fluxing, vision alignment, and controlled die placement are performed with asynchronous parallel motion. Automatic 300 mm wafer changer is compatible with wafer cassette docking carts. Bonder includes closed-loop placement force control, flux dipping station, up to 53...

Communication Systems & Equipment

Wafer Positioner offers integrated 3-axis tip/tilt stage.

Designed for 300 mm wafer processing, DynamYX GT air-bearing wafer positioning system offers 6 axes of precision motion control. Machine includes silicon carbide stage, single plane system architecture, and low-profile design that reduces center of mass to minimize error from deflection or angular deviation. Alignment is achieved via Z-Tip-Tilt stage integrated on carriage in non-contact design....

Adhesives & Sealants

Die Bonder suits semiconductor/electronic packaging markets.

Able to provide assembly solutions for epoxy die attach, eutectic, and flip chip bonding, MRSI-605 AP Advanced Packaging Die Bonder is based on MRSI-505 platform. Machine includes 6-head, feather-touch tool turret that rotates through full 360Ã-

Communication Systems & Equipment

Positioning Platform is suited for 300 mm wafer metrology.

Featuring 3-plate design and direct-drive rotation, ISM300 low-profile, integrated XY-Theta positioning platform achieves total surface access on 300 mm wafers. Maintaining constant orientation of patterned elements on wafer relative to measurement optics, integrated metrology platform achieves linear speeds to 300 mm/sec and combined XY-Theta repeatability of less than Ã-

$Laser Beam Shaper uses low-dispersion refractive optics.$

Construction Equipment and Supplies

Laser Beam Shaper uses low-dispersion refractive optics.

Refractive Beam Shaper converts Gaussian laser beam input to produce collimated, flat-top beam that can propagate without change in power and intensity, or loss of uniformity over large distances. Optics produce no hard edges, speckles, or diffraction effects. Shaper functions over large bandwidth from far IR to deep UV allowing for use in many fields. Applications include illumination, laser...

Communication Systems & Equipment

Linear Stages have stainless steel construction.

Series SDS Linear Translation Stages have side-mounted micrometer, profiled bearing ways for extended contact with ball bearings, and locking mechanism that secures stage position with negligible motion when lock is engaged or disengaged. Units provide 25 mm travel and load capability up to 39 lb. They are suitable for applications requiring pitch and yaw of less than 200 and 100 microradians,...